NbN Capping Layer for Enhanced Thermal Processing of Group III-Nitride Semiconductor Devices

2016 ◽  
Vol 6 (2) ◽  
pp. Q3067-Q3070 ◽  
Author(s):  
J. D. Greenlee ◽  
A. Nath ◽  
T. J. Anderson ◽  
B. N. Feigelson ◽  
A. D. Koehler ◽  
...  
Keyword(s):  
Thermal Processing ◽  
Semiconductor Devices ◽  
Capping Layer ◽  
Group Iii ◽  
Nitride Semiconductor ◽  
Group Iii Nitride

Structural, electronic, and effective-mass properties of silicon and zinc-blende group-III nitride semiconductor compounds

2001 ◽  
Vol 63 (16) ◽  
Author(s):  
L. E. Ramos ◽  
L. K. Teles ◽  
L. M. R. Scolfaro ◽  
J. L. P. Castineira ◽  
A. L. Rosa ◽  
...  
Keyword(s):  
Effective Mass ◽  
Group Iii ◽  
Zinc Blende ◽  
Mass Properties ◽  
Nitride Semiconductor ◽  
Semiconductor Compounds ◽  
Group Iii Nitride

scholarly journals Wide-bandgap Semiconductor Devices using Group-III Nitride/SiC Heterointerface

Hyomen Kagaku ◽  
2010 ◽  
Vol 31 (12) ◽  
pp. 651-656
Author(s):  
Jun SUDA ◽  
Hiroki MIYAKE ◽  
Tsunenobu KIMOTO
Keyword(s):  
Semiconductor Devices ◽  
Wide Bandgap ◽  
Group Iii ◽  
Wide Bandgap Semiconductor ◽  
Group Iii Nitride
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