Characterization of Ru thin films from a novel CVD/atomic layer deposition precursor “Rudense” for capping layer of Cu interconnects
2015 ◽
Vol 33
(1)
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pp. 01A133
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Keyword(s):
2003 ◽
Vol 52
(3)
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pp. 289
Keyword(s):
2018 ◽
Vol 36
(6)
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pp. 06A104
2012 ◽
Vol 1
(6)
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pp. N107-N114
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2010 ◽
Vol 157
(10)
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pp. G193
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Keyword(s):
Keyword(s):
2019 ◽
Vol 58
(7)
◽
pp. 070907
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2009 ◽
Vol 22
(2)
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pp. 137-141
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Keyword(s):
2007 ◽
Vol 42
(1-6)
◽
pp. 172-175
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Keyword(s):