Experimental investigation on adhesive bonding of similar and dissimilar weld joint used for automotive applications

Author(s):  
Rohit Verma ◽  
Lochan Sharma ◽  
Mayank Chauhan ◽  
Rahul Chhibber ◽  
Kanwer Singh Arora

The automobile industry has started using adhesive bonding to join load bearing components which aerospace industry has been using for decades. Adhesive lap joints are used frequently in the manufacture of automobile. In present study, structural adhesives were used to join the aluminium alloy (AA5083 H111) with the HSS dual phase (DP780) steel. Adhesive bonding appears to be one of the appropriate methods of joining dissimilar materials. The aim of this work is to analyze the tensile strength of similar and dissimilar joints. The influence of various parameters was also investigated such as the overlap length and the bondline thickness of specimens. In DP steel, there is 22% increase in strength for similar lap joint when overlap length changes from 10 mm to 15 mm, while there is 45% increase in strength when it varies from 15 mm to 20 mm. Similarly in case of Al alloy, there is 26% increased strength for similar lap joints when length varies from 10 mm to 15 mm, while it increased to 42% when length changes from 15 mm to 25 mm and there is about 35% increase in strength for length varies from 20 mm to 25 mm. In case of dissimilar joints, firstly there is about 16% increase in strength then there is 5% decrease while after that there is 45% increase in strength. Adhesion failure, cohesion failure and mixed failure were obtained experimentally during failure mode analysis. As the strength of joint increases, failure mode shows a transition from adhesion failure to cohesion failure. From the literature survey it is evident that limited work has been carried out on analysis of shear-tensile strength of adhesively bonded steel and aluminium joint with variation in bonding parameters. Not much work on failure mode analysis of bonded joints during tensile testing has been reported. In present work a noval attempt has been made to analyze the shear-tensile strength and failure mode of adhesively bonded steel and aluminium joint with variation in bonding parameters.

Author(s):  
Isotta Morfini ◽  
Luca Goglio ◽  
Giovanni Belingardi ◽  
Sayed A. Nassar

This study investigates the effect of cure time and surface roughness on mechanical performance of single lap joints (SLJ). Test joints are made of aluminum/aluminum or aluminum/magnesium adherends that are autoclave-bonded using a commercially available film adhesive. Joint mechanical performance is assessed in terms of the static load transfer capacity (LTC), fatigue life and failure mode. Except for the cure time, all the rates of the other autoclave-bonding parameters are kept constant; namely, the level of cure temperature and pressure, as well as the rates of autoclave heating, cooling, pressurization and depressurization. Test data, failure mode analysis, discussion, observations and conclusions are provided.


Author(s):  
Sayed A. Nassar ◽  
Kassem Moustafa ◽  
Zhijun Wu ◽  
Demetrios Tzelepis

An experimental procedure and test setup is used for investigating effect of using nanoparticle additives to the adhesive on the load transfer capacity (LTC) of bonded magnesium (Mg)-steel (St) single lap joints (SLJ). Investigated variables include the nano-powder material (Alumina vs. Silica), particulate size (20 nm vs. 80 nm), and concentration in the adhesive (2.5% wt. vs 5.0 % wt.). Two different levels of surface roughness on the bonded area are used; namely, sanding the bond area with G60 or G180 sand paper. Test data and SEM failure mode analysis are provided.


Author(s):  
Sayed A. Nassar ◽  
Zhijun Wu ◽  
Kassem Moustafa ◽  
Demetrios Tzelepis

An experimental procedure and test setup are used for investigating effect of using nanoparticle additives to the adhesive on the load transfer capacity (LTC) of bonded magnesium (Mg)–steel (St) single lap joints (SLJ). Investigated variables include the nanopowder material (alumina versus silica), particulate size (20 nm versus 80 nm), and concentration in the adhesive (2.5 wt.% versus 5.0 wt.%). Two different levels of surface roughness on the bonded area are used, namely, sanding the bond area with G60 or G180 sand paper. Test data and scanning electron microscopy (SEM) failure mode analysis are provided.


Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.


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