Design Optimization of Power Distribution Design Networks Using Embedded Passive Technology

2003 ◽  
Author(s):  
Albert Chee W. Lu ◽  
Wei Fan ◽  
Lai L. Wai ◽  
Toshiro Yamazaki ◽  
Jacinto Jun Jarcia ◽  
...  
Keyword(s):  
Design Optimization ◽  
Frequency Domain ◽  
Power Distribution ◽  
Printed Circuit Board ◽  
Distribution Networks ◽  
Frequency Domain Analysis ◽  
Circuit Board ◽  
Power Distribution Networks ◽  
Printed Circuit ◽  
Impedance Characteristics

This paper describes a design optimization of power distribution networks using embedded passive technology. A frequency-domain methodology was used to study the impedance characteristics of printed circuit board power planes with embedded decoupling capacitors, and also the interaction with discrete capacitors, package structures and on-chip capacitors. Two different thin-core materials were analyzed. Key aspects of power distribution networks including plane spreading inductance, plane pair via inductance and transfer impedance were also analyzed. Utilizing broadband PDN models, extracted with full-wave EM techniques to account for frequency-dependent behaviour, frequency-domain SPICE simulations were carried out to determine the system impedance characteristics at multiple port locations up to 2 GHz. The frequency-domain analysis shows that in bare boards, significant SSN interaction between different port locations within the printed circuit board is present. It is concluded that the proper use of high-K distributed capacitors at optimal locations on the printed circuit board helps to alleviate SSN interaction between different port locations. Several multi-layer test vehicles have been fabricated and characterized, with good correlation between simulation results and measured values.

Comparison of time-domaim and frequency-domain characterization procedures for printed circuit board interconnects

IEEE iWEM2011 ◽  
2011 ◽  
Author(s):  
Kuen-Fwu Fuh ◽  
Kuan-Yu Chen ◽  
En-Ting Chen ◽  
Tzuang-Han Lin ◽  
Anderson Cheng ◽  
...  
Keyword(s):  
Frequency Domain ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

FUZZY BASED DESIGN OPTIMIZATION TO REDUCE THE CROSSTALK IN MICROSTRIP LINES

2004 ◽  
Vol 13 (01) ◽  
pp. 121-136 ◽  
Author(s):  
T. AHMAD ◽  
M. A. HOSSAIN ◽  
A. K. RAY ◽  
Z. GHASSEMLOOY
Keyword(s):  
Fuzzy Logic ◽  
Design Optimization ◽  
High Speed ◽  
Printed Circuit Board ◽  
Optimization Methods ◽  
Circuit Board ◽  
Electrical Parameters ◽  
Design And Optimization ◽  
Printed Circuit ◽  
Microstrip Lines

This paper presents an investigation of the design optimization in microstrip lines to reduce the crosstalk level using Fuzzy Logic. In microstrip lines length and spacing, termination conditions of interconnection and output impedance of gates are the major components that cause crosstalk. In order to design high speed printed circuit board (PCB) with optimum interconnection configuration, it is essential to reduce the crosstalk to its minimum tolerance level. A design methodology is proposed to correlate electrical parameters and physical configuration of lines to the crosstalk phenomena. This design is subsequently optimized using Fuzzy Logic to reduce the level of crosstalk. A set of experiments is carried out to demonstrate the capabilities of the design and optimization methods. The effect of the geometrical configuration of the lines on crosstalk, particularly the spacing, is highlighted.

Downsizing an automotive junction box based on large current-carrying printed-circuit board optimization

2016 ◽  
Vol 231 (2) ◽  
pp. 267-278 ◽  
Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park
Keyword(s):  
Power Distribution ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Installation Space ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Overcurrent Protection ◽  
Large Current ◽  
Analytical Estimation

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.

Ambient Response Modal Analysis on a CEM-1 Single-Layer Printed Circuit Board

2013 ◽  
Vol 393 ◽  
pp. 683-687
Author(s):  
M. Azhan Anuar ◽  
A.A. Mat Isa ◽  
A.R. Zamri ◽  
M.F.M. Said
Keyword(s):  
Domain Decomposition ◽  
Modal Analysis ◽  
Frequency Domain ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Single Layer ◽  
Circuit Board ◽  
Valuable Insight ◽  
Printed Circuit ◽  
Frequency Domain Decomposition

Since the level of vibration always depends on the natural frequencies of the system, it is important to know the modal parameters of such system to control failure and provide prevention actions. The demand for structurally reliable Printed Circuit Boards (PCB) has increased as more functions are required from electronic products along with less weight and smaller size. This imposes certain limitations and critical requirements. In this paper, investigation on the dynamic characteristics of CEM-1 Single-layer PCB using Operational Modal Analysis (OMA, or often called Output-Only or Ambient Modal analysis), is presented. The Frequency Domain Decomposition (FDD) and Enhanced Frequency Domain Decomposition (EFDD) techniques are applied on the PCB with free-free end condition. Comparison of results between both techniques and also with the result from Experimental Modal Analysis (EMA), will be shown. The understanding on dynamic behaviour of this structure provides valuable insight into the nature of the response and remarkable enhancement of its model, strength and vibration.

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