Nucleation on SiO2 during the Selective Chemical Vapor Deposition of Tungsten by the Hydrogen Reduction of Tungsten Hexafluoride

1994 ◽  
Vol 141 (12) ◽  
pp. 3532-3539 ◽  
Author(s):  
Nathan Desatnik ◽  
Brian E. Thompson
2007 ◽  
Vol 990 ◽  
Author(s):  
Hideaki Zama ◽  
Yuuji Nishimura ◽  
Michiyo Yago ◽  
Mikio Watanabe

ABSTRACTChemical vapor deposition (CVD) of copper using both a novel Cu(II) β-diketonate source and hydrogen reduction process was studied to fill contact vias with the smallest diameter in the 32nm and more advanced generation chip. Pure Cu films were grown under the condition with the product of hydrogen partial pressure and H2/Cu source molar ratio being over 1,000,000. We succeeded in filling the 40-nm-diameter contact vias by optimizing the growth condition of the Cu-CVD in both substrate temperatures and reaction pressures.


2006 ◽  
Vol 921 ◽  
Author(s):  
Shawn S Coffee ◽  
Wyatt A Winkenwerder ◽  
Scott K Stanley ◽  
Shahrjerdi Davood ◽  
Sanjay K Banerjee ◽  
...  

AbstractGermanium nanoparticle nucleation was studied in organized arrays on HfO2 using a SiO2 thin film mask with ~20-24 nm pores and a 6×1010 cm-2 pore density. Poly(styrene-b-methyl methacrylate) diblock copolymer was employed to pattern the SiO2 film. Hot wire chemical vapor deposition produced Ge nanoparticles using 4-19 monolayer Ge exposures. By seeding adatoms on HfO2 at room temperature before growth and varying growth temperatures between 725-800 K, nanoparticle size was demonstrated to be limited by Ge etching of SiO2 pore walls.


1989 ◽  
Vol 20 (1-2) ◽  
pp. 123-133 ◽  
Author(s):  
N.C. Macdonald ◽  
L.Y. Chen ◽  
J.J. Yao ◽  
Z.L. Zhang ◽  
J.A. McMillan ◽  
...  

2013 ◽  
Vol 52 (10S) ◽  
pp. 10MC08 ◽  
Author(s):  
Heejung Park ◽  
Seunghee Go ◽  
Chiyoung Lee ◽  
Hoseok Nam ◽  
Jong-Kwon Lee ◽  
...  

1987 ◽  
Vol 26 (Part 1, No. 12) ◽  
pp. 2057-2060 ◽  
Author(s):  
Takeshi Tanaka ◽  
Koji Deguchi ◽  
Masataka Hirose

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