Chemical Mechanical Polishing of Silicon Wafers: Finite Element Analysis of Wafer Flatness

2005 ◽  
Author(s):  
X. H. Zhang ◽  
Z. J. Pei ◽  
Graham R. Fisher
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Integrated Circuits ◽  
Chemical Mechanical Polishing ◽  
Silicon Wafers ◽  
Mechanical Polishing ◽  
High Quality ◽  
Element Analysis ◽  
Polishing Pressure

Silicon is the primary semiconductor material used to fabricate integrated circuits. The quality of microchips depends directly on the quality of silicon wafers. A series of processes are required to manufacture the high-quality silicon wafers. Chemical mechanical polishing is a necessary step to achieve the required wafer flatness. In this paper, a finite element analysis has been conducted to study the effects of influencing factors (including Young’s modulus and Poisson’s ratio of the polishing pad, thickness of the pad, and polishing pressure) on the wafer flatness.

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

2002 ◽  
Author(s):  
X. J. Xin ◽  
Z. J. Pei ◽  
Wenjie Liu
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Silicon Wafers ◽  
Semiconductor Material ◽  
Surface Grinding ◽  
High Quality ◽  
Element Analysis ◽  
Conventional Grinding

Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required to manufacture high quality silicon wafers. Surface grinding is one of the processes used to flatten the wire-sawn wafers. A major issue in grinding of wire-sawn wafers is the reduction and elimination of wire-sawing induced waviness. Several approaches (namely, combination of grinding and lapping, reduced chuck vacuum, soft-pad, and wax mounting) have been proposed to address this issue. The results of finite element analysis modeling of these approaches have shown that soft-pad grinding is the most promising approach since it is very effective in reducing the waviness and very easy to be adopted to conventional grinding environment. This paper presents a study of finite element analysis on soft-pad grinding of wire-sawn silicon wafers, covering the mechanisms of waviness reduction and the effects of pad material properties.

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

2004 ◽  
Vol 126 (2) ◽  
pp. 177-185 ◽  
Author(s):  
X. J. Xin ◽  
Z. J. Pei ◽  
Wenjie Liu
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Silicon Wafers ◽  
Semiconductor Material ◽  
Surface Grinding ◽  
High Quality ◽  
Element Analysis ◽  
Conventional Grinding

Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required to manufacture high quality silicon wafers. Surface grinding is one of the processes used to flatten the wire-sawn wafers. A major issue in grinding of wire-sawn wafers is the reduction and elimination of wire-sawing induced waviness. Several approaches (namely, combination of grinding and lapping, reduced chuck vacuum, soft-pad, and wax mounting) have been proposed to address this issue. Finite element analysis modeling of these approaches was conducted and the results were published earlier. It was shown that soft-pad grinding was a very promising approach since it was very effective in reducing the waviness and very easily adopted to conventional grinding environment. This paper presents a study of finite element analysis on soft-pad grinding of wire-sawn silicon wafers, covering the mechanisms of waviness reduction and the effects of pad material properties.

Modeling of Polishing Pad Wear in Chemical Mechanical Polishing

2010 ◽  
Vol 431-432 ◽  
pp. 318-321 ◽  
Author(s):  
Mao Li ◽  
Yong Wei Zhu ◽  
Jun Li ◽  
Kui Lin
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Wear Model ◽  
Element Analysis ◽  
Surface Accuracy ◽  
Polishing Pad ◽  
Pad Wear

The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.

Identification of a Significantly Non-Proportionally Damped Structure Using Force Appropriation

1995 ◽  
Author(s):  
P. S. Holmes ◽  
J. R. Wright ◽  
J. E. Cooper
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Normal Mode ◽  
Normal Modes ◽  
Dynamic Tests ◽  
High Quality ◽  
Element Analysis ◽  
Standard Curve ◽  
Complex Modes ◽  
Phase Resonance

Abstract Dynamic tests were carried out on an aluminium plate with significant non-proportional damping applied via two oil filled dampers. Normal mode force appropriation (phase resonance) methods were used to measure the undamped normal modes of the plate and the results compared with corresponding complex modes obtained using a standard curve fitting (phase separation) approach. It is demonstrated that, as long as suitable excitation positions are chosen, high quality undamped normal modes can be identified while the curve fitted modes are highly complex. A Finite Element analysis of the plate was used to show how the results of normal mode force appropriation are directly comparable, particularly when damping is non-proportional.

Finite Element Analysis for Wave Spring of Multi-Disc Wet Clutch Based on ANSYS

2013 ◽  
Vol 419 ◽  
pp. 203-208
Author(s):  
Ying Yu ◽  
Yao Run Peng ◽  
Shi Xin Lan ◽  
Ping Zhou
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Structural Characteristics ◽  
Response Speed ◽  
Wave Number ◽  
Element Analysis ◽  
Wet Clutch ◽  
Relationship Of ◽  
Deformation Relationship

Wave spring is a key component of multi-disc wet clutch and the response speed and running quality of multi-disc wet clutch is affected by its characteristics. This paper analyses the theoretical calculation of load-deformation relationship of wave spring. The load-deformation relationship of wave spring is obtained by ANSYS10.0 software according to its structural characteristics and actual boundary condition and compared with the calculated results based on different methods and the measured value, and then study the effect of the wave number on the load-deformation relationship of wave spring. The results show that the calculated value of finite element analysis (FEM) is closer to the measured value and the FEM has more advantages on simulation of the working performance of wave spring.

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