Production of noble gas ion beams in a focused ion beam machine using an electron beam ion trap

Author(s):  
Falk Ullmann ◽  
Frank Grossmann ◽  
Vladimir P. Ovsyannikov ◽  
Jacques Gierak ◽  
Eric Bourhis ◽  
...  
2007 ◽  
Vol 90 (8) ◽  
pp. 083112 ◽  
Author(s):  
F. Ullmann ◽  
F. Großmann ◽  
V. P. Ovsyannikov ◽  
J. Gierak ◽  
G. Zschornack

2008 ◽  
Vol 86 (1) ◽  
pp. 315-319 ◽  
Author(s):  
N Nakamura ◽  
F J Currell ◽  
D Kato ◽  
A P Kavanagh ◽  
Y M Li ◽  
...  

The electron beam ion trap (EBIT) in Tokyo was constructed about 10 years after the first EBIT at Lawrence Livermore National Laboratory was built, and has been being stably operated since then. In this paper, we present recent experimental activities at the Tokyo EBIT. In particular, experiments utilizing slow, very highly charged ion beams extracted from the EBIT are reported. PACS Nos.: 39.10.+j, 32.30.Rj, 34.50.Dy, 34.80.Kw


2008 ◽  
Author(s):  
Tae-Youl Choi ◽  
Dimos Poulikakos

Focused-ion-beam (FIB) is a useful tool for defining nanoscale structures. High energy heavy ions inherently exhibit destructive nature. A less destructive tool has been devised by using electron beam. FIB is mainly considered as an etching tool, while electron beam can be used for deposition purpose. In this paper, both etching and deposition method are demonstrated for applications in thermal science. Thermal conductivity of nanostructures (such as carbon nanotubes) was measured by using the FIB (and electron beam) nanolithography technique. Boiling characteristics was studied in a submicron heater that could be fabricated by using FIB.


2006 ◽  
Vol 77 (9) ◽  
pp. 093303 ◽  
Author(s):  
W. Meissl ◽  
M. C. Simon ◽  
J. R. Crespo López-Urrutia ◽  
H. Tawara ◽  
J. Ullrich ◽  
...  

2018 ◽  
Vol 89 (5) ◽  
pp. 052401 ◽  
Author(s):  
M. A. Blessenohl ◽  
S. Dobrodey ◽  
C. Warnecke ◽  
M. K. Rosner ◽  
L. Graham ◽  
...  

1997 ◽  
Vol 68 (5) ◽  
pp. 1998-2002 ◽  
Author(s):  
L. P. Ratliff ◽  
E. W. Bell ◽  
D. C. Parks ◽  
A. I. Pikin ◽  
J. D. Gillaspy

Author(s):  
H.J. Ryu ◽  
A.B. Shah ◽  
Y. Wang ◽  
W.-H. Chuang ◽  
T. Tong

Abstract When failure analysis is performed on a circuit composed of FinFETs, the degree of defect isolation, in some cases, requires isolation to the fin level inside the problematic FinFET for complete understanding of root cause. This work shows successful application of electron beam alteration of current flow combined with nanoprobing for precise isolation of a defect down to fin level. To understand the mechanism of the leakage, transmission electron microscopy (TEM) slice was made along the leaky drain contact (perpendicular to fin direction) by focused ion beam thinning and lift-out. TEM image shows contact and fin. Stacking fault was found in the body of the silicon fin highlighted by the technique described in this paper.


Author(s):  
P. Perdu ◽  
G. Perez ◽  
M. Dupire ◽  
B. Benteo

Abstract To debug ASIC we likely use accurate tools such as an electron beam tester (Ebeam tester) and a Focused Ion Beam (FIB). Interactions between ions or electrons and the target device build charge up on its upper glassivation layer. This charge up could trigger several problems. With Ebeam testing, it sharply decreases voltage contrast during Image Fault Analysis and hide static voltage contrast. During ASIC reconfiguration with FIB, it could induce damages in the glassivation layer. Sample preparation is getting a key issue and we show how we can deal with it by optimizing carbon coating of the devices. Coating is done by an evaporator. For focused ion beam reconfiguration, we need a very thick coating. Otherwise the coating could be sputtered away due to imaging. This coating is use either to avoid charge-up on glassivated devices or as a sacrificial layer to avoid short circuits on unglassivated devices. For electron beam Testing, we need a very thin coating, we are now using an electrical characterization method with an insitu control system to obtain the right thin thickness. Carbon coating is a very cheap and useful method for sample preparation. It needs to be tuned according to the tool used.


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