Plasma Printing of Micronozzles With Complex Shaped Outlets Into Stainless Steel Sheets

Abstract The plasma printing was developed as a means to fabricate the micronozzle chip with the inner diameter less than 50 μm. The initial two-dimensional micropattern was printed onto the stainless steel substrate surface by the maskless lithography. These printed micropatterns were utilized as a mask to make selective nitriding into the unprinted surface. After removal of printed pattern, the un-nitrided surfaces were chemically etched to leave the nitrided microtexture as a micronozzle chip. High nitrogen supersaturation as well as selective nitrogen diffusion had influence on the spatial resolution in this plasma printing in addition to the digitizing error in the maskless lithography.

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Production of high nitrogen surfaces on 2205 duplex stainless steel substrate using the PTA technique

Materials Science and Technology ◽

10.1179/026708310x12712410311974 ◽

2011 ◽

Vol 27 (9) ◽

pp. 1391-1398 ◽

Cited By ~ 9

Author(s):

A Rokanopoulou ◽

G D Papadimitriou

Keyword(s):

Stainless Steel ◽

Duplex Stainless Steel ◽

Stainless Steel Substrate ◽

Steel Substrate ◽

High Nitrogen ◽

2205 Duplex Stainless Steel

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Effect of Substrate Surface Roughening on the Capacitance and Cycling Stability of Ni(OH)2 Nanoarray Films

Scientific Reports ◽

10.1038/s41598-019-53365-1 ◽

2019 ◽

Vol 9 (1) ◽

Cited By ~ 1

Author(s):

Adulphan Pimsawat ◽

Apishok Tangtrakarn ◽

Nutsupa Pimsawat ◽

Sujittra Daengsakul

Keyword(s):

Stainless Steel ◽

Cyclic Voltammetry ◽

Specific Capacitance ◽

Stainless Steel Substrate ◽

Steel Substrate ◽

Substrate Surface ◽

Surface Roughening ◽

Film Stability ◽

Substrate Roughening ◽

Charge Discharge

AbstractThe effect of substrate surface roughening on the capacitance of Ni(OH)2/NiOOH nanowall array samples produced via chemical bath deposition for 2, 4, 6, 24 and 48 h on an as-received stainless steel substrate and the same substrate after sandblasting has been investigated. Symmetric cells were subjected to 120,000 charge-discharge cycles to access changes in their capacitance. Specific capacitances were derived from cyclic voltammetry and charge-discharge cycling under a three electrode setup. Substrate roughening significantly increases the capacitance of symmetric cells and film stability since film exfoliation does not occur to the same degree as on the as-received substrate. Interestingly, films deposited on a roughened substrate for 6, 24 and 48 h also exhibit self-recovery of capacitance, which could be related to an electrodissolution-electrodeposition effect. With the use of a roughened substrate, the thinnest film gives the highest specific capacitance, 1456 F g−1, whilst the thickest one shows the highest areal capacitance, 235 mF cm−2, after 20,000 cycles. These results reveal the promise of surface roughening toward increasing the capacitance and stability of Ni(OH)2/NiOOH films.

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The Effect of Substrate Preheating and Surface Organic Covering on Splat Formation

Thermal Spray 1998: Proceedings from the International Thermal Spray Conference ◽

10.31399/asm.cp.itsc1998p0473 ◽

1998 ◽

Author(s):

C.J. Li ◽

J.-L. Li ◽

W.-B. Wang

Keyword(s):

Stainless Steel ◽

Stainless Steel Substrate ◽

Steel Substrate ◽

Substrate Surface ◽

Thermal Spraying ◽

Splat Morphology ◽

Organic Substances ◽

Splat Formation ◽

Molten Droplet ◽

Preheating Temperature

Abstract The splashing usually occurs when a droplet impact on a substrate surface during thermal spraying, which results in the formation of splat with irregularly complicated morphology. In present study splats are formed on polished stainless steel substrate surface covered with different organic substances with different boiling points by plasma spraying under different preheating temperature of substrate in order to clarify the factors which control the splashing during droplet flattening in thermal spray process. The droplet materials used are aluminum, nickel, copper, Ah03 and molybdenum. Three kinds of organic substances used are xylene, glycol and glycerol which are brushed on the surface of substrate before spraying. It is found that when the preheating temperature exceeds 50°C over the boiling point of organic substance brushed on substrate surface the regular disk type splats are formed in the case that no substrate melting occurs by molten droplet. When the flattening of droplet causes the melting of substrate such as the combination of Mo droplet with stainless steel substrate, the preheating of substrate has no influence on splat morphology. The evaporated gas induced splashing and substrate surface melting induced splashing models are proposed to interpret the formation of the annulus-ringed splat

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Mechanically Alloyed CoCrFeNiMo0.85 High-Entropy Alloy for Corrosion Resistance Coatings

Materials ◽

10.3390/ma14143802 ◽

2021 ◽

Vol 14 (14) ◽

pp. 3802

Author(s):

Laura Elena Geambazu ◽

Cosmin Mihai Cotruţ ◽

Florin Miculescu ◽

Ioana Csaki

Keyword(s):

Stainless Steel ◽

Corrosion Resistance ◽

Stainless Steel Substrate ◽

Bulk Material ◽

Steel Substrate ◽

Substrate Surface ◽

Resistance Testing ◽

High Entropy Alloy ◽

High Entropy Alloys ◽

High Entropy

High-entropy alloys could provide a solution for corrosion resistance due to their impressive properties. Solid-state processing of high purity Co, Cr, Fe, Ni and Mo metallic powders and consolidation resulted in a bulk material that was further machined into electro spark deposition electrodes. After the stainless steel substrate surface preparation, thin successive layers of the high-entropy alloy were deposited and Pull-Off testing was performed on the newly obtained coating, for a better understanding of the adhesion efficiency of this technique. Good adhesion of the coating to the substrate was proved by the test and no cracks or exfoliations were present. Corrosion resistance testing was performed in a liquid solution of 3.5 wt.% NaCl for 6 hours at room temperature and the results obtained validated our hypothesis that CoCrFeNiMo0.85 high-entropy alloys could provide corrosion resistance when coating a stainless steel substrate.

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