ABSTRACTThe polylmide synthesized from benzophenonetetracarboxylic dianhydride and alkyl-substituted diamines is inherently photosensitive at ≤365 nm, and a solvent soluble, negative-acting system can be formulated from the fully-imidized resin. The lithographic, thermal, mechanical, and electrical properties of the polyimide films have been characterized. This polyimide film shows good thermal, mechanical, and electrical properties, and a 1:1 aspect ratio is consistently achieved on 10 μm thick films. The thermal properties of the films were determined using TGA and TMA methods. The decomposition temperature was 527°C, the weight loss of the cured film at 350°C in nitrogen was 0.04 %/hour and the thermal expansion coefficient was 37 ppm/°C. The dielectric constant and dissipation factor of the film were 3.0 and 0.003 respectively at 4% humidity. The effects of hard-bake time, hard-bake temperature, nitrogen purge rate during heat treatment, and humidity on the thermal and electrical properties of the thin film were also examined, and are presented here. The rate of weight loss of the cured film increases when the rate of nitrogen purge decreases or when the cure temperature increases. Longer heat treatments resulted in a slight decrease in the CTE and an Increase in the Tg. The electrical properties of the films are dependent both on the humidity during measurement and on the hard-bake temperature.
Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structures
