Adhesion Strength Evaluation via Constrained Blister Test I. SIBS / Polystyrene and Polypropylene

Abstract Adhesion of Styrene-Isobutylene-Styrene (SIBS) triblock copolymers to polystyrene and polypropylene was investigated at controlled ratios and molecular weights of the SIBS's polystyrene. Comparative studies of the cohesive and adhesive strengths were carried out using a carefully designed system based on monitoring a constrained blister growth. The acquired data was simulated mathematically to express adhesion main parameters of the energy of interfacial adhesion (γ) and dissipation coefficient (b). Polystyrene content of 30–40% in the SIBS exhibited maximum interfacial adhesion energy (γ) and, consequently, the highest adhesion strength compared to other SIBS samples of other polystyrene ratios. ATR-FTIR spectroscopic analysis and scanning electron microscopy (SEM) were carried out on both the substrate and the film surfaces before adhesion and after failure to assist understanding the failure process. Interpretation of SEM microphotographs and the ATR-FTIR confirmed the process to be adhesion in nature rather than cohesion.

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One-Dimensional Constrained Blister Test to Measure Thin Film Adhesion

Journal of Applied Mechanics ◽

10.1115/1.4039171 ◽

2018 ◽

Vol 85 (5) ◽

Author(s):

Tingting Zhu ◽

Sinan Müftü ◽

Kai-tak Wan

Keyword(s):

Thin Film ◽

Contact Area ◽

Interfacial Adhesion ◽

External Pressure ◽

Adhesion Energy ◽

Blister Test ◽

One Dimensional ◽

Film Adhesion ◽

Thin Film Adhesion ◽

Interfacial Adhesion Energy

A rectangular film is clamped at the opposite ends before being inflated into a blister by an external pressure, p. The bulging film adheres to a constraining plate with distance, w0, above. Increasing pressure expands the contact area of length, 2c. Depressurization shrinks the contact area and ultimate detaches the film. The relation of (p, w0, c) is established for a fixed interfacial adhesion energy.

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Interfacial Adhesion Energy of Ni-P Electroless-plating Contact for Buried Contact Silicon Solar Cell using 4-point Bending Test System

Journal of the Microelectronics and Packaging Society ◽

10.6117/kmeps.2012.19.1.055 ◽

2012 ◽

Vol 19 (1) ◽

pp. 55-60 ◽

Cited By ~ 2

Author(s):

Jeong-Kyu Kim ◽

Eun-Kyung Lee ◽

Mi-Sung Kim ◽

Jae-Hong Lim ◽

Kyu-Hwan Lee ◽

...

Keyword(s):

Solar Cell ◽

Electroless Plating ◽

Interfacial Adhesion ◽

Silicon Solar Cell ◽

Test System ◽

Adhesion Energy ◽

Bending Test ◽

Interfacial Adhesion Energy

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Effect of surface treatments on interfacial adhesion energy between UV-curable resist and glass wafer

International Journal of Adhesion and Adhesives ◽

10.1016/j.ijadhadh.2009.02.006 ◽

2009 ◽

Vol 29 (6) ◽

pp. 662-669 ◽

Cited By ~ 18

Author(s):

Eun-Jung Jang ◽

Young-Bae Park ◽

Hak-Joo Lee ◽

Dae-Geun Choi ◽

Jun-Ho Jeong ◽

...

Keyword(s):

Interfacial Adhesion ◽

Adhesion Energy ◽

Surface Treatments ◽

Glass Wafer ◽

Uv Curable ◽

Interfacial Adhesion Energy ◽

Effect Of Surface

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Effect of Post-Chemical–Mechanical Polishing Surface Treatments on the Interfacial Adhesion Energy between Cu and a Capping Layer

Japanese Journal of Applied Physics ◽

10.7567/jjap.52.10mc05 ◽

2013 ◽

Vol 52 (10S) ◽

pp. 10MC05 ◽

Cited By ~ 2

Author(s):

Jeong-Kyu Kim ◽

Hee-Oh Kang ◽

Wook-Jung Hwang ◽

Jun-Mo Yang ◽

Young-Bae Park

Keyword(s):

Chemical Mechanical Polishing ◽

Interfacial Adhesion ◽

Adhesion Energy ◽

Surface Treatments ◽

Mechanical Polishing ◽

Capping Layer ◽

Interfacial Adhesion Energy

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Molecular Dynamics Simulation on the Influences of Nanostructure Shape, Interfacial Adhesion Energy, and Mold Insert Material on the Demolding Process of Micro-Injection Molding

Polymers ◽

10.3390/polym11101573 ◽

2019 ◽

Vol 11 (10) ◽

pp. 1573 ◽

Cited By ~ 6

Author(s):

Jin Yang ◽

Can Weng ◽

Jun Lai ◽

Tao Ding ◽

Hao Wang

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Injection Molding ◽

Interfacial Adhesion ◽

Mold Insert ◽

Adhesion Energy ◽

Dynamics Simulation ◽

Micro Injection Molding ◽

Interfacial Adhesion Energy

In micro-injection molding, the interaction between the polymer and the mold insert has an important effect on demolding quality of nanostructure. An all-atom molecular dynamics simulation method was performed to study the effect of nanostructure shape, interfacial adhesion energy, and mold insert material on demolding quality of nanostructures. The deformation behaviors of nanostructures were analyzed by calculating the non-bonded interaction energies, the density distributions, the radii of gyration, the potential energies, and the snapshots of the demolding stage. The nanostructure shape had a direct impact on demolding quality. When the contact areas were the same, the nanostructure shape did not affect the non-bonded interaction energy at PP-Ni interface. During the demolding process, the radii of gyration of molecular chains were greatly increased, and the overall density was decreased significantly. After assuming that the mold insert surface was coated with an anti-stick coating, the surface burrs, the necking, and the stretching of nanostructures were significantly reduced after demolding. The deformation of nanostructures in the Ni and Cu mold inserts were more serious than that of the Al2O3 and Si mold inserts. In general, this study would provide theoretical guidance for the design of nanostructure shape and the selection of mold insert material.

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