CAM System Based on Constant Drill Hole Temperature for Drilling in Printed Wiring Board

2007 ◽  
Author(s):  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Seita Sumida
Keyword(s):  
High Speed ◽  
Tool Path ◽  
Present Report ◽  
New Technology ◽  
Drill Hole ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Grid Pattern ◽  
High Speed Drilling ◽  
Wiring Board

Recently, printed wiring boards (PWBs) employed in electronic devices have been miniaturized, lightened, and made multifunctional. Therefore, a new technology is required to improve the mounting density of PWBs. In the present report, we study high-quality, high-speed drilling of through-holes in PWBs. Particularly, we investigate the tool path for drilling grid-pattern holes. We estimate the drill temperature and PWB temperature while drilling the PWBs. On the basis of the results, we propose a tool path decision method that considers heat damage on the PWBs for a drilling CAM system.

Recent Advances in Oxide Glass Fiber Science

2001 ◽  
Vol 702 ◽  
Author(s):  
Ernest L. Lawton ◽  
Frederick T. Wallenberger ◽  
Hong Li
Keyword(s):  
High Speed ◽  
Rapid Development ◽  
Dissipation Factor ◽  
Oxide Glass ◽  
Electronic Systems ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Fiber Glass ◽  
Lower Dielectric Constant ◽  
Wiring Board

ABSTRACTThe predominate substrate for multilayer printed wiring boards is laminate constructed from epoxy resin reinforced with fiber glass fabrics. This combination of materials dominates the segment of the electronics market where dimensional stability of the substrate is critical. The rapid development of high speed digital and analog electronic systems has challenged the predominance of fiber glass as the reinforcement of choice. As systems move to the GHz frequency range, there is a need for lower dielectric constant of the substrate to insure integrity and speed of signals. A lower dissipation factor of the substrate is desired for the wireless communication applications of printed wiring boards. A review is presented of materials competing as substrates for the high speed application of the printed wiring board market.

An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards

1993 ◽  
Vol 115 (4) ◽  
pp. 366-372 ◽  
Author(s):  
G. G. Stefani ◽  
N. S. Goel ◽  
D. B. Jenks
Keyword(s):  
Numerical Technique ◽  
Thermal Characterization ◽  
Computer Time ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Equivalent Parameter ◽  
Finite Element Package ◽  
Multiple Materials ◽  
Wiring Board

Thermal modeling of Surface Mount Technology (SMT) microelectronics packages is difficult due to the complexity of the printed wiring board (PWB) plates through hole (PTH) structure. A simple, yet powerful finite difference based approach, called EPIC (Equivalent Parameter for Interfacial Cells), for modelling complex 2-D and 3-D geometries with multiple materials is used to model the PTH structure. A technique for computing an effective thermal conductivity for the PWB is presented. The results compare favorably with those from a commercially available finite element package but require far less computer time.

Thermal Evaluation of High-Current Polyimide Rigid and Rigid-Flex Printed Wiring Board Trace Widths in a Vacuum

2013 ◽  
Vol 2013 (1) ◽  
pp. 000964-000969
Author(s):  
Bennion Cannon ◽  
Frank Friedl ◽  
Gary Gisler
Keyword(s):  
Thermal Imaging ◽  
Hot Spots ◽  
Test Results ◽  
High Current ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Thermal Imaging Camera ◽  
Industry Standards ◽  
Imaging Camera ◽  
Wiring Board

This paper details the thermal evaluation of high-current polyimide rigid and rigid-flex printed wiring boards in a vacuum. Although industry standards, such as IPC-2152 or MIL-STD-275, can be used to determine required trace width for PWB traces that carry current to between 20 or 30 amps for multiple copper plane thicknesses, they typically cannot be used to determine trace width for PWB traces that handle current greater than 15 amps. This paper presents results from testing and analysis of high-current rigid and rigid-flex PWBS that must carry current of up to 60 amps. Testing was performed in vacuum on a controlled-temperature platen, measuring board temperature at specific locations to determine performance of different trace widths using 2 and 4 ounce copper layers. A thermal imaging camera was used to identify PWB hot spots. Test results were compared to IPC-2152 standards, extrapolated to 60 amps current.

Optical-electrical printed wiring board for high-speed computing applications

2013 ◽  
Vol 52 (3) ◽  
pp. 035201 ◽  
Author(s):  
Joseph Dingeldein ◽  
Kevin L. Kruse ◽  
Casey Demars ◽  
Christopher Middlebrook ◽  
Craig Friedrich ◽  
...  
Keyword(s):  
High Speed ◽  
Printed Wiring Board ◽  
Wiring Board
Sign in / Sign up

Export Citation Format

Share Document