HIGH THERMAL CONDUCTIVITY THIN FILM FOR HEAT SPREADING ENHANCEMENT IN MICROELECTRONIC MEASURED USING SHORT PULSED PHOTOTHERMAL TECHNIQUE

2018 ◽  
Author(s):  
M. Rammal ◽  
Bertrand Garnier ◽  
P. Jayapragasam ◽  
C. Rodiet ◽  
B. E. Belkerk ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Photothermal Technique ◽  
Heat Spreading

Chemical-Vapor-Deposited Materials for High Thermal Conductivity Applications

MRS Bulletin ◽  
2001 ◽  
Vol 26 (6) ◽  
pp. 458-463 ◽  
Author(s):  
Jitendra S. Goela ◽  
Nathaniel E. Brese ◽  
Michael A. Pickering ◽  
John E. Graebner
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
High Thermal Conductivity ◽  
Solid Materials ◽  
Chemical Vapor Deposited

Chemical vapor deposition (CVD) is an attractive method for producing bulk and thin-film materials for a variety of applications. In this method, gaseous reagents condense onto a substrate and then react to produce solid materials. The materials produced by CVD are theoretically dense, highly pure, and have other superior properties.

Characterisation of high thermal conductivity thin-film substrate systems and their interface thermal resistance

2018 ◽  
Vol 334 ◽  
pp. 233-242 ◽  
Author(s):  
Alireza Moridi ◽  
Liangchi Zhang ◽  
Weidong Liu ◽  
Steven Duvall ◽  
Andrew Brawley ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Thermal Resistance ◽  
High Thermal Conductivity ◽  
Interface Thermal Resistance ◽  
Film Substrate

Challenges in Package Cooling of High Performance Servers

2007 ◽  
Author(s):  
Jie Wei
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Pipes ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Asymmetric Power ◽  
Heat Spreading ◽  
Silver Composite

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.

Anisotropic Thermal Conductivity of A Si/Ge Superlattice

1998 ◽  
Vol 545 ◽  
Author(s):  
T. Borca-Tasciuc ◽  
D. Song ◽  
J. L. Liu ◽  
G. Chen ◽  
K. L. Wang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Temperature Drop ◽  
Differential Method ◽  
Conductivity Measurements ◽  
3Ω Method ◽  
Anisotropic Thermal Conductivity ◽  
Plane Direction ◽  
Narrow Width ◽  
Heat Spreading

AbstractExperimental evidence for a significant thermal conductivity reduction have been reported in recent years for GaAs/AlAs, Si/Ge, and Bi 2Te3/Sb2Te3 superlattices. In this work, we present preliminary experimental results on the reduction of the in-plane and cross-plane thermal conductivity for a symmetric Si/Ge superlattice. A differential 2-wire 3ω method is developed to perform the anisotropic thermal conductivity measurements. In this technique, a patterned heater with a width much larger than the film thickness yields the cross-plane thermal conductivity of the film. The in-plane thin film thermal conductivity is inferred from the temperature rise of a narrow width heater that can create more heat spreading in the in-plane direction of the thin film. A differential method to measure the temperature drop across the film is employed in order to increase the accuracy of the measurement.

A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

2005 ◽  
Vol 128 (4) ◽  
pp. 427-431 ◽  
Author(s):  
Minhua Lu ◽  
Larry Mok ◽  
R. J. Bezama
Keyword(s):  
Thermal Conductivity ◽  
Oxygen Plasma ◽  
High Thermal Conductivity ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Capillary Limit ◽  
Wick Structure ◽  
Overall Performance ◽  
Heat Spreading ◽  
Graphite Foam

A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of 80W∕cm2. The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water.

Tensile and Thermal Conductivity Properties of Epoxy Nanocomposites Thin Film by Spin Coating Technique

2011 ◽  
Vol 471-472 ◽  
pp. 1118-1123 ◽  
Author(s):  
T.V. Voo ◽  
M. Mariatti ◽  
L.C. Sim
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Spin Coating ◽  
Synthetic Diamond ◽  
Tensile Modulus ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Sem Images ◽  
Nano Composite ◽  
Nano Size

This work aims to enhance thermal conductivity of thin film without compromising the other properties of polymer. In this study, three types of fillers in nano size with high thermal conductivity properties were studied; silicon nitride, boron nitride and synthetic diamond. The contents of fillers were varied between 0-2 vol. %. Epoxy nano-composite solution filled with high thermal conductivity fillers was spun at 1500-2000 rpm to produce thin film in the thickness of 40-60 µm. Thermal conductivity properties were measured by using hot disc technique. It was found that the thermal conductivity increases as filler loading increases. The mechanical properties of the thin film epoxy composites were determined by using tensile test (ASTM D882). As predicted, the tensile modulus was found increasing with the addition of fillers and reasonable agreements were obtained from the SEM images of the fracture surfaces.

scholarly journals Finite Element Analysis of the 3ω Method for Characterising High Thermal Conductivity Ultra-Thin Film/Substrate System

Coatings ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 87 ◽  
Author(s):  
Weidong Liu ◽  
Liangchi Zhang ◽  
Alireza Moridi
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Theoretical Models ◽  
High Thermal Conductivity ◽  
Element Analysis ◽  
3Ω Method ◽  
Film Substrate ◽  
Ultra Thin Film

The 3ω method is an attractive technique for measuring the thermal conductivity of materials; but it cannot characterise high thermal conductivity ultra-thin film/substrate systems because of the deep heat penetration depth. Recently, a modified 3ω method with a nano-strip was specifically developed for high thermal conductivity thin film systems. This paper aims to evaluate the applicability of this method with the aid of the finite element analysis. To this end, a numerical platform of the modified 3ω method was established and applied to a bulk silicon and an AlN thin-film/Si substrate system. The numerical results were compared with the predictions of theoretical models used in the 3ω method. The study thus concluded that the modified 3ω method is suitable for characterising high thermal conductivity ultra-thin film/substrate systems.

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