A Novel Three-Dimensional High Density Vertical Rram Arrays with Reduced Leakage Current

2020 ◽  
Vol MA2020-01 (22) ◽  
pp. 1298-1298
Author(s):  
Min-Ci Wu ◽  
Yi-Hsin Ting ◽  
Jui-Yuan Chen ◽  
Wen-Wei Wu
Keyword(s):  
Leakage Current ◽  
Three Dimensional ◽  
High Density

Leakage current in high density CCD memory structures

1981 ◽  
Author(s):  
J.W. Slotboom ◽  
H.A. Harwig ◽  
M.J.M. Pelgrom
Keyword(s):  
Leakage Current ◽  
High Density ◽  
Memory Structures

scholarly journals Evidence of Three-Dimensional Asymmetries Seeded by High-Density Carbon-Ablator Nonuniformity in Experiments at the National Ignition Facility

2021 ◽  
Vol 126 (2) ◽  
Author(s):  
D. T. Casey ◽  
B. J. MacGowan ◽  
J. D. Sater ◽  
A. B. Zylstra ◽  
O. L. Landen ◽  
...  
Keyword(s):  
Three Dimensional ◽  
High Density ◽  
National Ignition Facility

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

Three-Dimensional Magneto-Optical Recording

2004 ◽  
Vol 834 ◽  
Author(s):  
Akiyoshi Itoh
Keyword(s):  
Storage System ◽  
Three Dimensional ◽  
Optical Recording ◽  
High Density ◽  
The Novel ◽  
National Project ◽  
3 Dimensional ◽  
Disk Storage ◽  
High Density Recording ◽  
New Type

ABSTRACTIn this report, the newly developed three-dimensional magneto-optical (MO) recording scheme and the experimental results are reported. A part of this work has been done as the national project of 3D-MO (3-dimensional MO) project. It started at September 1998 and ended March 2002 as a part of the national project “Nanometer-Scale Optical High Density Disk Storage System” and aimed at achieving 100 Gb/in2 in storage density. Three-dimensional MO recording is one of the prosperous candidates of next generation ultra high density recording. Magnetic amplifying MO system (MAMMOS) is employed for achieving the novel three-dimensional MO recording. Double-MAMMOS scheme consists of 2-recording layers of differing compensation temperature (Tcomp ) and one readout layer was proposed and discussed.With write/read test it is succeeded to show the results corresponding to a 100 Gb/in2 (50 Gb/in2 × 2) recording density. We also proposed and showed results of simulations of a new type of Double-MAMMOS in which the recording layers can hold quadri-valued information by single writing process.

scholarly journals Three-dimensional high-density co-culture with primary tenocytes induces tenogenic differentiation in mesenchymal stem cells

2011 ◽  
Vol 29 (9) ◽  
pp. 1351-1360 ◽  
Author(s):  
Philipp R. A. Schneider ◽  
Constanze Buhrmann ◽  
Ali Mobasheri ◽  
Ulrike Matis ◽  
Mehdi Shakibaei
Keyword(s):  
Stem Cells ◽  
Mesenchymal Stem Cells ◽  
Three Dimensional ◽  
High Density ◽  
Tenogenic Differentiation

Aeroelastic Stability of Lifting Surfaces in High-Density Fluids

1959 ◽  
Vol 3 (01) ◽  
pp. 10-21 ◽  
Author(s):  
Charles J. Henry ◽  
John Dugundji ◽  
Holt Ashley
Keyword(s):  
Degrees Of Freedom ◽  
Three Dimensional ◽  
Separated Flow ◽  
High Density ◽  
Aeroelastic Stability ◽  
Free Surfaces ◽  
Elastic Systems ◽  
Static Instability ◽  
Theoretical Evidence ◽  
Lifting Surfaces

The large increases anticipated in speeds of vehicles towed or propelled underwater suggests a re-examination of the problem of stability of flexible lifting surfaces mounted thereon. Experimental and theoretical evidence is assembled which suggests that oscillatory aeroelastic instability (flutter) is very unlikely at the structural-to-fluid mass ratios typical of hydrodynamic operation. It is shown that static instability (divergence) is the more important practical problem but that its occurrence can be predicted with greater confidence. Flutter data obtained in high-density fluids are reviewed, and various sources of inaccuracy in their theoretical prediction are analyzed. The need is expressed for more precise means of analytically representing both dynamic-elastic systems and three-dimensional unsteady hydrodynamic loads. For a simple hydrofoil with single degrees of freedom in bending and torsion, the theoretical influence of several significant parameters on high-density flutter is calculated and discussed. Recommendations are made for refinements to existing techniques of analysis to include the presence of channel boundaries, free surfaces, cavitation or separated flow.

scholarly journals Filaments and striations: anisotropies in observed, supersonic, highly magnetized turbulent clouds

2019 ◽  
Vol 492 (1) ◽  
pp. 668-685 ◽  
Author(s):  
James R Beattie ◽  
Christoph Federrath
Keyword(s):  
Magnetic Field ◽  
Column Density ◽  
Three Dimensional ◽  
High Density ◽  
Systematic Analysis ◽  
Guide Field ◽  
Degree Of Anisotropy ◽  
Mach Numbers ◽  
Magnetohydrodynamic Simulations ◽  
The Magnetic Field

ABSTRACT Stars form in highly magnetized, supersonic turbulent molecular clouds. Many of the tools and models that we use to carry out star formation studies rely upon the assumption of cloud isotropy. However, structures like high-density filaments in the presence of magnetic fields and magnetosonic striations introduce anisotropies into the cloud. In this study, we use the two-dimensional power spectrum to perform a systematic analysis of the anisotropies in the column density for a range of Alfvén Mach numbers ($\operatorname{\mathcal {M}_{\text{A}}}=0.1{\!-\!10}$) and turbulent Mach numbers ($\operatorname{\mathcal {M}}=2{\!-\!20}$), with 20 high-resolution, three-dimensional turbulent magnetohydrodynamic simulations. We find that for cases with a strong magnetic guide field, corresponding to $\operatorname{\mathcal {M}_{\text{A}}}\lt 1$, and $\operatorname{\mathcal {M}}\lesssim 4$, the anisotropy in the column density is dominated by thin striations aligned with the magnetic field, while for $\operatorname{\mathcal {M}}\gtrsim 4$ the anisotropy is significantly changed by high-density filaments that form perpendicular to the magnetic guide field. Indeed, the strength of the magnetic field controls the degree of anisotropy and whether or not any anisotropy is present, but it is the turbulent motions controlled by $\operatorname{\mathcal {M}}$ that determine which kind of anisotropy dominates the morphology of a cloud.

Sign in / Sign up

Export Citation Format

Share Document