Copper Filling of Deep Sub-µm Through-Holes by High-Vacuum Planar Magnetron Sputtering Using Argon Gas with Added Nitrogen: Optimum Quantity of Nitrogen in Argon Gas
2006 ◽
Vol 45
(2A)
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pp. 736-738
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2009 ◽
Vol 256
(4)
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pp. 1240-1243
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1993 ◽
Vol 32
(Part 1, No. 2)
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pp. 902-906
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2012 ◽
Vol 51
◽
pp. 025701
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2012 ◽
Vol 51
(2R)
◽
pp. 025701
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2015 ◽
Vol 33
(6)
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pp. 063001
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2003 ◽
Vol 21
(3)
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pp. 572-576
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