WEAK LOCALIZATION AND ELECTRON–ELECTRON INTERACTION EFFECTS IN THIN METAL WIRES AND FILMS

2010 ◽  
Vol 24 (12n13) ◽  
pp. 2053-2071
Author(s):  
N. Giordano

A brief and selective review of experimental studies of electrical conduction in thin metal wires and films at low temperatures is given. This review will illustrate the importance of various length scales and of dimensionality in determining the properties disordered metals. A few intriguing and still unresolved experimental findings are also mentioned.

2000 ◽  
Vol 636 ◽  
Author(s):  
Douglas Natelson ◽  
Robert L. Willett ◽  
Kenneth W. West ◽  
Loren N. Pfeiffer

AbstractWe report weak localization studies of quantum coherence in metal nanowires with widths as small as 5 nm, demonstrating that structures fabricated at sub-50 nm length scales can reveal coherence phenomena not accessible in larger devices. Through selective etching of cleaved molecular-beam epitaxy (MBE)-grown substrates, we produce precise nanoscale surface relief then used as a stencil for metal deposition. This nonlithographic method of lateral definition allows the fabrication of metal (AuPd) nanowires greater than one micron in length with widths below 5 nm, a previously unexplored size regime in studies of quantum corrections to the conductance of disordered metals. Analyzing magnetoresistance data, we find that the coherence time, Tφ, shows a low temperature T dependence close to quasi-1D theoretical expectations (Tφ ∼ T-2/3 in 5 nm wide wires, while exhibiting a relative saturation as T 0 for wide samples of the same material. Since an externally controlled parameter, the sample geometry, can cause a single material to exhibit both suppression and divergence ofTφ, this finding provides a new constraint on models of dephasing phenomena.


1983 ◽  
Vol 61 (7) ◽  
pp. 979-980
Author(s):  
Neeraj Jain ◽  
Ramji Srivastava

General expressions for the temperature coefficient of resistivity (TCR) of thin metal wires have been derived by incorporating the thermal expansion of the wire diameter and the wire-to-substrate expansion mismatch. A possibility of transition to nonmetallic behaviour is predicted at low temperatures.


Author(s):  
Ieuan Evans ◽  
Jon Heron ◽  
Joseph Murray ◽  
Matthew Hickman ◽  
Gemma Hammerton

Experimental studies support the conventional belief that people behave more aggressively whilst under the influence of alcohol. To examine how these experimental findings manifest in real life situations, this study uses a method for estimating evidence for causality with observational data—‘situational decomposition’ to examine the association between alcohol consumption and crime in young adults from the Avon Longitudinal Study of Parents and Children. Self-report questionnaires were completed at age 24 years to assess typical alcohol consumption and frequency, participation in fighting, shoplifting and vandalism in the previous year, and whether these crimes were committed under the influence of alcohol. Situational decomposition compares the strength of two associations, (1) the total association between alcohol consumption and crime (sober or intoxicated) versus (2) the association between alcohol consumption and crime committed while sober. There was an association between typical alcohol consumption and total crime for fighting [OR (95% CI): 1.47 (1.29, 1.67)], shoplifting [OR (95% CI): 1.25 (1.12, 1.40)], and vandalism [OR (95% CI): 1.33 (1.12, 1.57)]. The associations for both fighting and shoplifting had a small causal component (with the association for sober crime slightly smaller than the association for total crime). However, the association for vandalism had a larger causal component.


2014 ◽  
Vol 551 ◽  
pp. 195-199 ◽  
Author(s):  
Bunju Shinozaki ◽  
Kazuya Hidaka ◽  
Syouhei Ezaki ◽  
Kazumasa Makise ◽  
Takayuki Asano ◽  
...  

2004 ◽  
Vol 854 ◽  
Author(s):  
Stéphanie P. Lacour ◽  
Sigurd Wagner

ABSTRACTWe have previously shown that 25nm thick gold stripes on 1mm thick silicone membrane retain electrical conduction when stretched up to 100% along their long dimension. To function as electrical interconnects in conformable integrated circuits, the metallization must be stretchable in arbitrary directions. Therefore we have made and tested the mechanical and electrical properties of complex conductor patterns including X and Y oriented lines and cross junctions. We find that the metal patterns continue to conduct under uniaxial stretching in the X or Y direction and under radial, biaxial stretching.


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