Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources

2010 ◽  
Author(s):  
Mitsuo Hashimoto ◽  
Hiroto Kasai ◽  
Kazuma Usami ◽  
Hiroyuki Ryoson ◽  
Kazuaki Yazawa ◽  
...  
Keyword(s):  
Heat Flux ◽  
Copper Powder ◽  
High Heat ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Heat Spreader ◽  
Two Phase ◽  
Evaporator Temperature ◽  
Sintered Copper ◽  
Multi Walled Carbon Nanotubes

A two-phase heat spreader has been developed for cooling high heat flux sources in high-power lasers, high-intensity light-emitting diodes, and semiconductor power devices. The heat spreader targets the passive cooling of heat sources with fluxes greater than 5 W/mm2 without requiring any active power consumption for the thermal solution. The prototype vapor chamber consists of an evaporator plate, a condenser plate and an adiabatic section, with water as the phase-change fluid. The custom-designed high heat flux source is composed of a platinum resistive heating pattern and a temperature sensor on an aluminum nitride substrate which is soldered to the outside of the evaporator. Experiments were performed with several different microstructures as evaporator surfaces under varying heat loads. The first microstructure investigated, a screen mesh, dissipated 2 W/mm2 of heat load but with an unacceptably high evaporator temperature. A sintered copper powder microstructure with particles of 50 μm mean diameter supported 8.5 W/mm2 without dryout. Four sets of particle diameters and different thicknesses for the sintered copper powder evaporators were tested. Additionally, some of the sintered structures were coated with multi-walled carbon nanotubes (CNT) that were rendered hydrophilic. Such nano-structured evaporators successfully showed a further reduction in thermal resistance of the vapor chamber.

Integrated Vapor Chamber Heat Spreader for Power Module Applications

2017 ◽  
Author(s):  
Clayton L. Hose ◽  
Dimeji Ibitayo ◽  
Lauren M. Boteler ◽  
Jens Weyant ◽  
Bradley Richard
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Coefficient Of Thermal Expansion ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Power Module ◽  
Heat Spreader

This work presents a demonstration of a coefficient of thermal expansion (CTE) matched, high heat flux vapor chamber directly integrated onto the backside of a direct bond copper (DBC) substrate to improve heat spreading and reduce thermal resistance of power electronics modules. Typical vapor chambers are designed to operate at heat fluxes > 25 W/cm2 with overall thermal resistances < 0.20 °C/W. Due to the rising demands for increased thermal performance in high power electronics modules, this vapor chamber has been designed as a passive, drop-in replacement for a standard heat spreader. In order to operate with device heat fluxes >500 W/cm2 while maintaining low thermal resistance, a planar vapor chamber is positioned onto the backside of the power substrate, which incorporates a specially designed wick directly beneath the active heat dissipating components to balance liquid return and vapor mass flow. In addition to the high heat flux capability, the vapor chamber is designed to be CTE matched to reduce thermally induced stresses. Modeling results showed effective thermal conductivities of up to 950 W/m-K, which is 5 times better than standard copper-molybdenum (CuMo) heat spreaders. Experimental results show a 43°C reduction in device temperature compared to a standard solid CuMo heat spreader at a heat flux of 520 W/cm2.

Dropwise Condensation on Superhydrophobic Microporous Wick Structures

2018 ◽  
Vol 140 (7) ◽  
Author(s):  
Sean H. Hoenig ◽  
Richard W. Bonner
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Contact Angle ◽  
Droplet Size ◽  
Copper Powder ◽  
Contact Angle Hysteresis ◽  
High Heat ◽  
Superhydrophobic Surfaces ◽  
High Heat Flux ◽  
Sintered Copper

Previous research in dropwise condensation (DWC) on rough microtextured superhydrophobic surfaces has demonstrated evidence of high heat transfer enhancement compared to smooth hydrophobic surfaces. In this study, we experimentally investigate the use of microporous sintered copper powder on copper substrates coated with a thiol-based self-assembled monolayer to attain enhanced DWC for steam in a custom condensation chamber. Although microtextured superhydrophobic surfaces have shown advantageous droplet growth dynamics, precise heat transfer measurements are underdeveloped at high heat flux. Sintered copper powder diameters from 4 μm to 119 μm were used to investigate particle size effects on heat transfer. As powder diameter decreased, competing physical factors led to improved thermal performance. At consistent operating conditions, we experimentally demonstrated a 23% improvement in the local condensation heat transfer coefficient for a superhydrophobic 4 μm diameter microporous copper powder surface compared to a smooth hydrophobic copper surface. For the smallest powders observed, this improvement is primarily attributed to the reduction in contact angle hysteresis as evidenced by the decrease in departing droplet size. Interestingly, the contact angle hysteresis of sessile water droplets measured in air is in contradiction with the departing droplet size observations made during condensation of saturated steam. It is evident that the specific design of textured superhydrophobic surfaces has profound implications for enhanced condensation in high heat flux applications.

A two-phase heat spreader for cooling high heat flux sources

2010 ◽  
Author(s):  
Mitsuo Hashimoto ◽  
Hiroto Kasai ◽  
Yuichi Ishida ◽  
Hiroyuki Ryoson ◽  
Kazuaki Yazawa ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Spreader ◽  
Two Phase

Development of Micro/Nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices

2011 ◽  
Author(s):  
David H. Altman ◽  
Joseph R. Wasniewski ◽  
Mark T. North ◽  
Sungwon S. Kim ◽  
Timothy S. Fisher
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
High Heat ◽  
Test Facility ◽  
Great Promise ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Heat Spreader

Spreading of high-flux electronics heat is a critical part of any packaging design. This need is particularly profound in advanced devices where the dissipated heat fluxes have been driven well over 100W/cm2. To address this challenge, researchers at Raytheon, Thermacore and Purdue are engaged in the development and characterization of a low resistance, coefficient of thermal expansion (CTE)-matched multi-chip vapor chamber heat spreader, which utilizes capillary driven two-phase heat transport. The vapor chamber technology under development overcomes the limitations of state-of-the-art approaches by combining scaled-down sintered Cu powder and nanostructured materials in the vapor chamber wick to achieve low thermal resistance. Cu-coated vertically aligned carbon nanotubes is the nanostructure of choice in this development. Unique design and construction techniques are employed to achieve CTE-matching with a variety of device and packaging materials in a low-profile form-factor. This paper describes the materials, design, construction and characterization of these vapor chambers. Results from experiments conducted using a unique high-heat flux capable 1DSS test facility are presented, exploring the effects of various microscopic wick configurations, CNT-functionalizations and fluid charges on thermal performance. The impacts of evaporator wick patterning, CNT evaporator functionalization and CNT condenser functionalization on performance are assessed and compared to monolithic Cu wick configurations. Thermal performance is explained as a function of applied heat flux and temperature through the identification of dominant component thermal resistances and heat transfer mechanisms. Finally, thermal performance results are compared to an equivalent solid conductor heat spreader, demonstrating a >40% reduction in thermal resistance. These results indicate great promise for the use of such novel vapor chamber technology in thickness-constrained high heat flux device packaging applications.

Development of a High Performance Vapor Chamber for High Heat Flux Applications

2008 ◽  
Author(s):  
Yuan Zhao ◽  
Chung-Lung Chen
Keyword(s):  
Heat Flux ◽  
High Performance ◽  
Experimental Tests ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Porous Network ◽  
Heat Spreader ◽  
Wick Structure

This paper introduces a high performance vapor chamber heat spreader with a novel bi-dispersed wick structure. The main wick structure is a sintered porous network in a latticed pattern, which contains not only small pores to transport liquid by capillary forces, but also many slots to provide large passages to vent vapor from heated surfaces. The copper particles have a diameter of approximately 50 μm; they produce an effective pore radius of approximately 13 μm after sintering. The slots have a typical width of approximately 500 μm. Unlike traditional bi-dispersed wick structures, the latticed wick structures provide undisrupted liquid delivery passages and vapor escape channels and thus greatly improve the heat transfer performance. Preliminary experimental tests were conducted and the results were analyzed. It was shown by the experiments that vapor chamber heat spreaders with the latticed wicks present three times improvement on heat spreading performance, comparing with a solid copper heat spreader, and much improved capacity to handle hot spots with local heat fluxes exceeding 300 W/cm2, which will have great impacts on extending heat pipe technology from traditional low to medium heat fluxes to high heat flux applications.

Reliable MOSFET operation using two-phase microfluidics in the presence of high heat flux transients

2011 ◽  
Vol 21 (10) ◽  
pp. 105002 ◽  
Author(s):  
Shiv Govind Singh ◽  
Amit Agrawal ◽  
Siddhartha P Duttagupta
Keyword(s):  
Heat Flux ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase

Model Predictive Control of a Pumped Two-Phase Cooling System With Microchannel Heat Exchangers

2018 ◽  
Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne
Keyword(s):  
Heat Flux ◽  
Model Predictive Control ◽  
Predictive Control ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Cooling Systems ◽  
Two Phase Cooling

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.

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