Optical waveguides for on-chip fluorescence measurements (Conference Presentation)

Author(s):  
Pao T. Lin ◽  
Gerard L. Coté ◽  
Kristen Maitland ◽  
Tiening Jin ◽  
Junchao Zhou ◽  
...  
2020 ◽  
Vol 56 (91) ◽  
pp. 14283-14286
Author(s):  
Diana Al Husseini ◽  
Junchao Zhou ◽  
Daniel Willhelm ◽  
Trevor Hastings ◽  
Gregory S. Day ◽  
...  

Functionalization of optical waveguides with submicron all-nanoparticle coatings significantly enhanced the detection of acetone. Such coatings were enabled via precise control of the substrate withdrawal speed using the layer-by-layer deposition.


2021 ◽  
Author(s):  
Ricardo Téllez-Limón ◽  
Rafael Salas-Montiel

Chip-scale integrated optical devices are one of the most developed research subjects in last years. These devices serve as a bridge to overcome size mismatch between diffraction-limited bulk optics and nanoscale photonic devices. They have been employed to develop many on-chip applications, such as integrated light sources, polarizers, optical filters, and even biosensing devices. Among these integrated systems can be found the so-called hybrid photonic-plasmonic devices, structures that integrate plasmonic metamaterials on top of optical waveguides, leading to outstanding physical phenomena. In this contribution, we present a comprehensive study of the design of hybrid photonic-plasmonic systems consisting of periodic arrays of metallic nanowires integrated on top of dielectric waveguides. Based on numerical simulations, we explain the physics of these structures and analyze light coupling between plasmonic resonances in the nanowires and the photonic modes of the waveguides below them. With this chapter we pretend to attract the interest of research community in the development of integrated hybrid photonic-plasmonic devices, especially light interaction between guided photonic modes and plasmonic resonances in metallic nanowires.


2001 ◽  
Vol 667 ◽  
Author(s):  
Anne Minardi ◽  
Claudine Garapon ◽  
Jacques Mugnier ◽  
Corinne Champeaux

ABSTRACTEuropium doped alumina Al2O3optical waveguides were prepared by pulsed laser deposition (PLD) using a KrF laser. The targets were obtained by sintering doped powders synthesized by a sol-gel method. Depending on the oxygen pressure used during the deposition, Eu3+ (for 0.1 mbar) or Eu2+ (for 10−5 mbar) are obtained in the films. Two kinds of Eu2+ ions are present, with a 4f-5d broad excitation band peaking at 330 nm and emission bands located at 490 nm or 585 nm respectively. For Eu3+ doped films, the usual 5D0 to the 7FJ multiplets emission spectra were observed. The emission lines are strongly inhomogeneously broadened. Low temperature site selective fluorescence measurements were achieved in order to correlate the different Eu3+ sites observed with the structure of the films (amorphous or γ crystallized).


2017 ◽  
Vol 8 ◽  
pp. 38-44 ◽  
Author(s):  
Felix Pyatkov ◽  
Svetlana Khasminskaya ◽  
Vadim Kovalyuk ◽  
Frank Hennrich ◽  
Manfred M Kappes ◽  
...  

Carbon nanotubes (CNTs) have recently been integrated into optical waveguides and operated as electrically-driven light emitters under constant electrical bias. Such devices are of interest for the conversion of fast electrical signals into optical ones within a nanophotonic circuit. Here, we demonstrate that waveguide-integrated single-walled CNTs are promising high-speed transducers for light-pulse generation in the gigahertz range. Using a scalable fabrication approach we realize hybrid CNT-based nanophotonic devices, which generate optical pulse trains in the range from 200 kHz to 2 GHz with decay times below 80 ps. Our results illustrate the potential of CNTs for hybrid optoelectronic systems and nanoscale on-chip light sources.


2006 ◽  
Vol 951 ◽  
Author(s):  
Claire L. Callender ◽  
Patrick Dumais ◽  
Christopher J. Ledderhof ◽  
Julian P. Noad

ABSTRACTThe design, fabrication and characterization of liquid-filled microchannels embedded in silica layers and integrated with optical waveguides for applications in on-chip sensors and novel photonic devices are presented. These integrated microstructures are formed using plasma-enhanced chemical vapor deposition (PECVD), photolithography and reactive ion etching (RIE). Surface accessible fluid introduction ports have been developed, and microfluidic circuits including bends, T-junctions and splitters are demonstrated. Coupling of light from integrated solid silica waveguides via directional coupling or direct end-fire coupling into fluid filled channels has been achieved on-chip, and optical losses assessed experimentally and theoretically. Optimization of the microstructures for sensor applications and for novel photonic devices based on nonlinear and other optical properties of fluids in integrated liquid waveguide segments is discussed.


2002 ◽  
Vol 744 ◽  
Author(s):  
Shom Ponoth ◽  
Navnit Agarwal ◽  
Peter Persans ◽  
Joel Plawsky

ABSTRACTOptical waveguides are being explored for on-chip purposes to overcome the speed limitations of electrical interconnects. Passive optical components like waveguides and vertical outcouplers are important components in such schemes. In this study we fabricate planar waveguides with integrated vertical micro-mirrors using standard Back End of the Line silicon (BEOL) CMOS based processes. Around 1.6 μm of a hybrid alkoxy siloxane polymer with a refractive index of ∼ 1.50 at the intended wavelength of 830 nm is used as the core and plasma deposited silicon oxide with a refractive index of ∼ 1.46 is used as the cladding. The angular face in the polymer waveguide that would function as the mirror surface was fabricated by a pattern transfer method which involves transferring the angle in a template to the waveguide using anisotropic reactive ion etching. The sidewall angle realized in a positive resist on patterning was used as the angle template. Exposure and development conditions were adjusted for Shipley® S1813 photoresist to generate a sidewall angle of ∼ 65°. The anisotropic Reactive Ion Etching (RIE) was done using a CF4/O2 plasma chemistry. A gas composition of 50/50 CF4/O2 was chosen in order to minimize the etch related roughness of the polymer and the photoresist. The metallization of the mirror faces was done using a self-aligned maskless technique which ensures metal deposition only on the angular face and also eliminates a lithography step.


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