Galvanic Corrosion Control in Chemical Mechanical Polishing of Cu Interconnects with Ruthenium Barrier Metal Film

Japanese Journal of Applied Physics ◽

10.1143/jjap.48.04c022 ◽

2009 ◽

Vol 48 (4) ◽

pp. 04C022 ◽

Author(s):

Koji Maruyama ◽

Morio Shiohara ◽

Kouji Yamada ◽

Seiichi Kondo ◽

Shuichi Saito

Keyword(s):

Chemical Mechanical Polishing ◽

Galvanic Corrosion ◽

Mechanical Polishing ◽

Corrosion Control ◽

Cu Interconnects ◽

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Galvanic Corrosion Control during Cu Chemical Mechanical Polishing of Cu Interconnects that Contain Ruthenium Barrier Metal Film

10.7567/ssdm.2008.c-10-1 ◽

2008 ◽

Author(s):

K. Maruyama ◽

M. Shiohara ◽

K. Yamada ◽

S. Kondo ◽

S. Saito

Keyword(s):

Chemical Mechanical Polishing ◽

Galvanic Corrosion ◽

Mechanical Polishing ◽

Corrosion Control ◽

Cu Interconnects ◽

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Development of the post-chemical mechanical polishing cleaner suppressing galvanic corrosion between copper and the Co barrier metal

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017264 ◽

2014 ◽

Author(s):

Tomohiro Kusano ◽

Toshiaki Shibata ◽

Atsushi Itou ◽

Fumikazu Mizutani

Keyword(s):

Chemical Mechanical Polishing ◽

Galvanic Corrosion ◽

Mechanical Polishing ◽

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Damageless Cu chemical mechanical polishing for porous SiOC/Cu interconnects

Microelectronic Engineering ◽

10.1016/j.mee.2007.05.036 ◽

2007 ◽

Vol 84 (11) ◽

pp. 2615-2619 ◽

Author(s):

Seiichi Kondo ◽

Kouichi Fukaya ◽

Kouji Yamada ◽

Tadakazu Miyazaki ◽

Masahisa Fujita ◽

...

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Cu Interconnects

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Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_6 ◽

2017 ◽

pp. 107-119 ◽

Author(s):

Jie Cheng

Keyword(s):

Chemical Mechanical Polishing ◽

Corrosion Inhibitors ◽

Galvanic Corrosion ◽

Mechanical Polishing

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Fundamental Study of Chemical–Mechanical Polishing Slurry of Cobalt Barrier Metal for the Next-Generation Interconnect Process

Japanese Journal of Applied Physics ◽

10.1143/jjap.49.05fc03 ◽

2010 ◽

Vol 49 (5) ◽

pp. 05FC03 ◽

Author(s):

Hideaki Nishizawa ◽

Haruki Nojo ◽

Akira Isobe

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Next Generation ◽

Fundamental Study ◽

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Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017282 ◽

2014 ◽

Author(s):

Liang Jiang ◽

Yongyong He ◽

Xinchun Lu ◽

Jianbin Luo

Keyword(s):

Barrier Layer ◽

Chemical Mechanical Polishing ◽

Galvanic Corrosion ◽

Mechanical Polishing

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Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing

Japanese Journal of Applied Physics ◽

10.1143/jjap.39.6216 ◽

2000 ◽

Vol 39 (Part 1, No. 11) ◽

pp. 6216-6222 ◽

Author(s):

Seiichi Kondo ◽

Noriyuki Sakuma ◽

Yoshio Homma ◽

Naofumi Ohashi

Keyword(s):

Chemical Mechanical Polishing ◽

Galvanic Corrosion ◽

Mechanical Polishing ◽

Chemical Corrosion

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Chemical Mechanical Polishing and Planarization of Mn-Based Barrier/Ru Liner Films in Cu Interconnects for Advanced Metallization Nodes

ECS Journal of Solid State Science and Technology ◽

10.1149/2.0161705jss ◽

2017 ◽

Vol 6 (5) ◽

pp. P259-P264 ◽

Author(s):

K. V. Sagi ◽

L. G. Teugels ◽

M. H. van der Veen ◽

Herbert Struyf ◽

S. V. Babu

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Cu Interconnects

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Barrier Metal Slurry for Low Defect Copper Damascene Chemical Mechanical Polishing

ECS Transactions ◽

10.1149/06440.0085ecst ◽

2015 ◽

Vol 64 (40) ◽

pp. 85-90 ◽

Author(s):

H. Kim ◽

K. Seo ◽

J. Moon ◽

H. Kim ◽

H. Hwang

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

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Defectless Monolithic Low-k/Cu Interconnects Produced by Chemically Controlled Chemical Mechanical Polishing Process withIn situEnd-Point-Detection Technique

Japanese Journal of Applied Physics ◽

10.1143/jjap.48.04c029 ◽

2009 ◽

Vol 48 (4) ◽

pp. 04C029 ◽

Author(s):

Makoto Ueki ◽

Takahiro Onodera ◽

Akira Ishikawa ◽

Susumu Hoshino ◽

Yoshihiro Hayashi

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Detection Technique ◽

Polishing Process ◽

Cu Interconnects ◽

Chemical Mechanical Polishing Process ◽

Point Detection ◽

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