Enhancement of Selectivity of Oxide-to-Nitride Films on Organic Additive in Nano-ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing

ECS Meeting Abstracts ◽

10.1149/ma2008-01/17/693 ◽

2008 ◽

Keyword(s):

Chemical Mechanical Polishing ◽

Organic Additive ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Trench Isolation ◽

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Effect of Molecular Weight of Surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing (CMP)

Japanese Journal of Applied Physics ◽

10.1143/jjap.43.l1060 ◽

2004 ◽

Vol 43 (No. 8B) ◽

pp. L1060-L1063 ◽

Author(s):

Hyun-Goo Kang ◽

Takeo Katoh ◽

Myung-Yoon Lee ◽

Hyung-Soon Park ◽

Ungyu Paik ◽

...

Keyword(s):

Molecular Weight ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Trench Isolation ◽

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Nanotopography Impact of Surfactant Concentration and Molecular Weight of Nano-ceria Slurry on Remaining Oxide Thickness Variation after Shallow Trench Isolation Chemical Mechanical Polishing

Japanese Journal of Applied Physics ◽

10.1143/jjap.46.5076 ◽

2007 ◽

Vol 46 (8A) ◽

pp. 5076-5079 ◽

Author(s):

Jin-Hyung Park ◽

Manabu Kanemoto ◽

Ungyu Paik ◽

Jea-Gun Park

Keyword(s):

Molecular Weight ◽

Chemical Mechanical Polishing ◽

Surfactant Concentration ◽

Oxide Thickness ◽

Mechanical Polishing ◽

Thickness Variation ◽

Shallow Trench Isolation ◽

Trench Isolation ◽

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Chemical mechanical polishing of shallow trench isolation using the ceria-based high selectivity slurry for sub-0.18 μm complementary metal–oxide–semiconductor fabrication

Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ◽

10.1116/1.1475984 ◽

2002 ◽

Vol 20 (3) ◽

pp. 918 ◽

Author(s):

Sam-Dong Kim ◽

In-Seok Hwang ◽

Hyung-Moo Park ◽

Jin-Koo Rhee ◽

Chul-Woo Nam

Keyword(s):

Metal Oxide ◽

Chemical Mechanical Polishing ◽

High Selectivity ◽

Complementary Metal Oxide Semiconductor ◽

Metal Oxide Semiconductor ◽

Mechanical Polishing ◽

Oxide Semiconductor ◽

Shallow Trench Isolation ◽

Trench Isolation ◽

Semiconductor Fabrication

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Dislocation-Free Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Embedded Flash Memory

Solid State Phenomena - Advances in Nanomaterials and Processing ◽

10.4028/3-908451-31-0.29 ◽

2007 ◽

pp. 29-32

Author(s):

Nam Hoon Kim ◽

Hae Young Yoo ◽

Eui Goo Chang

Keyword(s):

Flash Memory ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Trench Isolation ◽

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Agglomerated Large Particles under Various Slurry Preparation Conditions and Their Influence on Shallow Trench Isolation Chemical Mechanical Polishing

Japanese Journal of Applied Physics ◽

10.1143/jjap.44.7770 ◽

2005 ◽

Vol 44 (11) ◽

pp. 7770-7776 ◽

Author(s):

Dae-Hyeong Kim ◽

Hyun-Goo Kang ◽

Sang-Kyun Kim ◽

Ungyu Paik ◽

Jea-Gun Park

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Preparation Conditions ◽

Trench Isolation ◽

Large Particles ◽

Slurry Preparation

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Dummy feature placement for chemical-mechanical polishing uniformity in a shallow trench isolation process

Proceedings of the 2001 international symposium on Physical design - ISPD '01 ◽

10.1145/369691.369750 ◽

2001 ◽

Author(s):

Ruiqi Tian ◽

Xiaoping Tang ◽

D. F. Wong

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Trench Isolation

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Selective Chemical Mechanical Polishing of Silicon Dioxide over Silicon Nitride for Shallow Trench Isolation Using Ceria Slurries

Journal of The Electrochemical Society ◽

10.1149/1.3230624 ◽

2009 ◽

Vol 156 (12) ◽

pp. H936 ◽

Author(s):

P. R. Dandu Veera ◽

Shivaji Peddeti ◽

S. V. Babu

Keyword(s):

Silicon Nitride ◽

Silicon Dioxide ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Trench Isolation ◽

Selective Chemical

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Defect detection strategies for chemical-mechanical polishing process in shallow-trench isolation applications

10.1117/12.361347 ◽

1999 ◽

Author(s):

Jane J. Li ◽

Albert H. Liu ◽

Scott S. Hiemke

Keyword(s):

Defect Detection ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Shallow Trench Isolation ◽

Trench Isolation ◽

Chemical Mechanical Polishing Process ◽

Detection Strategies

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Effects of the Physical Characteristics of Cerium Oxide on Plasma-Enhanced Tetraethylorthosiliate Removal Rate of Chemical Mechanical Polishing for Shallow Trench Isolation

Japanese Journal of Applied Physics ◽

10.1143/jjap.42.1227 ◽

2003 ◽

Vol 42 (Part 1, No. 3) ◽

pp. 1227-1230 ◽

Author(s):

Sang-Kyun Kim ◽

Ungyu Paik ◽

Seong-Geun Oh ◽

Yong-Kook Park ◽

Takeo Katoh ◽

...

Keyword(s):

Cerium Oxide ◽

Chemical Mechanical Polishing ◽

Removal Rate ◽

Physical Characteristics ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Trench Isolation

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Effects of underlying films on the chemical-mechanical polishing for shallow trench isolation technology

Thin Solid Films ◽

10.1016/s0040-6090(97)00490-2 ◽

1997 ◽

Vol 308-309 ◽

pp. 543-549 ◽

Author(s):

Y.-L Wang ◽

C Liu ◽

M.-S Feng ◽

Jowei Dun ◽

K.-S Chou

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Shallow Trench Isolation ◽

Trench Isolation

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