Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
2002 ◽
Vol 124
(3)
◽
pp. 292-297
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Keyword(s):
This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth, and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding, its blocking at second-phase particles, and diffusional creep relaxation. In Part II of this paper, the developed creep-fatigue damage model is quantified and parametric studies are provided to better illustrate the utility of the developed model.
2000 ◽
Keyword(s):
2014 ◽
Vol 136
(11)
◽
2002 ◽
Vol 124
(3)
◽
pp. 298-304
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Keyword(s):
2016 ◽
Vol 34
(2)
◽
pp. 121-133
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2014 ◽
Vol 707
◽
pp. 390-396
Keyword(s):
2001 ◽
Vol 215
(8)
◽
pp. 883-892
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Keyword(s):