Analysis of Interaction Structure Among Multiple Functional Process Variables for Process Control in Semiconductor Manufacturing

2010 ◽  
Vol 23 (2) ◽  
pp. 263-272 ◽  
Author(s):  
Xi Zhang ◽  
Qiang Huang
1996 ◽  
Vol 429 ◽  
Author(s):  
Tony Speranza ◽  
Terry Riley ◽  
Arun Nanda ◽  
Burt Fowler ◽  
Kenneth Torres ◽  
...  

AbstractThis paper discusses various commercial aspects of Rapid Thermal Processing (RTP). It provides an overview of SEMATECH's efforts to improve the manufacturing viability of RTP. Over the past several years SEMATECH, a U.S. Government/Industry consortium, has identified thermal equipment and processing needs relating to semiconductor manufacturing. It has aggressively pursued solutions to these needs through specific equipment projects. These projects include: RTP Installed Base Productivity Improvement, 0.25um RTP Tool Development, and RTP Modeling and Component Technology. Also discussed are several thermal projects which focus on the performance of more traditional tools. A comparison between RTP and a vertical furnace with model based process control and a small batch fast ramp furnace is made. A brief discussion of an RTP gate stack cluster tool project is followed by a review of future thermal processing needs, including 300mm.


2014 ◽  
Vol 60 (3) ◽  
pp. 213-217 ◽  
Author(s):  
Bakhyt K. Mukhanov ◽  
Zhanar Zh. Omirbekova ◽  
Azamat K. Usenov ◽  
Waldemar Wójcik

Abstract The paper deals with simulation of in-situ uranium leaching technological process, collecting data for forecasting and leaching process control. It provides numerical simulation of uranium in-situ leaching (ISL) using Comsol Multiphysics software package application. Previous studies evaluated main hydrodynamic characteristics of wells and reservoirs, such as the coefficient of resistance and the saturation recovery; while this paper is concerned with determining the changes in process variables in the wells during operation.


2012 ◽  
Vol 59 (2) ◽  
Author(s):  
Nor Kamaliana Khamis ◽  
Baba Md Deros ◽  
Nizaroyani Saibani ◽  
Syamsinar Baizura Ahmad Sabki

The use of Statistical Process Control (SPC) in the manufacturing process has been historically proven to increase the quality of the product. Recent trends show that companies are becoming increasingly reliant on computer based-SPC because it can save a significant amount of time compared with traditional SPC. In addition, labor-intensive tasks, such as manual data collection and entry, can be eliminated, thus reducing human error. This paper aims to prove the benefits of computer based system for SPC known as e-SPC in a semiconductor manufacturing environment. Specifically, this paper will present the case study‟s finding that show how one semiconductor manufacturing company‟s use of e-SPC can detect a process abnormality at an early stage and in real time compared with manual SPC. The case study involves interviews with the company representatives and observations on the manufacturing environment. This paper will also show how e-SPC can be used to control and then to stabilize the manufacturing operation. In conclusion, this paper demonstrates that e-SPC can significantly improve the performance of a manufacturing environment. Moreover, this paper can also be used as a reference for the implementation of e-SPC in any company.


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