The effect of strain rates on tensile deformation of ultrafine-grained copper
Tensile deformation behavior of ultrafine-grained (UFG) copper processed by accumulative roll-bonding (ARB) was studied under different strain rates at room temperature. It was found that the UFG copper under the strain rate of 10[Formula: see text] s[Formula: see text] led to a higher strength (higher flow stress level), flow stability (higher stress hardening rate) and fracture elongation. In the fracture surface of the sample appeared a large number of cleavage steps under the strain rate of 10[Formula: see text] s[Formula: see text], indicating a typical brittle fracture mode. When the strain rate is 10[Formula: see text] or 10[Formula: see text] s[Formula: see text], a great amount of dimples with few cleavage steps were observed, showing a transition from brittle to plastic deformation with increasing strain rate.