scholarly journals Control of Wettability Using Regularly Ordered Two-Dimensional Polymeric Wavy Substrates

NANO ◽  
2018 ◽  
Vol 13 (10) ◽  
pp. 1850120
Author(s):  
Dong Kee Yi

Two-dimensional poly(dimethylsiloxane) (PDMS) films with wavy patterns were studied in order to investigate reversible and irreversible wetting effects. Pre-strained, surface oxidized layers of PDMS were used to form relieved wavy geometries, on which hydrophobic functionalization was carried out in order to produce irreversible wetting effects. Wavy-patterned PDMS films showed time-dependent reversible wetting effects. The degree of surface wettability could be tuned by the choice of wavy groove geometries. And the groove geometries were controlled via O2 plasma treatment and mechanical pre-straining. The pre-strained, buckled PDMS films were applied to the fabrication of hydrophobic polystyrene nano-patterns using colloidal self-assembly, where the colloids were arrayed in two-dimensional way. The wavy polystyrene films were found to be more hydrophobic relative to flat polystyrene films. The grooving methodology used in this study could be applied to enhancing the hydrophobicity of other types of polymeric thin films, eliminating the need for chemical treatment.

2014 ◽  
Vol 558 ◽  
pp. 200-207 ◽  
Author(s):  
Sang Ho Lee ◽  
Andrew C. Jamison ◽  
David M. Hoffman ◽  
Allan J. Jacobson ◽  
T. Randall Lee

2002 ◽  
pp. 1094-1095 ◽  
Author(s):  
Takashi Matsui ◽  
Akane Yamaguchi ◽  
Yuko Takeoka ◽  
Masahiro Rikukawa ◽  
Kohei Sanui

2019 ◽  
Vol 6 (3) ◽  
pp. 507-514 ◽  
Author(s):  
Shunpu Li ◽  
Young Tea Chun ◽  
Jin Li ◽  
Pawan Shrestha ◽  
Hyungju Ahn ◽  
...  

Self-assembly of patterned nanostructures in solution-processed thin films with single phase polymers is successful.


RSC Advances ◽  
2015 ◽  
Vol 5 (7) ◽  
pp. 4780-4787 ◽  
Author(s):  
Seyed Mohammad Mirkhalaf Valashani ◽  
Christopher J. Barrett ◽  
Francois Barthelat

Self-assembly of highly regular micron-sized platelets opens new pathways for the development of novel biomimetic materials, protective coatings, flexible electronics, and tunable optical devices.


2003 ◽  
Vol 137 (1-3) ◽  
pp. 931-932 ◽  
Author(s):  
Y. Nishiwaki ◽  
Y. Takeoka ◽  
M. Rikukawa ◽  
K. Sanui

2019 ◽  
Vol 2019 ◽  
pp. 1-7 ◽  
Author(s):  
Mei Gao ◽  
Xinwei Wang ◽  
Yuanze Hong ◽  
Yongji Shi ◽  
Dengkui Wang ◽  
...  

Two-dimensional thin tellurene (Te) was effectively synthesized by a one-pot hydrothermal reduction process. It had the hexagonal phase with good crystallization, the extent of radiation absorption (400-850 nm), and a 1.37 eV band gap. Based on the evolution of the crystal structure and morphology, the formation mechanism of Te nanomaterials has been speculated by the time-dependent reactions as the nucleation of nanosized clusters first, then self-assembly into uniform nanowires, and, finally, formation into the nanosheets in the presence of polyvinylpyrrolidone (PVP). It is expected that thin Te nanosheets can further be used in the field of photoelectric applications.


2018 ◽  
Vol 8 (1) ◽  
Author(s):  
Garam Park ◽  
In-Hwan Oh ◽  
J. M. Sungil Park ◽  
Jinyong Jung ◽  
Chun-Yeol You ◽  
...  

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.


2007 ◽  
Vol 2 (2) ◽  
pp. 257-264
Author(s):  
Satoko Nishiyama ◽  
Masahiro Tajima ◽  
Yasuhiko Yoshida

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