Annealing Characteristics of Nanostructured Cu-Fe-P Alloy Processed by Accumulative Roll-Bonding
2007 ◽
Vol 7
(11)
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pp. 3872-3875
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Keyword(s):
Annealing characteristics of a nanostructured copper alloy processed by accumulative roll-bonding (ARB) were studied. A nano-grained Cu-Fe-P alloy processed by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 400 °C for 0.6 ks. The sample still showed an ultrafine grained (UFG) structure up to 250 °C, however above 300 °C it began to replace by equiaxed and coarse grains due to an occurrence of the conventional static recrystallization. The hardness of the annealed copper decreased largely above 300 °C. These annealing characteristics of the UFG copper alloy were compared to those of a high purity copper.
Keyword(s):
2014 ◽
Vol 14
(10)
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pp. 8014-8018
2007 ◽
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pp. 1381-1384
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Vol 10
(5)
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pp. 3389-3392
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Vol 124-126
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pp. 1373-1376
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Vol 6
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pp. 3661-3664
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Vol 580-582
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pp. 71-74
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Vol 53
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pp. 4623-4634
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