Photoconductor Pulse Generators And Sampling Gates For Characterization Of High-Speed Devices And Transmission Lines

Abstract The design, manufacturing and DC and microwave characterization of high-power Schottky barrier InAlAs/InGaAs back-illuminated mesa structure photodiodes are presented. The photodiodes with 10 and 15 μm mesa diameters operate at ≥40 and 28 GHz, respectively, have the output RF power as high as 58 mW at a frequency of 20 GHz, the DC responsivity of up to 1.08 A/W depending on the absorbing layer thickness, and a photodiode dark current as low as 0.04 nA. We show that these photodiodes provide an advantage in the amplitude-to-phase conversion factor which makes them suitable for use in high-speed analog transmission lines with stringent requirements for phase noise.

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A Novel Approach to the Measurement and Characterization of Losses due to Surface Roughness in High Speed Transmission Lines

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/cicmt-2011-wp23 ◽

2011 ◽

Vol 2011 (CICMT) ◽

pp. 000241-000245

Author(s):

Femi Akinwale ◽

A. Ege Engin

Keyword(s):

Surface Roughness ◽

Transmission Lines ◽

High Speed ◽

Data Transfer ◽

Signal Propagation ◽

High Frequencies ◽

Novel Approach ◽

Critical Issues ◽

5 Ghz

An accurate measurement technique is required to fully characterize the losses observed at high frequencies in transmission lines. Evaluation of losses seen at high frequencies is necessary to meet the high-speed data transfer rates that future applications will demand. Conductor properties and losses are two critical issues in signal path characterization. The nature of conductor losses is not well understood at high speeds. Classical models used for predicting the effects of surface roughness on signal propagation are known to breakdown around 5 GHz. Novel methods are sought to quantify the effects beyond 5 GHz. In this paper, a simple methodology to extract conductor loss is derived and validated based on a stripline configuration of two different widths. The proposed methodology is applicable to surface roughness loss characterization of both organic and ceramic packaging materials.

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Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2010.2050204 ◽

2010 ◽

Vol 33 (4) ◽

pp. 857-867 ◽

Cited By ~ 43

Author(s):

Joong-Ho Kim ◽

Dan Oh ◽

Woopoung Kim

Keyword(s):

Transmission Lines ◽

High Speed ◽

Digital Systems ◽

Multiconductor Transmission Lines

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Mixed-Port Hybrid Parameters for High-Speed Differential Lines

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000380 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000380-000383

Author(s):

A. Ege Engin ◽

Ivan Ndip ◽

Klaus-Dieter Lang ◽

Jerry Aguirre

Keyword(s):

Transmission Lines ◽

Mixed Mode ◽

High Speed ◽

Mode Conversion ◽

Network Analyzer ◽

Scattering Parameters ◽

Coupled Lines ◽

Tightly Coupled ◽

Insight Into

Abstract High-speed transmission lines are commonly routed as differential lines to control sensitivity to noise on the reference planes at higher speeds. The preferred method of characterization of differential lines is in terms of mixed-mode scattering parameters, as they provide insight into the behavior of differential and common signals, as well as the mode conversion among them. These mixed-mode scattering parameters can be mathematically obtained from single-ended parameters, which can for example be measured with a 4-port vector network analyzer. There has been recent concerns about the so-obtained mixed-mode scattering parameters, especially for tightly-coupled lines, resulting in extended or modified definitions of mixed-mode scattering parameters. This can be a point of confusion in interpreting the behavior of differential lines. In this paper we introduce the mixed-port hybrid parameters, which do not suffer from any such ambiguous definitions, as they are based on intuitive differential and common-port excitations of the network. As such, mixed-port hybrid parameters can be used to analyze the mixed-mode performance of any arbitrary 4-port network, certainly including coupled or asymmetrical lines, without any ambiguity.

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Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC Applications

Journal of Microelectronics and Electronic Packaging ◽

10.4071/1551-4897-3.4.216 ◽

2006 ◽

Vol 3 (4) ◽

pp. 216-225

Author(s):

Ming-Kun Chen ◽

Cheng-Chi Tai ◽

Yu-Jung Huang

Keyword(s):

Transmission Lines ◽

High Speed ◽

Flip Chip ◽

Equivalent Circuit Model ◽

Electrical Characterization ◽

Time Domain Reflectometry ◽

Electronic Market ◽

Wide Range ◽

The Time Domain

With high-speed computers and wireless communications system become more popular in the electronic market, these communication-oriented products require high packaging densities, clock rates and higher switching speeds over Gb/s. A multilayer flip-chip Ball grid array (FCBGA) package used for applications running at more than 1 Gb/s has been characterized in this work. Electrical characterization of the package becomes essential beyond 1 GHz considering that the interconnections on the package behave not only just as interconnections but also as transmission lines. In this paper, we present the measurement and simulation results for interconnection of an FCBGA package using the time domain reflectometry (TDR) method. Simulation and measurement results are compared to establish a proper equivalent circuit model of the FCBGA interconnections. The parasitics of the power network can be measured through TDR, vector network analyzer (VNA) and impedance analyzer (IA). The complete models generated in this work are targeted for high-speed system-on-chip (SOC) devices that have a wide range of uses across commercial electronic applications.

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