Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices

To quickly destroy electronic devices and ensure information security, a destruction mechanism of transient electronic devices was designed in this paper. By placing the Ni-Cr film resistance and the energetic material between the chip and the package and heating the resistance by an electric current, the energetic material expanded and the chip cracked. The information on the chip was destroyed. The author simulated the temperature distribution and stress of the power-on structure in different sizes by ANSYS software. The simulation results indicate that the chip cracks within 50 ms under the trigger current of 0.5 A when a circular groove with an area of 1 mm2 and depth of 0.1 mm is filled with an expansion material with an expansion coefficient of 10−5°C−1. Then, the author prepared a sample for experimental verification. Experimental results show that the sample chip quickly cracks and fails within 10 ms under the trigger current of 1 A. The simulation and experimental results confirm the feasibility of the structure in quick destruction, which lays the foundation for developing instantaneous-failure integrated circuit products to meet information security applications.

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Multi-Physical Models of Bending Characteristics on the Double-Clamped Beam Switch for Flexible Electronic Devices Application

Sensors ◽

10.3390/s20247074 ◽

2020 ◽

Vol 20 (24) ◽

pp. 7074

Author(s):

Lei Han ◽

Lijun Chen ◽

Ruijie Qin ◽

Kang Wang ◽

Zhiqiang Zhang ◽

...

Keyword(s):

Reflection Loss ◽

Experimental Verification ◽

Flexible Substrate ◽

Electronic Devices ◽

Experimental Results ◽

Physical Models ◽

Driving Voltage ◽

Flexible Electronic ◽

Driving Time ◽

Flexible Electronic Devices

In this paper, multi-physical models of bending characteristics, including the static, dynamic and microwave models, are firstly proposed for the double-clamped beam switch based on flexible substrate. Both simulated and experimental verification have been carried out to prove that the changing regularity of the driving voltage and time of the switch is inversely proportional with the increase in the bending curvature of the flexible substrate. The microwave performance of the switch at the ON state is found to get worse with the increase in the bending curvature. The measured results indicate that when the bending curvature increases from 0 m−1 to 28.6 m−1, the measured driving voltage decreases from 90.0 V to 72.6 V with the error of 5.9% compared with the calculated results. The measured driving time decreases from 52.4 μs to 35.6 μs with the error of 16.7% compared with the calculated results. When the substrate bending curvature increases from 0 m−1 to 28.6 m−1, the measured reflection loss S11 of the switch gradually deteriorates from −27.1 dB to −22.0 dB with the error of 1.3 dB corresponding to the calculated results at 10 GHz. All the simulated and experimental results are consistent with the theoretical calculated results.

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Stochastic Data Transformation Boxes for Information Security Applications

Advances in Intelligent Systems and Computing - Biologically Inspired Cognitive Architectures (BICA) for Young Scientists ◽

10.1007/978-3-319-63940-6_31 ◽

2017 ◽

pp. 221-227 ◽

Cited By ~ 1

Author(s):

Ahmad Albatsha ◽

Michael A. Ivanov

Keyword(s):

Information Security ◽

Data Transformation ◽

Security Applications ◽

Stochastic Data

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Model of Social Influence in Analysis of Socio-engineering Attacks

Administrative Consulting ◽

10.22394/1726-1139-2021-8-97-107 ◽

2021 ◽

pp. 97-107

Author(s):

T. V. Tulupieva ◽

M. V. Abramov ◽

A. L. Tulupiev

Keyword(s):

Information Security ◽

Social Influence ◽

Integrated Circuit ◽

Social Engineering ◽

Accurate Assessment ◽

Factors Influencing ◽

Aggregation Of Information ◽

New Interpretation

The purpose of this study is to study the modernization of the model of an attacker’s social engineering attack on a user, taking into account a wider range of factors influencing the success of a social engineering attack associated with the principles of social influence. Methods. To achieve this goal, the approaches to social influence and the components of social influence were analyzed. An integrated circuit of social influence is built, grounding in the context of socio-engineering attacks. Results. A model of social influence is proposed, built in the context of an attacker’s social engineering attack on a user. A new interpretation of the term user vulnerability in the context of information security has been proposed. Conclusion. The result obtained forms the potential of filling the user and attacker models with specific vulnerabilities and competencies, which will lead to a more accurate assessment of the success of the attacker’s social engineering attack on the user, due to the aggregation of information from incidents that have occurred.

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Backside Chippings Improvement through Wafer Dicing Parameter Optimization and Understanding the Anistropic Silicon Properties

Journal of Engineering Research and Reports ◽

10.9734/jerr/2021/v20i717350 ◽

2021 ◽

pp. 144-152

Author(s):

Aiza Marie E. Agudon ◽

Bryan Christian S. Bacquian

Keyword(s):

Integrated Circuit ◽

Electronic Devices ◽

Silicon Wafers ◽

Form Complex ◽

Work Related ◽

Front End ◽

Wafer Thickness ◽

Fully Automatic ◽

Direct Materials ◽

Selection Of

Semiconductor Companies and Industries soar high as the trend for electronic gadgets and devices increases. Transition from “manual” to “fully automatic” application is one of the advantages why consumer adapt to changes and prefer electronic devices as one of daily answers. Individuals who admire these electronic devices often ask how they are made. As we look inside each device, we can notice interconnected microchips commonly called IC (Integrated Circuit). These are specially prepared silicon wafers where integrated circuit are developed. Commonly, each device is composed of numerous microchips depending on the design and functionality IC production is processed from “front-end” to “back-end” assembly. Front-end assembly includes wafer fabrication where electrical circuitry is prepared and integrated to every single silicon wafers. Back-end assembly covers processing the wafer by cutting into smaller individual and independent components called “dice”. Each dice will be placed into Leadframe, bonded with wires prior encapsulating with mold compounds. After molding, each IC will be cut through a process called singulation. Afterwards, all molded units are subjected for functional testing. Dice is central to each IC; it is where miniature transistor, resistor and capacitor are integrated to form complex small circuitry in microchips. Pre-assembly (Pre-assy) stations have the first hand prior to all succeeding stations. Live wafers are primary direct materials processed in these stations. Robust work instruction and parameter must be practiced during handling and processing to avoid gross rejection and possible work-related defects. The paper is all about the challenges to resolve and improved the backside chippings in 280um wafer thickness in mechanical dicing saw. The conventional Mechanical dicing process induce a lot of mechanical stress and vibration during the cutting process which oftentimes lead to backside chipping and die crack issues. However, backside chippings can mitigate with proper selection of parameter settings and understand the silicon wafer properties.

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Информационно-кибернетический подход к проектированию педагогического эксперимента

Revistă de Ştiinţe Socio-Umane = Journal of Social and Human Sciences ◽

10.46727/jshs.2021.v48.i2.p111-124 ◽

2021 ◽

Vol 48 (2) ◽

pp. 111-124

Author(s):

Виолетта Богданова

Keyword(s):

Information Security ◽

Experimental Results ◽

Whitney Test ◽

Mann Whitney Test ◽

Angular Transformation ◽

Teaching Information

The stages of a pedagogical experiment on teaching information security of future economists are presented from a cybernetic informational perspective. The experimental results were statistically processed, evaluated using the nonparametric Mann-Whitney test and the φ *criterion - Fisher's angular transformation.

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Stresses in compact end closures for cylindrical pressure vessels

Journal of Strain Analysis ◽

10.1243/03093247v041057 ◽

1969 ◽

Vol 4 (1) ◽

pp. 57-64

Author(s):

R W T Preater

Keyword(s):

Cylindrical Shell ◽

Rigid Body ◽

Optimum Design ◽

Cross Section ◽

Experimental Verification ◽

Pressure Vessels ◽

Rigid Body Motion ◽

Experimental Results ◽

Body Motion ◽

Annular Ring

Three different assumptions are made for the behaviour of the junction between the cylindrical shell and the end closure. Comparisons of analytical and experimental results show that the inclusion of a ‘rigid’ annular ring beam at the junction of the cylider and the closure best represents the shell behaviour for a ratio of cylinder mean radius to thickness of 3–7, and enables a prediction of an optimum vessel configuration to be made. Experimental verification of this optimum design confirms the predictions. (The special use of the term ‘rigid’ is taken in this context to refer to a ring beam for which deformations of the cross-section are ignored but rigid body motion is permitted.)

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EXPERIMENTAL VERIFICATION OF PYRAGAS’S CHAOS CONTROL METHOD APPLIED TO CHUA’S CIRCUIT

International Journal of Bifurcation and Chaos ◽

10.1142/s0218127494001313 ◽

1994 ◽

Vol 04 (06) ◽

pp. 1703-1706 ◽

Cited By ~ 19

Author(s):

P. CELKA

Keyword(s):

Periodic Orbits ◽

Experimental Verification ◽

Chaos Control ◽

Control Method ◽

Experimental Results ◽

Experimental Setup ◽

Chua’S Circuit ◽

Unstable Periodic Orbits ◽

Chua's Circuit

We have built an experimental setup to apply Pyragas’s [1992, 1993] control method in order to stabilize unstable periodic orbits (UPO) in Chua’s circuit. We have been able to control low period UPO embedded in the double scroll attractor. However, experimental results show that the control method is useful under some restrictions we will discuss.

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