System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Bakhtiyar Mohammad Nafis ◽  
Ange-Christian Iradukunda ◽  
David Huitink
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Large Scale ◽  
Phase Change Materials ◽  
Temperature Stability ◽  
System Level ◽  
Heat Of Fusion ◽  
Automotive Electronics ◽  
Automotive Applications ◽  
Power Module

Abstract Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and HEVs), combined with a desire to miniaturize, the challenge of removing enough heat from electronic devices in automotive vehicles is evolving. This paper closely examines the new challenges in thermal management in various driving environments and aims to classify each existing cooling method in terms of performance. Particular focus is placed upon emerging solutions regarded to hold great potential, such as phase-change materials (PCMs). PCMs have been regarded for some time as a means of transferring heat quickly away from the region with the electronic components and are widely regarded as a possible means of carrying out cooling in large scale from small areas, because of their high latent heat of fusion, high specific heat, temperature stability, and small volume change during phase change, etc. They have already been utilized as a method of passive cooling in electronics in various ways, but their adoption in automotive power electronics, such as in traction inverters, has yet to be fulfilled. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs, with reference to a case study using computational model of a commercially available power module used in automotive applications.

scholarly journals Investigation of Thermal Properties of Novel Phase Change Material Mixtures (Octadecane-Diamond) with Laser Flash Analysis

2019 ◽  
Vol 26 (4) ◽  
pp. 211-218
Author(s):  
Mateusz Sierakowski ◽  
Wojciech Godlewski ◽  
Roman Domański ◽  
Jakub Kapuściński ◽  
Tomasz Wiśniewski ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Phase Change ◽  
Power Plants ◽  
Large Scale ◽  
Phase Change Materials ◽  
Heat Dissipation ◽  
Electronics Cooling ◽  
Diamond Powder ◽  
Heat Of Fusion

AbstractPhase change materials (PCMs) are widely used in numerous engineering fields because of their good heat storage properties and high latent heat of fusion. However, a big group of them has low thermal conductivity and diffusivity, which poses a problem when it comes to effective and relatively fast heat transfer and accumulation. Therefore, their use is limited to systems that do not need to be heated or cooled rapidly. That is why they are used as thermal energy storage systems in both large scale in power plants and smaller scale in residential facilities. Although, if PCMs are meant to play an important role in electronics cooling, heat dissipation, or temperature stabilization in places where the access to cooling water is limited, such as electric automotive industry or hybrid aviation, a number of modifications and improvements needs to be introduced. Investigation whether additional materials of better thermal properties will affect the thermal properties of PCM is therefore of a big interest. An example of such material is diamond powder, which is a popular additive used in abradants. Its thermal diffusivity and conductivity is significantly higher than for a pure PCM. The article presents the results of an analysis of the effect of diamond powder on thermal conductivity and diffusivity of phase change materials in the case of octadecane.

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

2019 ◽  
Author(s):  
Bakhtiyar Mohammad Nafis ◽  
Ange-Christian Iradukunda ◽  
Imam Al Razi ◽  
David R. Huitink ◽  
Yarui Peng
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Electric Vehicles ◽  
Electronic Packaging ◽  
Phase Change Materials ◽  
Hybrid Electric Vehicles ◽  
Electronic Devices ◽  
Automotive Electronics ◽  
Hybrid Electric ◽  
Cooling Methods

Abstract The reliable operation of electronic equipment is strongly related to the thermal and mechanical conditions it is exposed to during operation. In order to ensure a long lifetime of components, it is imperative that any electronic packaging design takes into careful consideration the appropriateness of various thermal management schemes and the application-specific requirements in order to keep temperatures within certain limits. The exact requirement varies with the application, and electronic packaging designs for automotive applications are at particular risk of failure due to the naturally harsh conditions it is exposed to. Electronic devices in vehicles have to be able to operate and survive at much higher temperatures than their consumer counterparts. While that has always been an issue, the rise of electric and hybrid electric vehicles (EVs and HEVs), combined with a desire to fit as much as possible into the smallest form factor, the challenge of removing enough heat from electronic devices in automotive vehicles is constantly evolving. This paper closely examines the new challenges in thermal management in various driving environments and aims to classify each existing cooling methods in terms of their performance. Drive schedules used by the Environmental Protection Agency (EPA) for emission and fuel economy testing are taken as examples of different realistic driving scenarios and their predicted thermal profiles are evaluated against various cooling methods, both active, passive or a combination of the two (hybrid). Particular focus is placed upon emerging solutions regarded to hold great potential, such as phase change materials (PCMs). Phase change materials have been regarded for some time as a means of transferring heat quickly away from the region with the electronic components. Phase change materials are widely regarded as a possible means of carrying out cooling in large scales from small areas, considering their advantages such as high latent heat of fusion, high specific heat, controllable temperature stability and small volume change during phase change, etc. They have already been utilized as a method of passive cooling in electronics in various ways, such as in heat spreaders and finned heat sinks. The applications, however, have been mostly for system-on-chip handheld devices, and their adoption in automotive power electronics, such as those used in traction inverters, has been much slower. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs. Merits of some of the existing PCM based solutions for automotive electronics applications are also discussed, as are their drawbacks and modifications.

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Rafael Báez ◽  
Luis E. González ◽  
Manny X. de Jesús-López ◽  
Pedro O. Quintero ◽  
Lauren M. Boteler
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Thermal Loading ◽  
Phase Change Materials ◽  
Cooling System ◽  
Physical Stability ◽  
Metallic Phase ◽  
Heat Of Fusion ◽  
Microstructural Stability ◽  
Wide Range

Abstract Metallic phase change materials (mPCMs) have been demonstrated as potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing the thermal resistance between the device and the cooling system, could result in a significant improvement in thermal management for transient applications. However, many thermo-physical properties of these alloys are still unknown; furthermore, their microstructural stability with repetitive melting/solidification cycles is not warrant. In this work, we provide a series of potential mPCMs for thermal management of electronics operating on a wide range of application temperatures, followed by an experimental investigation of microstructural and thermo-physical stability of these materials under repetitive melting solidification cycles. The results of the effect of cyclic thermal loading of theses alloys on the melting behavior and latent heat of fusion are discussed. Thermal stability of 51.0 wt  % In–32.5 wt %Bi–16.5 wt %Sn and 50 wt %Bi–26.7 wt %Pb–13.3 wt %Sn–10 wt %Cd alloys, as potential midtemperature mPCM, has been evaluated. The results suggest that these mPCMs maintain their thermo-physical stability over large periods of thermal cycles.

On the Design of Phase Change Materials based thermal management systems for electronics cooling

2021 ◽  
pp. 117276
Author(s):  
Giulia Righetti ◽  
Claudio Zilio ◽  
Luca Doretti ◽  
Giovanni A. Longo ◽  
Simone Mancin
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Electronics Cooling ◽  
Management Systems

scholarly journals A hybrid thermal management system for high power lithium-ion capacitors combining heat pipe with phase change materials

Heliyon ◽  
2021 ◽  
pp. e07773
Author(s):  
Danial Karimi ◽  
Md Sazzad Hosen ◽  
Hamidreza Behi ◽  
Sahar Khaleghi ◽  
Mohsen Akbarzadeh ◽  
...  
Keyword(s):  
Phase Change ◽  
Heat Pipe ◽  
Thermal Management ◽  
High Power ◽  
Management System ◽  
Phase Change Materials ◽  
Lithium Ion ◽  
Thermal Management System

scholarly journals Programmable phase-change metasurfaces on waveguides for multimode photonic convolutional neural network

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Changming Wu ◽  
Heshan Yu ◽  
Seokhyeong Lee ◽  
Ruoming Peng ◽  
Ichiro Takeuchi ◽  
...  
Keyword(s):  
Neural Network ◽  
Neural Networks ◽  
Phase Change ◽  
Convolutional Neural Network ◽  
Large Scale ◽  
Phase Change Materials ◽  
Refractive Index Change ◽  
Optical Computing ◽  
Machine Learning Algorithms ◽  
Matrix Vector Multiplication

AbstractNeuromorphic photonics has recently emerged as a promising hardware accelerator, with significant potential speed and energy advantages over digital electronics for machine learning algorithms, such as neural networks of various types. Integrated photonic networks are particularly powerful in performing analog computing of matrix-vector multiplication (MVM) as they afford unparalleled speed and bandwidth density for data transmission. Incorporating nonvolatile phase-change materials in integrated photonic devices enables indispensable programming and in-memory computing capabilities for on-chip optical computing. Here, we demonstrate a multimode photonic computing core consisting of an array of programable mode converters based on on-waveguide metasurfaces made of phase-change materials. The programmable converters utilize the refractive index change of the phase-change material Ge2Sb2Te5 during phase transition to control the waveguide spatial modes with a very high precision of up to 64 levels in modal contrast. This contrast is used to represent the matrix elements, with 6-bit resolution and both positive and negative values, to perform MVM computation in neural network algorithms. We demonstrate a prototypical optical convolutional neural network that can perform image processing and recognition tasks with high accuracy. With a broad operation bandwidth and a compact device footprint, the demonstrated multimode photonic core is promising toward large-scale photonic neural networks with ultrahigh computation throughputs.

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