Novel Low-Power DC–DC Converter Using High-Efficiency Charge Pump Circuits for Flat Panel Displays

2005 ◽  
Vol 44 (12) ◽  
pp. 8427-8431 ◽  
Author(s):  
Hong Jae Shin ◽  
Kae Dal Kwack ◽  
Tae Whan Kim
2002 ◽  
Vol 40 (4) ◽  
pp. 546 ◽  
Author(s):  
Lee Dong-Uk ◽  
Kwon Oh-Kyong ◽  
Lee Inhwan

Author(s):  
Hongfei Shi ◽  
Zhibin Wang ◽  
Huanyu Ma ◽  
Haoran Jia ◽  
Fuzhi Wang ◽  
...  

Metal halide perovskite light-emitting diodes (PeLEDs) is a new type of electroluminescent device with wide application in flat-panel displays and solid-state lighting. The charge recombination at the electrode interfaces and...


Reflective twisted nematic liquid crystal displays have gained very wide user acceptance in consumer and professional applications. They are compact flat-panel displays with a very low power consumption, which modulate ambient light and as a result have very good legibility in a wide range of illumination conditions. There is a need for such low-power flat-panel displays with high information content as data displays for portable equipment. A number of problems must be overcome if twisted nematic displays are to be made complex enough for these applications. The most important factor determining the number of display elements that can be addressed is the viability of matrix-addressing techniques. This paper explores the limits in the number of lines that can be addressed for a display operating in reflexion.


2010 ◽  
Vol 31 (1) ◽  
pp. 015009 ◽  
Author(s):  
Feng Peng ◽  
Li Yunlong ◽  
Wu Nanjian

Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 676
Author(s):  
Labonnah Farzana Rahman ◽  
Mohammad Marufuzzaman ◽  
Lubna Alam ◽  
Mazlin Bin Mokhtar

Applications such as non-volatile memories (NVM), radio frequency identification (RFID), high voltage generators, switched capacitor circuits, operational amplifiers, voltage regulators, and DC–DC converters employ charge pump (CP) circuits as they can generate a higher output voltage from the very low supply voltage. Besides, continuous power supply reduction, low implementation cost, and high efficiency can be managed using CP circuits in low-power applications in the complementary metal-oxide-semiconductor (CMOS) process. This study aims to figure out the most widely used CP design topologies for embedded systems on the chip (SoC). Design methods have evolved from diode-connected structures to dynamic clock voltage scaling charge pumps have been discussed in this research. Based on the different architecture, operating principles and optimization techniques with their advantages and disadvantages have compared with the final output. Researchers mainly focused on designing the charge pump topologies based on input/output voltage, pumping efficiency, power dissipation, charge transfer capability, design complexity, pumping capacitor, clock frequencies with a minimum load balance, etc. Finally, this review study summarizes with the discussion on the outline of appropriate schemes and recommendations to future researchers in selecting the most suitable CP design methods for low power applications.


Electronics ◽  
2018 ◽  
Vol 8 (1) ◽  
pp. 14
Author(s):  
Hai Deng ◽  
Guoqiang Li

A high-efficiency low-power chip-based liquid crystal (LC) driver has been successfully designed and implemented for adaptive electro-optic eyewear including tunable vision correction devices (eyeglass, contact lens, intraocular lens, occluder, and prism), phoropter, iris, head-mounted display, and 3D imaging. The driver can generate a 1 kHz bipolar square wave with magnitude tunable from 0 V to 15 V to change the lens focus adaptively. The LC driver output magnitude is controlled by a reference DC voltage that is manually tunable between 0 and 3 V. A multi-mode 1×/2×/3×/4×/5× charge pump is developed for DC-DC conversion to expand the output range with a fast-sink function implemented to regulate the charge pump output. In addition, a new four-phase H-bridge driving scheme is employed to improve the DC/AC inverter efficiency. The LC driver has been successfully implemented and tested as an IC chip (8.6 mm × 8.6 mm) using AMS 0.18 μm High-Voltage CMOS technology.


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