scholarly journals MoO3 Nanobelts Embedded Polypyrrole/SIS Copolymer Blends for Improved Electro-Mechanical Dual Applications

Polymers ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 353 ◽  
Author(s):  
Arslan Umer ◽  
Faroha Liaqat ◽  
Azhar Mahmood

This research endeavor aimed to develop thin film blends of polypyrrole (PPy) and poly (styrene-isoprene-styrene) (SIS) with MoO3 as a nanofiller for improved mechanical and electrical properties to widen its scope in the field of mechatronics. This study reports blends of polypyrrole (PPy) and poly (styrene-isoprene-styrene) (SIS) tri-block copolymer showing improved mechanical and electrical attributes while employing MoO3 nanobelts as nanofillers that additionally improves the abovementioned properties in the ensuing nanocomposites. The synthesis of PPy/SIS blends and MoO3/PPy/SIS nanocomposites was well corroborated with XRD, SEM, FTIR, and EDS analysis. Successful blending of PPy was yielded up to 15 w/w% PPy in SIS, as beyond this self-agglomeration of PPy was observed. The results showed a remarkable increase in the conductivity of insulating SIS copolymer from 1.5 × 10−6.1 to 0.343 Scm−1 and tensile strength up to 8.5 MPa with the 15 w/w% PPy/SIS blend. A further enhancement of the properties was recorded by embedding MoO3 nanobelts with varying concentrations of the nanofillers into 15 w/w% PPy/SIS blends. The mechanical strength of the polymeric nanocomposites was enhanced up to 11.4 MPa with an increase in conductivity up to 1.51 Scm−1 for 3 w/w% MoO3/PPy-SIS blends. The resultant product exhibited good potential for electro-mechanical dual applications.

Author(s):  
Bluma G. Soares ◽  
Katia M. N. Gamboa ◽  
Angelo J. B. Ferreira ◽  
Edson Ueti ◽  
Sergio S. Camargo

2001 ◽  
Vol 40 (Part 1, No. 9A) ◽  
pp. 5382-5388 ◽  
Author(s):  
Yongdong Liu ◽  
Seiichi Hata ◽  
Kouichi Wada ◽  
Akira Shimokohbe

2013 ◽  
Vol 86 (1) ◽  
pp. 68-85 ◽  
Author(s):  
K. C. Yong

ABSTRACT The electron beam irradiation technique was successfully used to cross-link poly(butadiene-co-acrylonitrile)-polyaniline dodecylbenzenesulfonate [NBR-PAni.DBSA] blends. Significant increase in cross-linking densities of all blends with doses of irradiation (up to 200 kGy) was observed, and a reasonably high cross-linking density level (in the order of 1030 m−3) also was achieved. All electron beam–irradiated NBR-PAni.DBSA blends exhibited good tensile properties (with tensile strength up to ∼20 MPa), with values that are comparable to those of similar blends cross-linked with either conventional sulfur or peroxide techniques. This kind of irradiation-induced cross-linking technique (at doses up to 200 kGy) also did not interrupt the blends' electrical properties after the blends were sufficiently stabilized for at least 24 h. The irradiated NBR-PAni.DBSA blends also possessed good electrical properties, that is, a single conductivity percolation threshold and high conductivities up to the order of 10−2 S.cm−1. All of these findings indicate a good potential for using the electron beam irradiation technique to prepare highly cross-linked, electrically conductive NBR-PAni.DBSA blends.


Author(s):  
Naokazu Murata ◽  
Naoki Saito ◽  
Kinji Tamakawa ◽  
Ken Suzuki ◽  
Hideo Miura

Both mechanical and electrical properties of electroplated copper thin films were investigated experimentally with respect to changes in their micro texture. Clear recrystallization was observed after the annealing even at low temperature of about 150°C. The fracture strain of the film annealed at 400°C increased from the initial value of about 3% to 15%, and at the same time, the yield stress of the annealed film decreased from about 270 MPa to 90 MPa. In addition, it was found that there were two fatigue fracture modes in the film annealed at the temperatures lower than 200°C. One was a typical ductile fracture mode with plastic deformation and the other was brittle one. When the brittle fracture occurred, the crack propagated along weak or porous grain boundaries which remained in the film after electroplating. The brittle fracture mode disappeared after the annealing at 400°C. These results clearly indicated that the mechanical properties of electroplated copper thin films vary drastically depending on their micro texture. Next, the electrical reliability of electroplated copper thin film interconnections was discussed. The interconnections used for electromigration (EM) tests were made by damascene process. The width of the interconnections was varied from 1 μm to 10 μm. An abrupt fracture mode due to local fusion appeared in the as-electroplated films within a few hours during the test. Since the fracture rate increased linearly with the increase of square of the applied current density, this fracture mode was dominated by local Joule heating. It seemed that the local resistance of the film increased due to the porous grain boundaries and thus, the local temperature around the porous grain boundaries increased drastically. On the other hand, the life of the interconnections annealed at 400°C was improved significantly. This was because of the increase of the average grain size and the improvement of the quality of grain boundaries in the annealed films. The electrical properties of the electroplated copper films were also dominated by their micro texture. However, the stress migration occurred in the interconnections after the annealing at 400°C. This was because of the high residual tensile stress caused by the constraint of the densification of the films by the surrounding oxide film in the interconnection structures during the annealing. Finally, electroplating condition was controlled to improve the electrical properties. Both the resistance of electromigration and electrical resistivity were improved significantly. However, electromigration of copper atoms still occurred at the interface between the electroplated copper and the thin tantalum (Ta) layer sputtered as base material. Therefore, it is very important to control the crystallographic quality of electroplated copper films and the interface between different materials for improving the reliability of thin film interconnections.


2011 ◽  
Vol 236-238 ◽  
pp. 1453-1456 ◽  
Author(s):  
Mei Yun Zhang ◽  
Rui Huang ◽  
Zhao Qing Lu ◽  
Bin Yang ◽  
Tao Li

The beating characteristic of PPTA fiber and its influence on the performance of paper-based functional materials based on PPTA fiber and resin has been investigated in this study. The results show that the morphology of PPTA-pulp had significant influences on the mechanical and electrical properties of the composites. The sample contained with PPTA fiber of 35 °SR showed the increase in tensile strength, tearing strength and dielectric strength by 147.7%, 119.3% and 69.9% as compared with the untreated PPTA fiber.


2008 ◽  
Vol 589 ◽  
pp. 179-184 ◽  
Author(s):  
László Valenta ◽  
Attila Bojtos

Silicone rubber is an essential construction material in food industry, medicine and in some fields of mechanical engineering, because it has good mechanical, electrical, biological and other special properties. One needs to know these material properties in order to develop silicone sensors. We performed several standard measurements for rubber, like tensile strength, cyclic tensile, bending, fatiguing, stress relaxation tests etc. To investigate the electrical properties, we measured the resistance of silicone during the mechanical tests. The paper summarizes the newest results of our research in connection with mechanical and electrical properties of conductive silicone rubber.


Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3325
Author(s):  
Paweł Smoleń ◽  
Tomasz Czujko ◽  
Zenon Komorek ◽  
Dominik Grochala ◽  
Anna Rutkowska ◽  
...  

This paper investigates the effect of multiwalled carbon nanotubes on the mechanical and electrical properties of epoxy resins and epoxy composites. The research concerns multiwalled carbon nanotubes obtained by catalytic chemical vapor deposition, subjected to purification processes and covalent functionalization by depositing functional groups on their surfaces. The study included the analysis of the change in DC resistivity, tensile strength, strain, and Young’s modulus with the addition of carbon nanotubes in the range of 0 to 2.5 wt.%. The effect of agents intended to increase the affinity of the nanomaterial to the polymer on the aforementioned properties was also investigated. The addition of functionalized multiwalled carbon nanotubes allowed us to obtain electrically conductive materials. For all materials, the percolation threshold was obtained with 1% addition of multiwalled carbon nanotubes, and filling the polymer with a higher content of carbon nanotubes increased its conductivity. The use of carbon nanotubes as polymer reinforcement allows higher values of tensile strength and a higher strain percentage to be achieved. In contrast, Young’s modulus values did not increase significantly, and higher nanofiller percentages resulted in a drastic decrease in the values of the abovementioned properties.


2010 ◽  
Vol 43 (6) ◽  
pp. 2880-2889 ◽  
Author(s):  
Chuanbing Tang ◽  
Su-mi Hur ◽  
Brian C. Stahl ◽  
Kulandaivelu Sivanandan ◽  
Michael Dimitriou ◽  
...  

2007 ◽  
Vol 40 (13) ◽  
pp. 4578-4585 ◽  
Author(s):  
Mohit Singh ◽  
Omolola Odusanya ◽  
Gregg M. Wilmes ◽  
Hany B. Eitouni ◽  
Enrique D. Gomez ◽  
...  

2007 ◽  
Vol 334-335 ◽  
pp. 769-772 ◽  
Author(s):  
Ming Chuen Yip ◽  
Hung Yuan Wu

Carbon nanotubes have excellent mechanical and electrical properties such as high stiffness, light weight, heat stability, excellent heat conductivity, and excellent electrical conductivity. This study was aimed into investigate the properties of composites consisting of adding several different proportions of carbon nanotubes to phenolic resin, which contained tensile strength, fatigue life and electrical properties. The experimental results showed that the electric resistance decreases as the weight percentage of the nanotubes increases, also the tensile strength increased as the nanotubes increased. After the different moisture-temperature circumstances and thermal cycling, the increase of the electric resistance was compared to the pristine composites. The experimental results hoped to be understood from the fracture surface observations by scanning electron microscope (SEM).


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