Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling
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Abstract This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding and its blocking at 2nd phase particles, and diffusional creep relaxation. A conceptual framework is provided to quantify the creep-fatigue damage due to thermo-mechanical cycling. Some parametric studies are provided to better illustrate the utility of the developed model.
2002 ◽
Vol 124
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pp. 292-297
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2014 ◽
Vol 136
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2002 ◽
Vol 124
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pp. 298-304
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2016 ◽
Vol 34
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pp. 121-133
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2014 ◽
Vol 707
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pp. 390-396
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2001 ◽
Vol 215
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pp. 883-892
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