High Stable and Low Power 8T CNTFET SRAM Cell

2019 ◽  
Vol 29 (05) ◽  
pp. 2050080
Author(s):  
M. Elangovan ◽  
K. Gunavathi

Designing of Complementary Metal Oxide Semiconductor (CMOS) technology based VLSI circuits in deep submicron range includes many challenges like tremendous increase of leakage power. Design is also easily affected by process variation. The Carbon NanoTube Field Effect Transistor (CNTFET) is an alternative for Metal Oxide Semiconductor Field Effect Transistor (MOSFET) for nanoscale range VLSI circuits design. CNTFET offers best performance than MOSFET. It has high stability and consumes least power. Static Random Access Memory (SRAM) cells play a vital role in cache memory in most of the electronic circuits. In this paper, we have proposed a high stable and low power CNTFET based 8Transistor (8T) SRAM cell. The performance of proposed 8T SRAM cells for nominal chiral value (all CNTFET with [Formula: see text], [Formula: see text]) and Dual chiral value (NCNTFET with [Formula: see text], [Formula: see text] and PCNTFET [Formula: see text], [Formula: see text]) is compared with that of conventional 6T and 8T cells. From the simulation results, it is noted that the proposed structure consumes less power than conventional 6T and 8T cells during read/write operations and gives higher stability during write and hold modes. It consumes higher power than conventional 6T and 8T cells during hold mode and provides lower stability in read mode due to direct contact of bit lines with storage nodes. A comparative analysis of proposed and conventional 8T MOSFET SRAM has been done and the SRAM parameters are tabulated. The simulation is carried out using Stanford University 32[Formula: see text]nm CNTFET model in HSPICE simulation tool.

2021 ◽  
Author(s):  
Kamal Y. Kamal ◽  
Radu Muresan ◽  
Arafat Al-Dweik

<p>This article reviews complementary metal-oxide-semiconductor (CMOS) based physically unclonable functions (PUFs) in terms of types, structures, metrics, and challenges. The article reviews and classifies the most basic PUF types. The article reviews the basic variations originated during a metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process. Random <a>variations</a> at transistor level lead to acquiring unique properties for electronic chips. These variations help a PUF system to generate a unique response. This article discusses various concepts which allow for more variations at CMOS technology, layout, masking, and design levels. It also discusses various PUF related topics.</p>


2021 ◽  
Author(s):  
Kamal Y. Kamal ◽  
Radu Muresan ◽  
Arafat Al-Dweik

<p>This article reviews complementary metal-oxide-semiconductor (CMOS) based physically unclonable functions (PUFs) in terms of types, structures, metrics, and challenges. The article reviews and classifies the most basic PUF types. The article reviews the basic variations originated during a metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process. Random <a>variations</a> at transistor level lead to acquiring unique properties for electronic chips. These variations help a PUF system to generate a unique response. This article discusses various concepts which allow for more variations at CMOS technology, layout, masking, and design levels. It also discusses various PUF related topics.</p>


2019 ◽  
Vol 56 ◽  
pp. 71-79 ◽  
Author(s):  
S. Darwin ◽  
T.S. Arun Samuel

This paper describes the analytical modeling and simulation of Triple Material Double Gate Metal Oxide Semiconductor Field Effect Transistor (TMDG MOSFET) with no junctions. Three kind of gate materials with different work function values over the channel helps to improve the ON current and to form a barrier in the channel helps to reduce OFF current. It has been found from the obtained results that the OFF current or leakage current of the device is exactly low (IOFF =10-11 A) which is fit for low power applications. Also, the extracted value of ION current (10-3 A) has proved that there is a remarkable improvement with decreasing device dimensions. The overall gate length (L), work functions of gate materials, oxide thickness (tox), silicon thickness (tsi) and doping concentration (Nd) are optimized at 60nm, 4.8eV, 4.6eV, 4.4eV, 1nm, 10nm and 1019 cm-3 respectively. The 2-D Poisson equation has been solved by using parabolic approximation technique to obtain the potential distribution function in the channel. Based on this expression, analytical models of the lateral electric field, subthreshold slope and drain current for Junctionless Triple Material Double Gate Metal oxide semiconductor Field Effect Transistor (JL TMDG MOSFET) were derived. Finally, the validity of the proposed analytical model is compared with numerical solution simulation data results which are obtained by using TCAD device simulator.


1987 ◽  
Vol 65 (8) ◽  
pp. 995-998
Author(s):  
N. G. Tarr

It is shown that the accuracy of the charge-sheet model for the long-channel metal-oxide-semiconductor field-effect transistor can be improved by allowing for the small potential drop across the inversion layer, and by using a more accurate analytic approximation for the charge stored in the depletion region.


Sign in / Sign up

Export Citation Format

Share Document