Finite Element Analysis (FEA) of Pad Deformation Due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)

2019 ◽  
Vol 34 (1) ◽  
pp. 633-638
Author(s):  
Emmanuel Baisie ◽  
Bin Lin ◽  
Xiaohong Zhang ◽  
Zhichao Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Element Analysis ◽  
Diamond Disc

Modeling of Polishing Pad Wear in Chemical Mechanical Polishing

2010 ◽  
Vol 431-432 ◽  
pp. 318-321 ◽  
Author(s):  
Mao Li ◽  
Yong Wei Zhu ◽  
Jun Li ◽  
Kui Lin
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Wear Model ◽  
Element Analysis ◽  
Surface Accuracy ◽  
Polishing Pad ◽  
Pad Wear

The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.

Chemical Mechanical Polishing of Silicon Wafers: Finite Element Analysis of Wafer Flatness

2005 ◽  
Author(s):  
X. H. Zhang ◽  
Z. J. Pei ◽  
Graham R. Fisher
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Integrated Circuits ◽  
Chemical Mechanical Polishing ◽  
Silicon Wafers ◽  
Mechanical Polishing ◽  
High Quality ◽  
Element Analysis ◽  
Polishing Pressure

Silicon is the primary semiconductor material used to fabricate integrated circuits. The quality of microchips depends directly on the quality of silicon wafers. A series of processes are required to manufacture the high-quality silicon wafers. Chemical mechanical polishing is a necessary step to achieve the required wafer flatness. In this paper, a finite element analysis has been conducted to study the effects of influencing factors (including Young’s modulus and Poisson’s ratio of the polishing pad, thickness of the pad, and polishing pressure) on the wafer flatness.

Finite element analysis on dental implant[ndash ]supported prostheses without passive fit

2002 ◽  
Vol 11 (1) ◽  
pp. 30-40 ◽  
Author(s):  
Chatchai Kunavisarut ◽  
Lisa A. Lang ◽  
Brian R. Stoner ◽  
David A. Felton
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Dental Implant ◽  
Element Analysis ◽  
Passive Fit

Performance enhancement of normal contact ratio gearing system through correction factor

2019 ◽  
Vol 13 (3) ◽  
pp. 5242-5258
Author(s):  
R. Ravivarman ◽  
K. Palaniradja ◽  
R. Prabhu Sekar
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Correction Factor ◽  
Bending Strength ◽  
Performance Enhancement ◽  
Transmission Ratio ◽  
Contact Ratio ◽  
Element Analysis ◽  
Normal Contact ◽  
Root Region

As lined, higher transmission ratio drives system will have uneven stresses in the root region of the pinion and wheel. To enrich this agility of uneven stresses in normal-contact ratio (NCR) gearing system, an enhanced system is desirable to be industrialized. To attain this objective, it is proposed to put on the idea of modifying the correction factor in such a manner that the bending strength of the gearing system is improved. In this work, the correction factor is modified in such a way that the stress in the root region is equalized between the pinion and wheel. This equalization of stresses is carried out by providing a correction factor in three circumstances: in pinion; wheel and both the pinion and the wheel. Henceforth performances of this S+, S0 and S- drives are evaluated in finite element analysis (FEA) and compared for balanced root stresses in parallel shaft spur gearing systems. It is seen that the outcomes gained from the modified drive have enhanced performance than the standard drive.

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