Electrical Analysis of High Dielectric Constant Insulator and Metal Gate Metal Oxide Semiconductor Capacitors on Flexible Bulk Mono-Crystalline Silicon

2015 ◽  
Vol 64 (2) ◽  
pp. 579-585 ◽  
Author(s):  
Mohamed T. Ghoneim ◽  
Jhonathan P. Rojas ◽  
Chadwin D. Young ◽  
Gennadi Bersuker ◽  
Muhammad M. Hussain
2000 ◽  
Vol 77 (23) ◽  
pp. 3788-3790 ◽  
Author(s):  
L. W. Tu ◽  
W. C. Kuo ◽  
K. H. Lee ◽  
P. H. Tsao ◽  
C. M. Lai ◽  
...  

2013 ◽  
Vol 22 ◽  
pp. 564-569
Author(s):  
KANTA RATHEE ◽  
B. P. MALIK

Down scaling of complementary metal oxide semiconductor transistors has put limitations on silicon dioxide to be used as an effective dielectric. It is necessary to replace the SiO 2 with a physically thicker layer of oxides of high dielectric constant. Thus high k dielectrics are used to suppress the existing challenges for CMOS scaling. Many new oxides are being evaluated as gate dielectrics such as Ta2O5 , HfO2 , ZrO2 , La2O3 , HfO2 , TiO2 , Al2O3 , Y2O3 etc but it was soon found that these oxides in many respects have inferior electronic properties to SiO2 . But the the choice alone of suitable metal oxide with high dielectric constant is not sufficient to overcome the scaling challenges. The various deposition techniques and the conditions under which the thin films are deposited plays important role in deciding the structural and electrical properties of the deposited films. This paper discusses in brief the various deposition conditions which are employed to improve the structural and electrical properties of the deposited films.


2007 ◽  
Vol 90 (10) ◽  
pp. 103510 ◽  
Author(s):  
Musarrat Hasan ◽  
Hokyung Park ◽  
Hyundoek Yang ◽  
Hyunsang Hwang ◽  
Hyung-Suk Jung ◽  
...  

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