ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects

2015 ◽  
Keyword(s):  
Contact Resistance ◽  
Technology Node ◽  
Cu Interconnects

ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects

2015 ◽  
Vol 69 (7) ◽  
pp. 161-169 ◽  
Author(s):  
J. Nag ◽  
B. Cohen ◽  
S. Choi ◽  
A. Ogino ◽  
M. Oh ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Technology Node ◽  
Cu Interconnects

Characteristics of Metal–Metal Nano-Area Contact Resistance for Less Than 5 nm Technology Node

2020 ◽  
Vol 20 (1) ◽  
pp. 643-646
Author(s):  
Eunmi Choi ◽  
Yinhua Cui ◽  
Yuan Gao ◽  
Sang June Hahn ◽  
Ju-Young Yun ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Technology Node ◽  
Metal Metal

Effects of Cu surface roughness on TDDB for direct polishing ultra-low k dielectric Cu interconnects at 40nm technology node and beyond

2012 ◽  
Vol 92 ◽  
pp. 115-118 ◽  
Author(s):  
W.C. Lin ◽  
Jack Lin ◽  
T.C. Tsai ◽  
C.M. Hsu ◽  
C.C. Liu ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Technology Node ◽  
Cu Interconnects ◽  
Low K

The contact resistance reduction of Cu interconnects by optimizing the crystal behavior of Ta/TaN diffusion barrier

2014 ◽  
Vol 27 ◽  
pp. 860-864 ◽  
Author(s):  
Wei-Lin Wang ◽  
Kuo-Tzu Peng ◽  
Hsien-Chang Kuo ◽  
Ming-Hsin Yeh ◽  
Hung-Ju Chien ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Diffusion Barrier ◽  
Cu Interconnects ◽  
Resistance Reduction
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