Supplemental Material: Shock-twinned zircon in ejecta from the 45-m-diameter Kamil crater in southern Egypt

AbstractElectron backscatter diffraction (EBSD) analysis of monazite requires a comparison of empirically collected electron backscatter patterns (EBSPs) with theoretical diffraction data, or ‘match units’, derived from known crystallographic parameters. Published crystallographic data derived from compositionally varying natural and synthetic monazite are used to calculate ten different match units for monazite. These match units are used to systematically index EBSPs obtained from four natural monazite samples with different compositions. Analyses of EBSD data, derived from the indexing of five and six diffraction bands using each of the ten match units for 10,000 EBSPs from each of the four samples, indicate a large variation in the ability of the different match units to correctly index the different natural samples. However, the use of match units derived from either synthetic Gd or Eu monazite crystallographic data yield good results for three of the four analysed monazites. Comparison of sample composition with published monazite compositions indicates that these match units are likely to yield good results for the EBSD analysis of metamorphic monazite. The results provide a clear strategy for optimizing the acquisition and analysis of EBSD data from monazite but also indicate the need for the collection of new crystallographic structure data and the subsequent generation of more appropriate match units for natural monazite.

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Surface treatment and electron backscatter diffraction (EBSD) analysis of the body-centered cubic phase in Mg-Li based alloys processed by severe plastic deformation

Micron ◽

10.1016/j.micron.2020.102914 ◽

2020 ◽

Vol 137 ◽

pp. 102914 ◽

Cited By ~ 1

Author(s):

Takahiro Mineta

Keyword(s):

Plastic Deformation ◽

Severe Plastic Deformation ◽

Surface Treatment ◽

Electron Backscatter Diffraction ◽

The Body ◽

Ebsd Analysis ◽

Cubic Phase ◽

Body Centered Cubic ◽

Electron Backscatter ◽

Backscatter Diffraction

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Identification and Quantification of Topologically Close Packed Phases (TCP) in Alloy 22 Using Electron Backscatter Diffraction (EBSD) Analysis

Microscopy and Microanalysis ◽

10.1017/s1431927604881339 ◽

2004 ◽

Vol 10 (S02) ◽

pp. 960-961 ◽

Cited By ~ 1

Author(s):

Bassem S El-Dasher ◽

Sharon G Torres ◽

Tammy S Summers

Keyword(s):

Electron Backscatter Diffraction ◽

Ebsd Analysis ◽

Topologically Close Packed ◽

Alloy 22 ◽

Electron Backscatter ◽

Backscatter Diffraction ◽

Identification And Quantification

Extended abstract of a paper presented at Microscopy and Microanalysis 2004 in Savannah, Georgia, USA, August 1–5, 2004.

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Supplemental Material: Shock-twinned zircon in ejecta from the 45-m-diameter Kamil crater in southern Egypt

10.1130/spe.s.14699793.v1 ◽

2021 ◽

Author(s):

Aaron Cavosie ◽

Luigi Folco

Keyword(s):

Electron Backscatter Diffraction ◽

Ebsd Analysis ◽

Electron Backscatter ◽

Backscatter Diffraction

Table S1: Electron backscatter diffraction (EBSD) analysis conditions<br>

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An Examination of the Composition and Microstructure of Coarse Intermetallic Particles in AA2099-T8, Including Li Detection

Microscopy and Microanalysis ◽

10.1017/s1431927618000454 ◽

2018 ◽

Vol 24 (4) ◽

pp. 325-341 ◽

Cited By ~ 8

Author(s):

Colin M. MacRae ◽

Anthony E. Hughes ◽

James S. Laird ◽

A. M. Glenn ◽

Nicholas C. Wilson ◽

...

Keyword(s):

Electron Probe ◽

Electron Backscatter Diffraction ◽

Ebsd Analysis ◽

Stored Energy ◽

Kernel Average Misorientation ◽

X Ray ◽

Energy Proton ◽

Intermetallic Particles ◽

Electron Backscatter ◽

Backscatter Diffraction

AbstractElectron and proton microprobes, along with electron backscatter diffraction (EBSD) analysis were used to study the microstructure of the contemporary Al–Cu–Li alloy AA2099-T8. In electron probe microanalysis, wavelength and energy dispersive X-ray spectrometry were used in parallel with soft X-ray emission spectroscopy (SXES) to characterize the microstructure of AA2099-T8. The electron microprobe was able to identify five unique compositions for constituent intermetallic (IM) particles containing combinations of Al, Cu, Fe, Mn, and Zn. A sixth IM type was found to be rich in Ti and B (suggesting TiB2), and a seventh IM type contained Si. EBSD patterns for the five constituent IM particles containing Al, Cu, Fe, Mn, and Zn indicated that they were isomorphous with four phases in the 2xxx series aluminium alloys including Al6(Fe, Mn), Al13(Fe, Mn)4 (two slightly different compositions), Al37Cu2Fe12 and Al7Cu2Fe. SXES revealed that Li was present in some constituent IM particles. Al SXES mapping revealed an Al-enriched (i.e., Cu, Li-depleted) zone in the grain boundary network. From the EBSD analysis, the kernel average misorientation map showed higher levels of localized misorientation in this region, suggesting greater deformation or stored energy. Proton-induced X-ray emission revealed banding of the TiB2 IM particles and Cu inter-band enrichment.

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Selectively Electron-Transparent Microstamping Toward Concurrent Digital Image Correlation and High-Angular Resolution Electron Backscatter Diffraction (EBSD) Analysis

Microscopy and Microanalysis ◽

10.1017/s1431927617012703 ◽

2017 ◽

Vol 23 (6) ◽

pp. 1091-1095 ◽

Cited By ~ 5

Author(s):

Timothy J. Ruggles ◽

Geoffrey F. Bomarito ◽

Andrew H. Cannon ◽

Jacob D. Hochhalter

Keyword(s):

Digital Image Correlation ◽

Digital Image ◽

Angular Resolution ◽

Electron Backscatter Diffraction ◽

Image Correlation ◽

Ebsd Analysis ◽

High Angular Resolution ◽

Resolution Electron ◽

Electron Backscatter ◽

Backscatter Diffraction

AbstractDigital image correlation (DIC) in a scanning electron microscope and high-angular resolution electron backscatter diffraction (HREBSD) provide valuable and complementary data concerning local deformation at the microscale. However, standard surface preparation techniques are mutually exclusive, which makes combining these techniques in situ impossible. This paper introduces a new method of applying surface patterning for DIC, namely a urethane microstamp, that provides a pattern with enough contrast for DIC at low accelerating voltages, but is virtually transparent at the higher voltages necessary for HREBSD and conventional EBSD analysis. Furthermore, microstamping is inexpensive and repeatable, and is more suitable to the analysis of patterns from complex surface geometries and larger surface areas than other patterning techniques.

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