Growth of a Large GaN Single Crystal Using the Liquid Phase Epitaxy (LPE) Technique

2003 ◽  
Vol 42 (Part 2, No.1A/B) ◽  
pp. L4-L6 ◽  
Author(s):  
Fumio Kawamura ◽  
Tomoya Iwahashi ◽  
Kunimichi Omae ◽  
Masanori Morishita ◽  
Masashi Yoshimura ◽  
...  
2011 ◽  
Vol 47 (9) ◽  
pp. 979-982 ◽  
Author(s):  
E. A. Volkova ◽  
D. A. Ksenofontov ◽  
V. V. Maltsev ◽  
N. I. Leonyuk ◽  
Yu. K. Kabalov ◽  
...  

1994 ◽  
Vol 161 (1) ◽  
pp. 141-146
Author(s):  
Hiroshi Komada ◽  
Kazuhiro Saito ◽  
Kay Kohn ◽  
Midori Tanaka ◽  
Kiiti Siratori ◽  
...  

1985 ◽  
Vol 63 (6) ◽  
pp. 753-756
Author(s):  
K. B. Sundaram ◽  
N. Dalacu ◽  
B. K. Garside

Pb0.92Sn0.08Te layers have been grown by hot-wall and liquid-phase epitaxy techniques. In the hot-wall epitaxy case, layers are grown on BaF2 and Pb0.92Sn0.08Te single-crystal substrates, while in the case of liquid-phase epitaxy, single crystals of PbTe and Pb0.92Sn0.08Te are used. In both cases x-ray Laue diffraction studies indicated the growth of good quality epilayers suitable for device fabrication.


1985 ◽  
Vol 54 ◽  
Author(s):  
E. Bauser ◽  
D. KÄss ◽  
M. Warth ◽  
H. P. Strunk

ABSTRACTSingle-crystal silicon layers and doping multilayers have been grown by liquid phase qpitaxy on silicon substrates. The substrates were either partially masked by SiO2, with via holes of various shapes and sizes, or patterned with SiO2 stripes, or profiled with grooves and ridges. The via holes and grooves were just refilled, or they acted as seeding areas for lateral overgrowth of the oxidized wafer up to 100μm. The silicon layers, interfaces and heterointerfaces were free of defects. With appropriate growth conditions the surfaces and interfaces of the epitaxial Si were outstandingly planar.


1983 ◽  
Vol 23 ◽  
Author(s):  
R. T. Tung ◽  
J. M. Gibson ◽  
D. C. Jacobson ◽  
J. M. Poate

ABSTRACTEpitaxial Ni and Co silicides have been fabricated using pulsed laser melting. Interfacial instabilities and cell formation are suppressed during the liquid-phase epitaxy by melting mono or disilicide layers. Single crystal NiSi2 and CoSi2 films have been grown on (100) and (111) Si following a post-anneal. This method does not require UHV deposition or reaction techniques.


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