Scratch indentation, a simple adhesion test method for thin films on polymeric supports

1994 ◽  
Vol 8 (6) ◽  
pp. 635-650 ◽  
Author(s):  
George D. Vaughn ◽  
Bruce G. Frushour ◽  
William C. Dale
Author(s):  
Jiantao Zheng ◽  
Suresh K. Sitaraman

Characterization of interfacial fracture parameters for nano-scale thin films continues to be challenging due to the difficulties associated with preparing samples, fixturing and loading the samples, and extracting and analyzing the experimental data. In this paper, we propose a stress-engineered superlayer test method that can be used to measure the interfacial fracture parameters of nano-scale (as well as micro-scale) thin films without the need for loading fixtures. The proposed test employs the residual stress in sputter-deposited metals to provide the energy for interfacial crack propagation. The innovative aspect of the test is the use of an etchable release layer that is deposited between the two interfacial materials of interest. The release layer is designed such that the available energy for interfacial crack propagation will continue to decrease as the crack propagates, and at the location where the crack ceases to propagate, the available energy for crack propagation will be the critical energy for crack propagation or the interfacial fracture toughness. The proposed test method has been successfully used to characterize Ti thin film on Si substrate.


2006 ◽  
Vol 20 (25n27) ◽  
pp. 4063-4068 ◽  
Author(s):  
SEUNG WOO HAN ◽  
MD ANWARUL HASAN ◽  
KI-HO CHO ◽  
HAK JOO LEE ◽  
DONG-HO KIM ◽  
...  

In this study we have characterized the mechanical and electrical properties of Bi 2 Te 3 thin films prepared by co-sputtering method. The film structure and morphology were revealed using the X-ray diffraction and scanning electron microscopy (SEM). Thickness of the deposited films was measured using SEM observation after FIB (Focused Ion Beam) milling, and the surface roughness of the films was analyzed using AFM (atomic force microscopy). Electrical transport properties were measured with a Hall effect measurement system, while the mechanical properties were evaluated using nanoindentation test method. Results showed that Bi 2 Te 3 thin films have amorphous structure at lower film thicknesses, but as the thickness increases the structure becomes polycrystalline. Surface roughness and crystal size of the films increased with increase in substrate temperature. Films showed higher elastic modulus and hardness values compared to those of the bulk Bi 2 Te 3 alloy. The electrical transport properties of the films were also affected by the substrate temperature.


1996 ◽  
Vol 441 ◽  
Author(s):  
Dong-Yeon Park ◽  
Dong-Su Lee ◽  
Min Hong Kim ◽  
Tae-Soon Park ◽  
Hyun-Jung Woo ◽  
...  

AbstractPlatinum(Pt) films were sputter-deposited on Si02/Si substrates under the mixed gas atmosphere of Ar and O2. Under certain deposition conditions, the films were oriented such that the (100) direction is normal to the substrate surface. The formation of the (100) texture was affected by the gas pressure and film thickness. After annealing at 650 °C for 1 hour, (100) oriented Pt films with the resistivity of pure Pt were obtained. The annealed Pt films all passed a tape adhesion test and had no defects such as hillocks or pinholes. The experimental results from this work are presented.


2010 ◽  
Vol 35 (4) ◽  
pp. 245-259 ◽  
Author(s):  
Kar Tean Tan ◽  
Christopher C. White ◽  
Donald L. Hunston
Keyword(s):  

1965 ◽  
Vol 38 (4) ◽  
pp. 791-801 ◽  
Author(s):  
C. E. Taylor

Abstract By using a rubber diaphragm as pressure transmitting medium, a cured adhesion test method has been developed which permits controllable curing pressures to be employed. The quest for a new adhesion test method was occasioned by lack of confidence in existing test methods with respect to reproducibility and correlation between testing sites. The diaphragm cures “hi place” with a minimum of rubber movement as compared to excessive press pressures which induce flow. Controllable vulcanizing pressures and temperatures permit accurate adhesion evaluation of individual components in the laboratory under conditions which closely approximate manufacturing methods. A prime goal has been evaluation of true chemical bonding and elimination of all possible mechanical adhesion contributions inherent in most rubber-product fabrications. The diaphragm pressure adhesion test can be used by Quality Control, Development, or Research Department as an accurate tool to evaluate the chemical adhesion potential of rubber and common reinforcing components. Since adhesion values are machine recorded, all laboratory time and error in tabulations and calculations are eliminated. Basic principles of the technique permit evaluation of chemical bonding of rubber to yarns, fibers, and cords with equal effectiveness.


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