Electroless Metallization of Nano-Sized Particles, Composites Fabrication

2019 ◽  
Vol 13 (17) ◽  
pp. 95-109 ◽  
Author(s):  
Teimuraz Khoperia ◽  
Tinatin Zedginidze
Keyword(s):  
Electroless Metallization

Transparent Flexible Electrodes Based on Junctionless Copper Nanowire Network via Selective Electroless Metallization of Electrospun Nanofibers

2017 ◽  
Vol 164 (12) ◽  
pp. D764-D770 ◽  
Author(s):  
Andrea Testa ◽  
Roberto Bernasconi ◽  
Ryohei Yoshikawa ◽  
Issei Takenaka ◽  
Luca Magagnin ◽  
...  
Keyword(s):  
Electrospun Nanofibers ◽  
Flexible Electrodes ◽  
Copper Nanowire ◽  
Nanowire Network ◽  
Electroless Metallization

scholarly journals Laser Activated and Electroless Metalized Polyurethane Coatings Containing Copper(II) L-Tyrosine and Glass Microspheres

Molecules ◽  
2021 ◽  
Vol 26 (18) ◽  
pp. 5571
Author(s):  
Piotr Rytlewski ◽  
Bartłomiej Jagodziński ◽  
Rafał Malinowski ◽  
Bogusław Budner ◽  
Krzysztof Moraczewski ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Laser Pulses ◽  
Surface Activation ◽  
Glass Microspheres ◽  
Polyurethane Coatings ◽  
Electroless Metallization ◽  
Metallized Layer ◽  
193 Nm ◽  
Coating Matrix ◽  
Lower Size

Polyurethane coatings containing copper(II) L-tyrosine and glass microspheres were laser irradiated and underwent electroless metallization. Various sizes of glass microspheres were incorporated into the polyurethane coating matrix in order to examine their effects on surface activation and electroless metallization. The surface of the coatings was activated by using ArF excimer laser emitting ultraviolet radiation (λ = 193 nm) using different number of laser pulses and their fluence. The effects of surface activation and metallization were evaluated mainly based on optical and scanning electron microcopies (SEM), energy-dispersive X-ray spectroscopy (EDX) and photoelectron spectroscopy (XPS). It was found that the presence of glass microspheres enabled the reduction in copper complex content, intensified the ablation process (higher cone-like structures created) and resulted in higher content of copper metallic seeds. On the other hand, the glass microspheres concentration, which was higher for lower size microspheres, was advantageous for obtaining a fully metallized layer.

Laser-Assisted Electroless Metallization of Polymer Materials

2017 ◽  
pp. 321-350
Author(s):  
Piotr Rytlewski ◽  
Bartłomiej Jagodziński ◽  
Krzysztof Moraczewski
Keyword(s):  
Polymer Materials ◽  
Electroless Metallization

Laser-induced surface activation and electroless metallization of polyurethane coating containing copper(II) L-tyrosine

2020 ◽  
Vol 505 ◽  
pp. 144429 ◽  
Author(s):  
Piotr Rytlewski ◽  
Bartłomiej Jagodziński ◽  
Rafał Malinowski ◽  
Bogusław Budner ◽  
Krzysztof Moraczewski ◽  
...  
Keyword(s):  
Surface Activation ◽  
Polyurethane Coating ◽  
Electroless Metallization

Redox Seeding and Electroless Metallization of Polyimides

1990 ◽  
pp. 394-414 ◽  
Author(s):  
A. Viehbeck ◽  
C. A. Kovac ◽  
S. L. Buchwalter ◽  
M. J. Goldberg ◽  
S. L. Tisdale
Keyword(s):  
Electroless Metallization

Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization

2017 ◽  
Vol 7 (9) ◽  
pp. 1552-1559 ◽  
Author(s):  
Wen-Ran Cai ◽  
Jun Mei ◽  
Woon-Ming Lau ◽  
Yan-Qiu Chen ◽  
Yu Liu ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
Flexible Substrate ◽  
Copper Electrode ◽  
Electroless Metallization

Conformal Electroless Copper and Nickel Deposition on Mems Structures

1998 ◽  
Vol 546 ◽  
Author(s):  
Hercules P. Neves ◽  
Thomas D. Kudrle ◽  
Jia-Ming Chen ◽  
Scott G. Adams ◽  
Michel Maharbiz ◽  
...  
Keyword(s):  
Microelectromechanical Systems ◽  
Chemical Activation ◽  
Surface Characteristics ◽  
Nickel Deposition ◽  
Electrical Isolation ◽  
Electroless Metallization ◽  
Potential Applications ◽  
Film Roughness ◽  
Seed Layers ◽  
The Ideal

AbstractWe propose electroless metallization as a method for conformal metal deposition microelectromechanical systems (MEMS). The intrinsically conformal nature of electroless deposition makes it ideal for coating high aspect ratio (greater than 50:1) structures frequently fabricated with micromachining techniques We take advantage of the selective nature of the deposition to obtain self-aligned electrical isolation. We minimize the metal film roughness for potential applications in RF and optics. Given the specific MEMS metallization requirements, we determined the ideal concentrations of additives and surfactants in order to provide good electrical isolation, low roughness and high film reliability. Our depositions were done using seed layers as well as through direct chemical activation of the silicon surface. Characteristics such as resistivity [ 1 ], morphology [ 1 ], microstructure [ 2 ], and electrochemical behavior [ 3 ] have already been reported in the literature; our paper is focused on the specific requirements for MEMS applications.

Top-Surface Imaging Using Selective Electroless Metallization of Patterned Monolayer Films

1993 ◽  
pp. 210-219 ◽  
Author(s):  
J. M. Calvert ◽  
W. J. Dressick ◽  
C. S. Dulcey ◽  
M. S. Chen ◽  
J. H. Georger ◽  
...  
Keyword(s):  
Surface Imaging ◽  
Monolayer Films ◽  
Electroless Metallization ◽  
Top Surface Imaging
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