Fracture Toughness of Titanium - Titanium Nitride Multi-Layer Thin Film

2008 ◽  
Author(s):  
Mohan Prasad Manoharan ◽  
Amit Desai ◽  
Amanul Haque
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Titanium Nitride ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
New Class ◽  
Tin Coatings ◽  
Film Specimen ◽  
Cantilever Bending ◽  
Layer Thin Film

Thin film specimens of titanium - titanium nitride multilayer erosion resistant coating were prepared using liftout technique in Focused Ion Beam - Scanning Electron Microscope (SEM). The fracture toughness of the thin film specimen was measured in situ using a cantilever bending experiment in SEM to be 11.33 MPa/m0.5, twice as much as conventional TiN coatings. Ti–TiN multi-layer coatings are part of a new class of advanced erosion resistant coatings and this paper discusses an experimental technique to measure the fracture toughness of these coatings.

A Membrane Deflection Fracture Experiment to Investigate Fracture Toughness of Freestanding MEMS Materials

2003 ◽  
Vol 795 ◽  
Author(s):  
H. D. Espinosa ◽  
B. Peng
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
National Laboratory ◽  
Argonne National Laboratory ◽  
Mean Value ◽  
Advanced Materials ◽  
Ultrananocrystalline Diamond ◽  
Membrane Deflection

ABSTRACTThis paper presents a novel Membrane Deflection Fracture Experiment (MDFE) to investigate the fracture toughness of MEMS and other advanced materials in thin film form. It involves the stretching of freestanding thin-film membranes, in a fixed-fixed configuration, containing pre-existing cracks. The fracture behavior of ultrananocrystalline diamond (UNCD), a material developed at Argonne National Laboratory, is investigated to illustrate the methodology. When the fracture initiates from sharp cracks, produced by indentation, the fracture toughness was found to be 4.7 MPa m1/2. When the fracture initiates from blunt notches with radii about 100 nm, machined by focused ion beam (FIB), the mean value of the apparent fracture toughness was found to be 7.2 MPa m1/2. Comparison of these two values, using the model proposed by Drory et al. [9], provides a correction factor of 2/3, which corresponds to a mean value of ρ/2x=1/2.

Fracture Toughness Evaluation of a Cracked Au Thin Film by Applying a Finite Element Analysis and Bulge Test

2019 ◽  
Vol 827 ◽  
pp. 196-202
Author(s):  
Hector A. Tinoco ◽  
Pavel Hutař ◽  
Benoit Merle ◽  
Mathias Göken ◽  
Tomáš Kruml
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Experimental Tests ◽  
Bulge Test ◽  
Element Analysis ◽  
Plastic Properties

This paper presents a finite element analysis of a pre-cracked freestanding gold thin film subjected to bulge test. These tests were conducted in order to determine the elasto-plastic properties and fracture toughness of the gold films. For the experimental tests, a pre-crack was introduced in the center of the film by focused ion beam (FIB) milling with a length of 10 and a width of 100nm. For the numerical fracture analysis, the problem was divided into two stages; the first stage was the development of the numerical model on the whole film without pre-crack (elasto-plastic analysis) and the second one was performed on a film portion that included the pre-crack (sub-modeling stage). Three different notches (rounded, sharp and V-sharp) were applied to calculate the stress intensity factor around the crack tip using path independent J-integral. The obtained results show that the load-deflection curves for non-cracked and pre-cracked film reproduced the experiments using the calculated elasto-plastic properties. This indicates that the proposed models presented a good correlation and robustness. Additionally, fracture toughness values were calculated between 0.288 and 0.303with J-integral values 1.037 J/m2 (elastic) and 1.136 J/m2 (elasto-plastic) which correspond with other calculations available in the literature.

Measuring Thin Film Fracture Toughness Using the Indentation Sinking-in Effect and Focused Ion Beam

1999 ◽  
Vol 594 ◽  
Author(s):  
Ting Y. Tsui ◽  
Young-Chang Joo
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Crack Tip ◽  
Bending Moment ◽  
Hard Metal ◽  
Crack Tip Opening Displacement ◽  
Opening Displacement ◽  
Extension Force

AbstractA new experimental technique is developed to measure the fracture toughness of a hard metal thin film deposited on a soft substrate. A pre-crack was fabricated in the thin film by using the advanced focused ion beam (FIB) milling techniques. The crack extension force was generated by means of the indentation sinking-in effect. The effect creates a bending moment and tensile stress on the hard thin film near the indentation, which promotes crack growth. The amount of crack tip blunting prior to the critical failure was measured from the FIB cross-sectioned micrographs. By using the crack tip opening displacement model (CTOD), the fracture toughness of the thin film was calculated. The results show the nickel phosphorus (NiP) thin film fracture toughness is at least 15.0MPa√m. The finite element method (FEM) was used to understand the modes of mixity near the crack tip. The results indicate the crack tip modes of mixity are dominated by the Mode I opening, provided the indentation is sufficiently far from the pre-crack or the indentation depths is small when compared with the film thickness.

Fabrication of Dc-SQUID with As-Grown YBaCuO Thin Film by Focused Ion Beam

1990 ◽  
pp. 987-990
Author(s):  
M. Tanioku ◽  
K. Kuroda ◽  
K. Kojima ◽  
K. Hamanaka ◽  
Y. H. Hisaoka ◽  
...  
Keyword(s):  
Thin Film ◽  
Focused Ion Beam ◽  
Ion Beam

The evaluation of the composition dependence of fracture toughness of Al3Nb alloys by using micro-size fracture testing

MRS Advances ◽  
2017 ◽  
Vol 2 (26) ◽  
pp. 1405-1410
Author(s):  
Nobuhiro Matsuzaki ◽  
Ken-ichi Ikeda ◽  
Seiji Miura ◽  
Nobuaki Sekido ◽  
Takahito Ohmura
Keyword(s):  
Fracture Toughness ◽  
Single Crystal ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Two Phase ◽  
Fracture Testing ◽  
Average Value ◽  
Chevron Notch ◽  
Polycrystalline Alloys ◽  
Oxidation Resistant

ABSTRACTAl3Nb is known as a high oxidation resistant material, while it is quite brittle. As the fracture toughness of Al3Nb single crystal and its dependence on the composition are not obtained, the micro-sized fracture testing proposed by Suzuki et al. was performed. Al3Nb single crystal micron-order size cantilevers with a chevron-notch were fabricated in a grain of two-phase polycrystalline alloys by using FIB (Focused Ion Beam). From the load-displacement curves during the bending by a nanoindenter, the average value of fracture toughness of Nb-rich Al3Nb is evaluated to be 2.90 MPam1/2, while the fracture toughness of Al-rich Al3Nb is also evaluated to be 2.82 MPam1/2. From this result, the fracture toughness of Al3Nb is less dependent on its Al/Nb ratio. Furthermore the fracture toughness of Al3 (Nb, V) was evaluated to be 2.82 MPam1/2.The fracture toughness of Al3Nb is seemingly insensitive to V addition.

The Technique of Ion Beam Etching Polishing

2013 ◽  
Vol 395-396 ◽  
pp. 1066-1070
Author(s):  
Cheng Jun Guo ◽  
Ning Pei ◽  
Da Sen Wang ◽  
Feng Ming Nie ◽  
Guang Ping Zhang ◽  
...  
Keyword(s):  
Thin Film ◽  
Ion Beam ◽  
Optical Element ◽  
Material Surface ◽  
Optical Surface ◽  
Ion Beam Etching ◽  
Original Surface ◽  
Low Viscosity ◽  
Spatial Frequencies ◽  
Layer Thin Film

The accelerated gas ions collide with the surface material, the atom or molecule on material surface is removed by momentum transferring. Depositing a layer low viscosity of the thin film materials on the original surface of the optical, such materials will form a layer thin film on the surface of optical element that is lower than the original. Remove the high-spatial frequencies and obtain super precision optical surface.

Temperature Measurement by Using Metal Thin Film Thermocouples

2003 ◽  
Author(s):  
Koji Miyazaki ◽  
Hiroshi Tsukamoto ◽  
Takahiro Miike ◽  
Toshiaki Takamiya
Keyword(s):  
Thin Film ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Glass Plate ◽  
Mean Free Path ◽  
Dimensional Structure ◽  
Measured Temperature ◽  
Metal Thin Film ◽  
Thin Film Thermocouples ◽  
Thermocouple Junction

We fabricate metal thin film thermocouples (TFTCs). Au-Pt, Cu-Ni, and W-Ni are deposited on a glass plate using standard thin film processes. The dimension of thermocouple junction is 300μm × 300μm. The thermoelectric powers of TFTCs are different from those of bulk because diffusion of electrons is restricted by the very thin film. The film thickness of TFTCs is of the same order as the mean free path of electrons. However TFTCs are still useful for temperature measurements because the thermoelectric voltage is proportional to measured temperature at thermocouple junction. The response time of Au-Pt TFTCs is about 30ns when the surface of the glass is heated by a YAG pulsed laser. The result compares favorably with measurements by a thermoreflectance method. We also describe W-Ni nano-TFTCs fabricated by Focused Ion Beam for the measurement of temperature distribution in a sub-micron area. In order to reduce the size of the TFTCs we employ a 3-dimensional structure.

A New Technique For Visualizing The Displacement Field Of Indentations: The Case Of A Soft Film On A Hard Substrate

1997 ◽  
Vol 505 ◽  
Author(s):  
Joost J. Vlassak ◽  
T. Y. Tsui ◽  
W. D. Nix
Keyword(s):  
Titanium Nitride ◽  
Displacement Field ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Grain Structure ◽  
New Technique ◽  
Hard Substrate ◽  
Film Material ◽  
Pile Up ◽  
A New Technique

ABSTRACTWe have developed a new technique for visualizing displacement fields of indentations in thin films. In this technique, the indented film consists of alternating layers of two different materials. One of the materials serves as a marker for visualizing the plastic flow induced by the indentation. Focused Ion Beam (FIB) milling is used to cross-section the indentation, revealing the deformed layers. This technique can be used to study how the presence of the substrate affects the plastic displacement field around the indentation. The technique is applied to a multilayered film of aluminum and titanium nitride on a silicon substrate. The titanium nitride layers are much thinner than the aluminum layers and serve the function of marker. Pile-up of the film material around the indenter and the effect of the hard substrate are easily revealed and a mechanism for pile-up is suggested. The technique also shows that the grain structure in the deformed zone around the indentation is altered profoundly.

Sign in / Sign up

Export Citation Format

Share Document