Atomic Layer Processes for Material Growth and Etching A Review

2021 ◽  
pp. 1-1
Author(s):  
Faiz Rahman ◽  
Julian C. Runyon
Keyword(s):  
Atomic Layer ◽  
Material Growth

Influence of Subsurface Hybrid Material Growth on the Mechanical Properties of Atomic Layer Deposited Thin Films on Polymers

2013 ◽  
Vol 19 (4-6) ◽  
pp. 134-141 ◽  
Author(s):  
Yujie Sun ◽  
Richard P. Padbury ◽  
Halil I. Akyildiz ◽  
Matthew P. Goertz ◽  
Jeremy A. Palmer ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Hybrid Material ◽  
Atomic Layer ◽  
Material Growth

Simulation of high-resolution annular dark field STEM images

1995 ◽  
Vol 53 ◽  
pp. 40-41
Author(s):  
E. J. Kirkland
Keyword(s):  
Electron Beam ◽  
Atomic Layer ◽  
Fresnel Diffraction ◽  
Dark Field ◽  
Objective Lens ◽  
Image Simulation ◽  
Small Probe ◽  
Annular Dark Field ◽  
Stem Image ◽  
Uniform Plane

In a STEM an electron beam is focused into a small probe on the specimen. This probe is raster scanned across the specimen to form an image from the electrons transmitted through the specimen. The objective lens is positioned before the specimen instead of after the specimen as in a CTEM. Because the probe is focused and scanned before the specimen, accurate annular dark field (ADF) STEM image simulation is more difficult than CTEM simulation. Instead of an incident uniform plane wave, ADF-STEM simulation starts with a probe wavefunction focused at a specified position on the specimen. The wavefunction is then propagated through the specimen one atomic layer (or slice) at a time with Fresnel diffraction between slices using the multislice method. After passing through the specimen the wavefunction is diffracted onto the detector. The ADF signal for one position of the probe is formed by integrating all electrons scattered outside of an inner angle large compared with the objective aperture.

Application of Atomic Layer Deposition in Dye-Sensitized Photoelectrosynthesis Cells

2021 ◽  
Vol 3 (1) ◽  
pp. 59-71
Author(s):  
Degao Wang ◽  
Qing Huang ◽  
Weiqun Shi ◽  
Wei You ◽  
Thomas J. Meyer
Keyword(s):  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Dye Sensitized ◽  
Layer Deposition

A Rare Low Spin Co(IV) Bis-Silyldiamide with High Thermal Stability: Exploring the Origin of an Unusual S = 1/2 Configuration

2020 ◽  
Author(s):  
David Zanders ◽  
Goran Bačić ◽  
Dominique Leckie ◽  
Oluwadamilola Odegbesan ◽  
Jeremy M. Rawson ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Density Functional ◽  
Atomic Layer ◽  
Epr Spectrum ◽  
Functional Theory ◽  
Cluster Calculations ◽  
Layer Deposition ◽  
Starting Point ◽  
Higher Spin ◽  
Surface Saturation

Attempted preparation of a chelated Co(II) β-silylamide re-sulted in the unprecedented disproportionation to Co(0) and a spirocyclic cobalt(IV) bis(β-silyldiamide): [Co[(NtBu)2SiMe2]2] (1). Compound 1 exhibits a room temperature magnetic moment of 1.8 B.M and a solid state axial EPR spectrum diagnostic of a rare S = 1/2 configuration. Semicanonical coupled-cluster calculations (DLPNO-CCSD(T)) revealed the doublet state was clearly preferred (–27 kcal/mol) over higher spin configurations for which density functional theory (DFT) showed no energetic preference. Unlike other Co(IV) complexes, 1 had remarkable thermal stability, and was demonstrated to form a stable self-limiting monolayer in initial atomic layer deposition (ALD) surface saturation tests. The ease of synthesis and high-stability make 1 an attractive starting point to begin investigating otherwise inaccessible Co(IV) intermediates and synthesizing new materials.

Atomic Layer Deposition of LiF and Lithium Ion Conducting (AlF3)(LiF)x Alloys Using Trimethylaluminum, Lithium Hexamethyldisilazide and Hydrogen Fluoride

2017 ◽  
Author(s):  
Younghee Lee ◽  
Daniela M. Piper ◽  
Andrew S. Cavanagh ◽  
Matthias J. Young ◽  
Se-Hee Lee ◽  
...  
Keyword(s):  
Lithium Ion ◽  
Atomic Layer ◽  
Mass Gain ◽  
Alloy Film ◽  
Ex Situ ◽  
X Ray ◽  
Layer Deposition ◽  
Ion Conducting ◽  
Good Agreement

<div>Atomic layer deposition (ALD) of LiF and lithium ion conducting (AlF<sub>3</sub>)(LiF)<sub>x</sub> alloys was developed using trimethylaluminum, lithium hexamethyldisilazide (LiHMDS) and hydrogen fluoride derived from HF-pyridine solution. ALD of LiF was studied using in situ quartz crystal microbalance (QCM) and in situ quadrupole mass spectrometer (QMS) at reaction temperatures between 125°C and 250°C. A mass gain per cycle of 12 ng/(cm<sup>2</sup> cycle) was obtained from QCM measurements at 150°C and decreased at higher temperatures. QMS detected FSi(CH<sub>3</sub>)<sub>3</sub> as a reaction byproduct instead of HMDS at 150°C. LiF ALD showed self-limiting behavior. Ex situ measurements using X-ray reflectivity (XRR) and spectroscopic ellipsometry (SE) showed a growth rate of 0.5-0.6 Å/cycle, in good agreement with the in situ QCM measurements.</div><div>ALD of lithium ion conducting (AlF3)(LiF)x alloys was also demonstrated using in situ QCM and in situ QMS at reaction temperatures at 150°C A mass gain per sequence of 22 ng/(cm<sup>2</sup> cycle) was obtained from QCM measurements at 150°C. Ex situ measurements using XRR and SE showed a linear growth rate of 0.9 Å/sequence, in good agreement with the in situ QCM measurements. Stoichiometry between AlF<sub>3</sub> and LiF by QCM experiment was calculated to 1:2.8. XPS showed LiF film consist of lithium and fluorine. XPS also showed (AlF<sub>3</sub>)(LiF)x alloy consists of aluminum, lithium and fluorine. Carbon, oxygen, and nitrogen impurities were both below the detection limit of XPS. Grazing incidence X-ray diffraction (GIXRD) observed that LiF and (AlF<sub>3</sub>)(LiF)<sub>x</sub> alloy film have crystalline structures. Inductively coupled plasma mass spectrometry (ICP-MS) and ionic chromatography revealed atomic ratio of Li:F=1:1.1 and Al:Li:F=1:2.7: 5.4 for (AlF<sub>3</sub>)(LiF)<sub>x</sub> alloy film. These atomic ratios were consistent with the calculation from QCM experiments. Finally, lithium ion conductivity (AlF<sub>3</sub>)(LiF)<sub>x</sub> alloy film was measured as σ = 7.5 × 10<sup>-6</sup> S/cm.</div>

Workfunction of Al-Doped ZnO Films Deposited by Atomic Layer Deposition

2018 ◽  
Author(s):  
Peter George Gordon ◽  
Goran Bacic ◽  
Gregory P. Lopinski ◽  
Sean Thomas Barry
Keyword(s):  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Atomic Ratio ◽  
Aluminum Concentration ◽  
Zno Films ◽  
Transparent Conductor ◽  
Kelvin Probe ◽  
Layer Deposition ◽  
Earth Abundant ◽  
Doped Zno

Al-doped ZnO (AZO) is a promising earth-abundant alternative to Sn-doped In<sub>2</sub>O<sub>3</sub> (ITO) as an n-type transparent conductor for electronic and photovoltaic devices; AZO is also more straightforward to deposit by atomic layer deposition (ALD). The workfunction of this material is particularly important for the design of optoelectronic devices. We have deposited AZO films with resistivities as low as 1.1 x 10<sup>-3</sup> Ωcm by ALD using the industry-standard precursors trimethylaluminum (TMA), diethylzinc (DEZ), and water at 200<sup>◦</sup>C. These films were transparent and their elemental compositions showed reasonable agreement with the pulse program ratios. The workfunction of these films was measured using a scanning Kelvin Probe (sKP) to investigate the role of aluminum concentration. In addition, the workfunction of AZO films prepared by two different ALD recipes were compared: a “surface” recipe wherein the TMA was pulsed at the top of each repeating AZO stack, and a interlamellar recipe where the TMA pulse was introduced halfway through the stack. As aluminum doping increases, the surface recipe produces films with a consistently higher workfunction as compared to the interlamellar recipe. The resistivity of the surface recipe films show a minimum at a 1:16 Al:Zn atomic ratio and using an interlamellar recipe, minimum resistivity was seen at 1:19. The film thicknesses were characterized by ellipsometry, chemical composition by EDX, and resistivity by four-point probe.<br>

Coverage and Stability of NHx Terminated Cobalt and Ruthenium Surfaces: a First Principles Investigation

2019 ◽  
Author(s):  
Ji Liu ◽  
Michael Nolan
Keyword(s):  
Metal Surfaces ◽  
High Vacuum ◽  
Atomic Layer ◽  
Nitrogen Plasma ◽  
Operating Conditions ◽  
Ultra High Vacuum ◽  
Bridge Site ◽  
Stable Surface ◽  
Saturation Coverage ◽  
The Stability

<div>In the atomic layer deposition (ALD) of Cobalt (Co) and Ruthenium (Ru) metal using nitrogen plasma, the structure and composition of the post N-plasma NHx terminated (x = 1 or 2) metal surfaces are not well known but are important in the subsequent metal containing pulse. In this paper, we use the low-index (001) and (100) surfaces of Co and Ru as models of the metal polycrystalline thin films. The (001) surface with a hexagonal surface structure is the most stable surface and the (100) surface with a zigzag structure is the least stable surface but has high reactivity. We investigate the stability of NH and NH2 terminations on these surfaces to determine the saturation coverage of NHx on Co and Ru. NH is most stable in the hollow hcp site on (001) surface and the bridge site on the (100) surface, while NH2 prefers the bridge site on both (001) and (100) surfaces. The differential energy is calculated to find the saturation coverage of NH and NH2. We also present results on mixed NH/NH2-terminations. The results are analyzed by thermodynamics using Gibbs free energies (ΔG) to reveal temperature effects on the stability of NH and NH2 terminations. Ultra-high vacuum (UHV) and standard ALD</div><div>operating conditions are considered. Under typical ALD operating conditions we find that the most stable NHx terminated metal surfaces are 1 ML NH on Ru (001) surface (350K-550K), 5/9 ML NH on Co (001) surface (400K-650K) and a mixture of NH and NH2 on both Ru (100) and Co (100) surfaces.</div>

Sign in / Sign up

Export Citation Format

Share Document