Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)

2003 ◽  
Author(s):  
John Lau ◽  
Walter Dauksher
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Boards ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Thermal Fatigue Life ◽  
Free Solder

In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very large. The CCGA (ceramic column grid array) package developed by IBM is one of the best candidates for housing these kinds of chips [1–7]. There are two parts in this study. One is to show that the 2-parameter Weibull life distribution is adequate for modeling the thermal-fatigue life of lead-free solder joints. This is demonstrated by comparing the 2-parameter and 3-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5wt%Sn3.9wt%Ag0.6wt%Cu lead-free solder paste on lead-free PCBs (printed circuit boards) under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density of the 1657-pin CCGA solder column with two different solder paste materials, namely, 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb and under three different thermal cycling profiles, namely, 25 ↔ 75°C, 0 ↔ 100°C, and −25 ↔ 125°C. The effects of these solder pastes and temperature conditions on the thermal-fatigue life of the high-lead (10wt%Sn90wt%Pb) solder columns of the CCGA package are provided and discussed.

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

2005 ◽  
Vol 127 (2) ◽  
pp. 96-105 ◽  
Author(s):  
John Lau ◽  
Walter Dauksher
Keyword(s):  
Fatigue Life ◽  
Printed Circuit Boards ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Thermal Fatigue Life ◽  
Free Solder ◽  
Two Parameter

In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very large. The CCGA (ceramic column grid array) package developed by IBM is one of the best candidates for housing these kinds of chips. There are two parts in this study. One is to show that the two-parameter Weibull life distribution is adequate for modeling the thermal-fatigue life of lead-free solder joints. This is demonstrated by comparing the two-parameter and three-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu lead-free solder paste on lead-free printed circuit boards under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density of the 1657-pin CCGA solder column with two different solder paste materials, namely, 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu and 63 wt %Sn37 wt %Pb and under three different thermal cycling profiles, namely, 25↔75°C, 0↔100°C, and −25↔125°C. The effects of these solder pastes and temperature conditions on the thermal-fatigue life of the high-lead (10 wt %Sn90 wt %Pb) solder columns of the CCGA package are provided and discussed.

Thermal Fatigue Life Estimation of Lead-Free Solder Using Inelastic Constitutive Model

2002 ◽  
Vol 2002.6 (0) ◽  
pp. 283-284
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Mineo KOBAYASHI ◽  
Nobutada OHNO ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Thermal Fatigue Life ◽  
Fatigue Life Estimation ◽  
Free Solder

scholarly journals Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints

2004 ◽  
Vol 7 (4) ◽  
pp. 308-313 ◽  
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Nobutada OHNO
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Free Solder

scholarly journals Evaluation of The Printability of Lead Versus Lead Free Solder Pastes

2021 ◽  
Author(s):  
Ala Al Robiaee
Keyword(s):  
Printed Circuit Boards ◽  
Lead Free ◽  
Solder Paste ◽  
Circuit Boards ◽  
Stencil Printing ◽  
Printed Circuit ◽  
Main Factors ◽  
Free Solder ◽  
Print Process ◽  
The Impact

As the global marketplaces consider mandating lead-free equipments, many questions arise about the impact and feasibility of replacing lead in printed circuit boards soldering applications. In this project, the results presented of a study on comparing the process of screening lead paste versus lead free paste parameters for regular stencil printing using standard manufacturing methods. The key process parameters studies were: squeegee speed, squeegee pressure, and screening yield for both types of pastes. Two solder paste formulations (lead paste and lead-free paste) were evaluated in this study. The analysis of the pastes deposit volumes showed that for normal manufacturing range of printer (screener) settings (speed and pressure) tested the two pastes performed the same. The results also showed that the squeegee speed has a greater effect on the printing process than the squeegee pressure. The tests clearly showed that the lead paste was affected more by setting changes compared to the lead free paste. Varying the print speed and pressure for type of pastes by observing the resulting printed paste volumes optimized screening parameters. This study confirms that a new stencil or stencil design is not needed for the lead free paste. However, this study recommends a change to the sitting of the screening print process. Stencil cleaning frequency is one of the main factors that impact the production rate in an SMT line. The project highlights new results that lead free paste throughput will be less compared to lead paste at the screening step. The number of rejected boards screened with lead free-paste exceeded normal manufacturing standards. As stencil cleaning is a must function, it was recommended to increase stencil wiping frequency when lead free paste [is] in use in order to obtain a consistent volume with less screening defect.

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

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