Simulations of Heat Transport During Transient Electrostatic Discharge Events in a Sub-Micron Transistor

Volume 4 ◽  
2004 ◽  
Author(s):  
Sreekant V. J. Narumanchi ◽  
Jayathi Y. Murthy ◽  
Cristina H. Amon

The thermal problem associated with the transient electrostatic discharge phenomena in sub-micron silicon transistors is fast becoming a major reliability concern in IC packages. Currently, Fourier diffusion and some simple models based on the solution to the phonon Boltzmann transport equation (BTE) are used to predict failure (melting of silicon) in these transistors. In this study, a more comprehensive model, based on the phonon BTE and incorporating considerable details of phonon physics, is proposed and used to study the ESD problem. Transient results from the model reveal very significant discrepancies when compared to results from the other models in the literature.

2018 ◽  
Vol 777 ◽  
pp. 421-425 ◽  
Author(s):  
Chhengrot Sion ◽  
Chung Hao Hsu

Many methods have been developed to predict the thermal conductivity of the material. Heat transport is complex and it contains many unknown variables, which makes the thermal conductivity hard to define. The iterative solution of Boltzmann transport equation (BTE) can make the numerical calculation and the nanoscale study of heat transfer possible. Here, we review how to apply the iterative method to solve BTE and many linear systems. This method can compute a sequence of progressively accurate iteration to approximate the solution of BTE.


1998 ◽  
Vol 545 ◽  
Author(s):  
G. Chen ◽  
S. G. Volz ◽  
T. Borca-Tasciuc ◽  
T. Zeng ◽  
D. Song ◽  
...  

AbstractUnderstanding phonon heat conduction mechanisms in low-dimensional structures is of critical importance for low-dimensional thermoelectricity. In this paper, we discuss heat conduction mechanisms in two-dimensional (2D) and one-dimensional (1D) structures. Models based on both the phonon wave picture and particle picture are developed for heat conduction in 2D superlattices. The phonon wave model, based on the acoustic wave equations, includes the effects of phonon interference and tunneling, while the particle model, based on the Boltzmann transport equation, treats the internal as well interface scattering of phonons. For 1D systems, both the Boltzmann transport equation and molecular dynamics simulation approaches are employed. Comparing the modeling results with experimental data suggest that the interface scattering of phonons plays a crucial role in the thermal conductivity of low-dimensional structures. We also discuss the minimum thermal conductivity of low-dimensional structures based on a generalized thermal conductivity integral, and suggest that the minimum thermal conductivities of low-dimensional systems may differ from those of their corresponding bulk materials. The discussion leads to alternative ways to reduce thermal conductivity based on the propagating phonon modes.


Author(s):  
Dadong Wang ◽  
Zhengxian Qu ◽  
Yanbao Ma

As reported by many studies, Fourier’s law breaks down in micro/nanoscale due to the nondiffusive heat transport. To account for the nondiffusive heat transport, high-fidelity nondiffusive models with good efficiency for the experimental data analysis in nanothermometry are necessary but unfortunately missing. In this paper, based on a validated enhance Gray Boltzmann transport equation, we offer the analytical solutions for two important nanothermometry techniques, namely the transient thermal gratings (TTG) and time-domain thermoreflectance (TDTR) experiments. The analytical solutions obtained by inverse Fourier transform are compared to the experimental signals in both TTG and TDTR cases. The excellent agreements between the analytical solutions and the experiments demonstrate the applicability of the EG-BTE in experimental data analysis as an efficient replacement of Fourier’s law.


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