Defectless Monolithic Low-k/Cu Interconnects Produced by Chemically Controlled Chemical Mechanical Polishing Process withIn situEnd-Point-Detection Technique

2009 ◽  
Vol 48 (4) ◽  
pp. 04C029 ◽  
Author(s):  
Makoto Ueki ◽  
Takahiro Onodera ◽  
Akira Ishikawa ◽  
Susumu Hoshino ◽  
Yoshihiro Hayashi
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Detection Technique ◽  
Polishing Process ◽  
Cu Interconnects ◽  
Chemical Mechanical Polishing Process ◽  
Point Detection ◽  
Low K

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions

2006 ◽  
Vol 46 (9-11) ◽  
pp. 1679-1684 ◽  
Author(s):  
C. Yuan ◽  
W.D. van Driel ◽  
R. van Silfhout ◽  
O. van der Sluis ◽  
R.A.B. Engelen ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Process Conditions ◽  
Polishing Process ◽  
Chemical Mechanical Polishing Process ◽  
Low K

Ultrafiltration based on various polymeric membranes for recovery of spent tungsten slurry for reuse in chemical mechanical polishing process

2018 ◽  
Vol 548 ◽  
pp. 232-238 ◽  
Author(s):  
Nur Fatin Amalina Muhammad Sanusi ◽  
Mohd Hizami Mohd Yusoff ◽  
Ooi Boon Seng ◽  
Mohd Sabirin Marzuki ◽  
Ahmad Zuhairi Abdullah
Keyword(s):  
Chemical Mechanical Polishing ◽  
Polymeric Membranes ◽  
Mechanical Polishing ◽  
Polishing Process ◽  
Chemical Mechanical Polishing Process
Sign in / Sign up

Export Citation Format

Share Document