A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

2005 ◽  
Vol 128 (4) ◽  
pp. 427-431 ◽  
Author(s):  
Minhua Lu ◽  
Larry Mok ◽  
R. J. Bezama
Keyword(s):  
Thermal Conductivity ◽  
Oxygen Plasma ◽  
High Thermal Conductivity ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Capillary Limit ◽  
Wick Structure ◽  
Overall Performance ◽  
Heat Spreading ◽  
Graphite Foam

A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of 80W∕cm2. The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water.

A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics

2005 ◽  
Author(s):  
Minhua Lu ◽  
Larry Mok ◽  
R. J. Bezama
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
High Heat ◽  
High Thermal Conductivity ◽  
Working Fluid ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Capillary Limit ◽  
Wick Structure ◽  
Graphite Foam

A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of 80 W/cm2. The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water.

Challenges in Package Cooling of High Performance Servers

2007 ◽  
Author(s):  
Jie Wei
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Pipes ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Asymmetric Power ◽  
Heat Spreading ◽  
Silver Composite

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.

Experimental Study on the Thermal Properties and Stability of Hybrid Nanofluids and Evaluation of its Heat Exchange Efficiency

2020 ◽  
Author(s):  
Yubai Xiao ◽  
Hu Zhang ◽  
Junmei Wu
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Transfer Performance ◽  
Volume Concentration ◽  
High Thermal Conductivity ◽  
Transfer Efficiency ◽  
Working Fluid ◽  
Transfer Performance ◽  
Heat Transfer Efficiency ◽  
Hybrid Nanofluids

Abstract In recent years, hybrid nanofluids, as a new kind of working fluid, have been widely studied because they possessing better heat transfer performance than single component nanofluids when prepared with proper constituents and proportions. The application of hybrid nanofluids in nuclear power system as a working fluid is an effective way of improving the capability of In-Vessel Retention (IVR) when the reactor is in a severe accident. In order to obtain hybrid nanofluids with excellent heat transfer performance, three kinds of hybrid nanofluids with high thermal conductivity are measured by transient plane source method, and their viscosity and stability are also investigated experimentally. These experimental results are used to evaluate the heat transfer efficiency of hybrid nanofluids. The results show that: (1) The thermal conductivity of hybrid nanofluids increases with increasing temperature and volume concentration. When compared to the base fluid, the thermal conductivity of Al2O3-CuO/H2O, Al2O3-C/H2O and AlN-TiO2/H2O nanofluids at 0.25% volume concentration increased by 36%, 24%, and 22%, respectively. (2) Surfactants can improve the stability of hybrid nanofluids. The Zeta potential value is related to the thermal conductivity of the hybrid nanofluids, and it could be used to explain the relationship between the thermal conductivity of the hybrid nanofluids and the dispersion. It also could provide a reference for subsequent screening of high thermal conductivity nanofluids. (3) The addition of C/H2O can effectively reduce the dynamic viscosity coefficient of hybrid nanofluids. (4) The analysis of heat transfer efficiency of the hybrid nanofluids found that both Al2O3-CuO/H2O and Al2O3-C/H2O have better heat transfer ability than water under certain mixing conditions. This study is conducive to further optimizing hybrid nanofluids and its application to the In-Vessel Retention in severe reactor accidents.

HIGH THERMAL CONDUCTIVITY THIN FILM FOR HEAT SPREADING ENHANCEMENT IN MICROELECTRONIC MEASURED USING SHORT PULSED PHOTOTHERMAL TECHNIQUE

2018 ◽  
Author(s):  
M. Rammal ◽  
Bertrand Garnier ◽  
P. Jayapragasam ◽  
C. Rodiet ◽  
B. E. Belkerk ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Photothermal Technique ◽  
Heat Spreading

The Effect of Working Fluid Inventory on the Performance of Revolving Helically Grooved Heat Pipes

2000 ◽  
Vol 123 (1) ◽  
pp. 120-129 ◽  
Author(s):  
R. Michael Castle ◽  
Scott K. Thomas ◽  
Kirk L. Yerkes
Keyword(s):  
Heat Pipe ◽  
Heat Pipes ◽  
Working Fluid ◽  
Maximum Heat ◽  
Limit Model ◽  
Filling Station ◽  
Capillary Limit ◽  
Helical Groove ◽  
Wick Structure ◽  
Evaporative Heat Transfer

The results of a recently completed experimental and analytical study showed that the capillary limit of a helically-grooved heat pipe (HGHP) was increased significantly when the transverse body force field was increased. This was due to the geometry of the helical groove wick structure. The objective of the present research was to experimentally determine the performance of revolving helically-grooved heat pipes when the working fluid inventory was varied. This report describes the measurement of the geometry of the heat pipe wick structure and the construction and testing of a heat pipe filling station. In addition, an extensive analysis of the uncertainty involved in the filling procedure and working fluid inventory has been outlined. Experimental measurements include the maximum heat transport, thermal resistance and evaporative heat transfer coefficient of the revolving helically grooved heat pipe for radial accelerations of |a⃗r|=0.0, 2.0, 4.0, 6.0, 8.0, and 10.0-g and working fluid fills of G=0.5, 1.0, and 1.5. An existing capillary limit model was updated and comparisons were made to the present experimental data.

Thermal Characteristics of Graphite Foam Thermosyphon for Electronics Cooling

2003 ◽  
Author(s):  
Hongkoo Roh ◽  
Jungho Kim ◽  
Paul J. Boudreaux
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Thermal Characteristics ◽  
Electronics Cooling ◽  
Liquid Level ◽  
Working Fluid ◽  
Low Density ◽  
Thermal Management Of Electronics ◽  
Graphite Foam ◽  
Density Results

Graphite foams consist of a network of interconnected graphite ligaments and are beginning to be applied to thermal management of electronics. The thermal conductivity of the bulk graphite foam is similar to aluminum, but graphite foam has one-fifth the density of aluminum. This combination of high thermal conductivity and low density results in a specific thermal conductivity about five times higher than that of aluminum, allowing heat to rapidly propagate into the foam. This heat is spread out over the very large surface area within the foam, enabling large amounts of energy to be transferred with relatively low temperature difference. For the purpose of graphite foam thermosyphon design in electronics cooling, various effects such as graphite foam geometry, sub-cooling, working fluid effect, and liquid level were investigated in this study. The best thermal performance was achieved with the large graphite foam, working fluid with the lowest boiling point, a liquid level with the exact height of the graphite foam, and at the lowest sub-cooling temperature.

Development of mesophase pitch derived high thermal conductivity graphite foam using a template method

Carbon ◽  
2011 ◽  
Vol 49 (11) ◽  
pp. 3622-3630 ◽  
Author(s):  
Abhay Yadav ◽  
Rajeev Kumar ◽  
Gopal Bhatia ◽  
G.L. Verma
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Template Method ◽  
Mesophase Pitch ◽  
Graphite Foam

Graphite Foam Thermosyphon Evaporator Performance: Parametric Investigation of the Effects of Working Fluid, Liquid Level, and Chamber Pressure

2002 ◽  
Author(s):  
Johnathan S. Coursey ◽  
Hongkoo Roh ◽  
Jungho Kim ◽  
Paul J. Boudreaux
Keyword(s):  
Thermal Conductivity ◽  
Thermal Diffusivity ◽  
Thermal Management ◽  
Liquid Level ◽  
Chamber Pressure ◽  
Working Fluid ◽  
Low Density ◽  
Thermal Management Of Electronics ◽  
Graphite Foam ◽  
Density Results

Graphite foams have recently been developed at ORNL and are beginning to be applied to thermal management of electronics. These foams consist of a network of interconnected graphite ligaments whose thermal conductivities are up to five times higher than copper. The thermal conductivity of the bulk graphite foam is similar to aluminum, but graphite foam has one-fifth the density of aluminum. This combination of high thermal conductivity and low density results in a thermal diffusivity about four times higher than that of aluminum, allowing heat to rapidly propagate into the foam. This heat is spread out over the very large surface area within the foam, enabling large amounts of energy to be transferred with relatively low temperature difference. The use of graphite foam as the evaporator of a thermosyphon is investigated due to its potential to transfer large amounts of energy without the need for external pumping. A preliminary optimization of the parameters governing evaporator performance is performed using 2-level factorial design. Performance of the system with both PF-5060 and PF-5050 were examined as well as the effects of liquid level and chamber pressure.

A Titanium Based Flat Heat Pipe

2008 ◽  
Author(s):  
Changsong Ding ◽  
Gaurav Soni ◽  
Payam Bozorgi ◽  
Brian Piorek ◽  
Carl D. Meinhart ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
Heat Pipe ◽  
Carrying Capacity ◽  
High Aspect Ratio ◽  
Capillary Flow ◽  
Titanium Substrate ◽  
Heat Pipes ◽  
Working Fluid ◽  
Wick Structure

We are developing innovative heat pipes based on Nano-Structured Titania (NST) with a potential for high heat carrying capacity and high thermal conductivity. These heat pipes have a flat geometry as opposed to a cylindrical geometry found in conventional heat pipes. The flatness will enable a good contact with microprocessor chips and thus reduce the thermal contact resistance. We refer to it as a Thermal Ground Plane (TGP) because of its flat and thin geometry. It will provide the ability to cool the future generations of power intensive microprocessor chips and circuit boards in an efficient way. It also brings the potential to function in high temperature (>150°C) fields because of its high yield strength and compatibility [1]. The TGP is fabricated with Titanium. It adopts the recently developed high aspect ratio Ti processing techniques [2] and laser packaging techniques. The three main components of the TGP are 1) a fine wick structure based on arrays of high aspect ratio Ti pillars and hair like structures of Nano-Structured Titania (NST), 2) A shallow Ti cavity welded onto the wick structure and 3) the working fluid, water, sealed between the cavity and the wick. The heat carrying capacity and the thermal conductivity of a heat pipe are generally determined by the speed of capillary flow of the working fluid through its wick. The TGP wick has the potential to generate high flow rates and to meet the growing challenges faced by electronics cooling community. The TGP wick structure, developed by etching high aspect ratio pillars in a titanium substrate and growing nano scale hairs on the surface of the pillars, is super hydrophilic and capable of wicking water at velocities ∼ 10−2 m/s over distances of several centimeters. The thermal conductivity of the current TGP device was measured to be k = 350 W/m·K. The completed TGP device has the potential of attaining a higher conductivity by improving the wicking material and of carrying higher power density. Washburn equation [3] for dynamics of capillary flow has been employed to explain the results of our experiments. The experiment shows a good agreement with Washburn equation.

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