Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

2003 ◽  
Vol 6 (10) ◽  
pp. C143 ◽  
Author(s):  
D. Josell ◽  
D. Wheeler ◽  
C. Witt ◽  
T. P. Moffat
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Copper Electrodeposition

Instantaneous Fabrication of Thin MEMS Features by Copper Electrodeposition Using Modified Inkjet Printer

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Vol 12 (2) ◽  
pp. 02044-1-02044-4
Author(s):  
Vimal Kumar Deshmukh ◽  
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Ankit Namdev ◽  
H. K. Narang ◽  
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Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and Vias

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Vol 145 (9) ◽  
pp. 3070-3074 ◽  
Author(s):  
Alan C. West ◽  
Chin‐Chang Cheng ◽  
Brett C. Baker
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Electrodeposition ◽  
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High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition

2017 ◽  
Vol 180 ◽  
pp. 30-34 ◽  
Author(s):  
Fuliang Wang ◽  
Peng Zeng ◽  
Yan Wang ◽  
Xinyu Ren ◽  
Hongbin Xiao ◽  
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High Speed ◽  
Copper Electrodeposition ◽  
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Ultrasonic Agitation

scholarly journals Copper Electrodeposition from a Water-Containing Choline Chloride Based Deep Eutectic Solvent

2017 ◽  
Vol 77 (11) ◽  
pp. 859-864 ◽  
Author(s):  
Priscila Valverde ◽  
Todd Green ◽  
Sudipta Roy
Keyword(s):  
Choline Chloride ◽  
Deep Eutectic Solvent ◽  
Copper Electrodeposition

scholarly journals Advances in Copper Electrodeposition in Chloride Excess. A Theoretical and Experimental Approach

2015 ◽  
Vol 164 ◽  
pp. 187-195 ◽  
Author(s):  
P. Sebastián ◽  
E. Torralba ◽  
E. Vallés ◽  
A. Molina ◽  
E. Gómez
Keyword(s):  
Experimental Approach ◽  
Copper Electrodeposition
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