Effects of Chip-Package Interaction on Mechanical Reliability of Cu Interconnects for 65nm Technology Node and Beyond

2006 ◽  
Author(s):  
C.J. Uchibori ◽  
Xuefeng Zhang ◽  
P.S. Ho ◽  
T. Nakamura
Keyword(s):  
Mechanical Reliability ◽  
Technology Node ◽  
Cu Interconnects

Effects of Cu surface roughness on TDDB for direct polishing ultra-low k dielectric Cu interconnects at 40nm technology node and beyond

2012 ◽  
Vol 92 ◽  
pp. 115-118 ◽  
Author(s):  
W.C. Lin ◽  
Jack Lin ◽  
T.C. Tsai ◽  
C.M. Hsu ◽  
C.C. Liu ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Technology Node ◽  
Cu Interconnects ◽  
Low K

ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects

2015 ◽  
Vol 69 (7) ◽  
pp. 161-169 ◽  
Author(s):  
J. Nag ◽  
B. Cohen ◽  
S. Choi ◽  
A. Ogino ◽  
M. Oh ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Technology Node ◽  
Cu Interconnects

Effects of Chip-Package Interaction on Mechanical Reliability of Cu Interconnects

2007 ◽  
Author(s):  
Chihiro J. UCHIBORI ◽  
Xuefeng Xhang ◽  
Sehyuk Im ◽  
Paul S. Ho ◽  
Tomoji Nakamura ◽  
...  
Keyword(s):  
Mechanical Reliability ◽  
Cu Interconnects

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

2010 ◽  
Vol 48 (11) ◽  
pp. 1035-1040 ◽  
Author(s):  
Young-Chul Lee ◽  
Kwang-Seok Kim ◽  
Ji-Hyuk Ahn ◽  
Jeong-Won Yoon ◽  
Min-Kwan Ko ◽  
...  
Keyword(s):  
Solder Joint ◽  
Mechanical Reliability
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