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Daniel Smith ◽  
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Rudy Giridharan ◽  
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scholarly journals Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating

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Lyle Alexander Menk ◽  
Matthew Jordan ◽  
Jason Christopher ◽  
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High Aspect Ratio ◽  
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Wafer Level ◽  
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Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

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pp. 055021 ◽  
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Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
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scholarly journals Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

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Vol 7 (1) ◽  
Author(s):  
Fei He ◽  
Junjie Yu ◽  
Yuanxin Tan ◽  
Wei Chu ◽  
Changhe Zhou ◽  
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Bessel Beams ◽  
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