Vertically Aligned Multi-Walled Carbon Nanotube Arrays as Thermal Interface Materials and Measurement Technique

Author(s):  
Tao Tong ◽  
Yang Zhao ◽  
Lance Delzeit ◽  
Ali Kashani ◽  
Arun Majumdar ◽  
...  

State-of-the-art thermal interface materials are briefly reviewed with an emphasis on the emerging trend of using carbon nanotubes to increase interface thermal performance. Vertically aligned multi-walled carbon nanotube (MWCNT) arrays were grown and applied as thermal interfacial enhancing materials. It is expected that the highly thermally conductive channels directly bridging the mating surfaces would significantly enhance the interface thermal conductance. We extended the all-optical pump and probe phase sensitive transient thermo-reflectance (PSTTR) method and used it to measure the interfacial properties of a three-layer sample of a vertically aligned MWCNT array grown on silicon (Si) substrate dry adhered to a glass plate. The dominant thermal resistance is identified as the dry adhered MWCNT-glass interface with a thermal conductance of ~5.9 × 104 W/m2·K, compared with MWCNT-Si interface of almost two orders of magnitude higher. Tentative explanations on the difference in the two interfaces and ways for future improvements are provided. The PSTTR measurement principle and issues are also discussed in the context.

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Andrew J. McNamara ◽  
Yogendra Joshi ◽  
Zhuomin Zhang ◽  
Kyoung-sik Moon ◽  
Ziyin Lin ◽  
...  

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).


2019 ◽  
Vol 11 (1) ◽  
pp. 3-10 ◽  
Author(s):  
Guangjie Yuan ◽  
Haohao Li ◽  
Bo Shan ◽  
Johan Liu

As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.


Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.


2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produced and tested. Recently, we have undertaken major efforts to develop functional nanothermal interface materials (nTIMs) based on short, vertically aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. In this paper, we describe our material structures and the myriad permutations of parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2 K/W, independent of applied pressure. This value is significantly better than a variety of commercially available, high-performance thermal pads and greases we tested, and compares favorably with the best results reported for CNT-based materials in an application-representative setting.


2015 ◽  
Vol 54 (9) ◽  
pp. 095102 ◽  
Author(s):  
Nuri Na ◽  
Kei Hasegawa ◽  
Xiaosong Zhou ◽  
Mizuhisa Nihei ◽  
Suguru Noda

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