Invited Paper Novel Chemistry For High Quality, Low Hydrogen PECVD Silicon Nitride Films

Author(s):  
D. E. Ibbotson ◽  
C. P. Chang ◽  
D. L. Flamm ◽  
J. A. Mucha
2011 ◽  
Vol 94 (1) ◽  
pp. 16003 ◽  
Author(s):  
J. Falta ◽  
Th. Schmidt ◽  
S. Gangopadhyay ◽  
T. Clausen ◽  
O. Brunke ◽  
...  

1987 ◽  
Vol 62 (4) ◽  
pp. 1406-1415 ◽  
Author(s):  
Chorng‐Ping Chang ◽  
Daniel L. Flamm ◽  
Dale E. Ibbotson ◽  
John A. Mucha

2004 ◽  
Vol 808 ◽  
Author(s):  
Fengzhen Liu ◽  
Lynn Gedvilas ◽  
Brian Keyes ◽  
Errol Sanchez ◽  
Shulin Wang ◽  
...  

ABSTRACTWe have studied the effect of H dilution on silicon nitride films deposited by the hot-wire chemical vapor deposition (HWCVD) technique using SiH4, NH3, and H2 gases. We found that H dilution significantly enhances the properties at silicon nitride films. The N content in the film increases by more than 2 times compared to the film without dilution, based on FTIR measurements. As a result, we can achieve high-quality a-SiNx:H films at low substrate temperature using a much lower gas ratio of NH3/SiH4(∼1) compared to a ratio of about 100 for conventional deposition by HWCVD. We also found that dilution decreases the H content in the films. More importantly, diluted SiNx films are conformal. Scanning electron microscopy measurements show a nearly 100% surface coverage over a sharp object. Electric breakdown measurement shows a well-insulated film with more then a few MV/cm for the breakdown field.


Shinku ◽  
2007 ◽  
Vol 50 (11) ◽  
pp. 659-664
Author(s):  
Akinobu TERAMOTO ◽  
Takashi ARATANI ◽  
Masaaki HIGUCHI ◽  
Eiji IKENAGA ◽  
Masaki HIRAYAMA ◽  
...  

1998 ◽  
Vol 508 ◽  
Author(s):  
A. Izumi ◽  
T. Ichise ◽  
H. Matsumura

AbstractSilicon nitride films prepared by low temperatures are widely applicable as gate insulator films of thin film transistors of liquid crystal displays. In this work, silicon nitride films are formed around 300 °C by deposition and direct nitridation methods in a catalytic chemical vapor deposition system. The properties of the silicon nitride films are investigated. It is found that, 1) the breakdown electric field is over 9MV/cm, 2) the surface state density is about 1011cm−2eV−1 are observed in the deposition films. These result shows the usefulness of the catalytic chemical vapor deposition silicon nitride films as gate insulator material for thin film transistors.


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