Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures

2007 ◽  
Author(s):  
Jesse VanEngelenhoven ◽  
Gary L. Solbrekken ◽  
Karl J. L. Geisler
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Dissipation ◽  
Side Wall ◽  
Form Factors ◽  
Air Cooling ◽  
Heat Transfer Capacity ◽  
Flow Pressure ◽  
Forced Air ◽  
Analytic Models

Based on standard commercial form factors, this study explores chassis-level air cooling limits for ruggedized military electronics enclosures constrained by pressure drop requirements and fin manufacturing capabilities. Numeric and analytic models are developed and used to define a methodology for optimizing the geometry of longitudinal plate fins included in side wall ducts to maximize the amount of heat that can be dissipated from an air-cooled chassis. The results of these analyses are presented in the form of a performance map facilitate the identification of particular fin manufacturing process well-suited for a specified set of mass flow, pressure drop, and heat transfer requirements. Analysis results demonstrate that if isothermal boundaries can be achieved, the heat transfer capacity of the chassis will increase relative to isoflux boundary condition assumptions. As a means to this end, the incorporation of heat pipes into the chassis wall is explored to enhance heat spreading and approach the isothermal limits of heat dissipation in the airflow ducts.

scholarly journals Cooling of a battery pack of a car, working on renewable energy

2018 ◽  
Vol 245 ◽  
pp. 15003 ◽  
Author(s):  
Ivan Kasatkin ◽  
Mikle Egorov ◽  
Evgeny Kotov ◽  
Evgeny Zakhlebaev
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Heat Removal ◽  
Lithium Ion ◽  
Operating Mode ◽  
Engineering Calculation ◽  
Electrical Circuit ◽  
Thermal Engineering ◽  
Air Cooling ◽  
Forced Air

The aim of the work is to choose a method of a solar car battery cooling. The student engineering team of Peter the Great Petersburg Polytechnic University designs the car. The analysis of the electrical circuit of the battery is carried out, the heat release is estimated due to three factors. According to the conditions of reliable operation of the battery, it is necessary to maintain its temperature range below 45°C, which requires cooling. The paper analyzes the possibilities of liquid, air-cooling, compares the free and forced methods of convective heat transfer. For the normal operating mode of the electric vehicle, environmental temperature at the level up to 38°C, a criterion thermal engineering calculation of the forced air-cooling of the corridor assembly of 405 battery cells providing the required heat dissipation is performed. It is shown that relatively high values of the heat transfer coefficient are provided under turbulent flow conditions characterized by Reynolds criteria above 103. On the basis of an analysis of the steady-state stationary heat-removal regime, it was concluded that an air flow provides a temperature gradient, sufficient for cooling the lithium-ion battery of a Solar Car «Polytech Solar».

A Two-Dimensional Conjugate Heat Transfer Model for Forced Air Cooling of an Electronic Device

1989 ◽  
Vol 111 (1) ◽  
pp. 41-45 ◽  
Author(s):  
A. Zebib ◽  
Y. K. Wo
Keyword(s):  
Heat Transfer ◽  
Conjugate Heat Transfer ◽  
Electronic Device ◽  
Transfer Problem ◽  
Maximum Temperature ◽  
Transfer Model ◽  
Air Cooling ◽  
Two Dimensional ◽  
Component Design ◽  
Forced Air

Thermal analysis of forced air cooling of an electronic component is modeled as a two-dimensional conjugate heat transfer problem. The velocity field in a constricted channel is first computed. Then, for a typical electronic module, the energy equation is solved with allowance for discontinuities in the thermal conductivity. Variation of the maximum temperature with the average air velocity is presented. The importance of our approach in evaluating possible benefits due to changes in component design and the limitations of the two-dimensional model are discussed.

scholarly journals Experimental and Simulation Study of Micro-Channel Backplane Heat Pipe Air Conditioning System in Data Center

2020 ◽  
Vol 10 (4) ◽  
pp. 1255
Author(s):  
Liping Zeng ◽  
Xing Liu ◽  
Quan Zhang ◽  
Jun Yi ◽  
Xiaohua Li ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Transfer Performance ◽  
Outlet Temperature ◽  
Transfer Performance ◽  
Micro Channel ◽  
Heat Transfer Capacity ◽  
The Heat Transfer Coefficient

This paper mainly studies the heat transfer performance of backplane micro-channel heat pipes by establishing a steady-state numerical model. Compared with the experimental data, the heat transfer characteristics under different structure parameters and operating parameters were studied, and the change of heat transfer coefficient inside the system, the air outlet temperature of the back plate and the influence of different environmental factors on the heat transfer performance of the system were analyzed. The results show that the overall error between simulation results and experimental data is less than 10%. In the range of the optimal filling rate (FR = 64.40%–73.60%), the outlet temperature at the lowest point and the highest point of the evaporation section is 22.46 °C and 19.60 °C, the temperature difference does not exceed 3 °C, and the distribution gradient in vertical height is small and the air outlet temperature is uniform. The heat transfer coefficient between the evaporator and the condenser is larger than the heat transfer coefficient under the conditions of low and high liquid charge rate. It increases gradually along the flow direction, and decreases gradually with the flow rate of the condenser. When the width of the flat tube of the evaporator increases from 20 mm to 28 mm, the internal pressure drop of the evaporator decreases by 45.83% and the heat exchange increases by 18.34%. When the number of evaporator slices increases from 16 to 24, the heat transfer increases first and then decreases, with an overall decrease of 2.86% and an increase of 87.67% in the internal pressure drop of the evaporator. The inclination angle of the corrugation changes from 30° to 60°, and the heat transfer capacity and pressure drop increase. After the inclination angle is greater than 60°, the heat transfer capacity and resistance decrease. The results are of great significance to system optimization design and engineering practical application.

Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

2012 ◽  
Author(s):  
Gongnan Xie ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang ◽  
Jun Zhao
Keyword(s):  
Heat Transfer ◽  
Double Layer ◽  
Pressure Loss ◽  
Heat Dissipation ◽  
Thermal Characteristics ◽  
Parallel Flow ◽  
Air Cooling ◽  
Pumping Power ◽  
Liquid Cooling ◽  
Counter Flow

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.

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